Beijing Silk Road Enterprise Management Services Co., Ltd.
| Insulation Resistance(IR) | 10MΩ |
| Operating Temperature | -40℃~+85℃ |
| DC Resistance(DCR) | 400mΩ |
| Voltage Rating - DC | 50V |
| Number of Lines | 2 |
| Description | 2Line Common Mode Choke Surface Mount-4P 2x1.2mm 250Ω@100MHz 300mA DCR 400mΩ |
| Mfr. Part # | FDCW2012-2-251TF |
| Package | SMD-4P,2x1.2mm |
| Model Number | FDCW2012-2-251TF |
View Detail Information
Explore similar products
Wire Wound Common Mode Choke Walsin WTCF2012Z0M221PB Ideal for USB Lines and
Wire Wound Chip Common Mode Coil CENKER CMC2012U-300-2P-T for Noise Suppression
Noise Suppression Coilank AACM2012T751W2 Common Mode Filter Compliant with AEC
Compact Common Mode Choke DDY WBA3225L201T-G-HF with Low DC Resistance and High
Product Specification
| Insulation Resistance(IR) | 10MΩ | Operating Temperature | -40℃~+85℃ |
| DC Resistance(DCR) | 400mΩ | Voltage Rating - DC | 50V |
| Number of Lines | 2 | Description | 2Line Common Mode Choke Surface Mount-4P 2x1.2mm 250Ω@100MHz 300mA DCR 400mΩ |
| Mfr. Part # | FDCW2012-2-251TF | Package | SMD-4P,2x1.2mm |
| Model Number | FDCW2012-2-251TF |
The FDCW2012 series wire wound chip common mode choke coil offers excellent noise suppression performance due to its high common mode impedance at high frequencies. Designed for small size and low profile (2.0*1.2*1.2 mm), these coils are 100% Lead (Pb) & Halogen-Free and RoHS compliant. They are ideal for various applications including power switches, servers, telecommunication equipment, USB communication, and panel links for LCD panels, effectively countering common mode noise in high-speed lines.
| Part Number | Common Mode Impedance () @100MHz (25%) | DCR (m) MAX | IR (A) MIN | Rated Voltage (Vdc) |
|---|---|---|---|---|
| FDCW2012-2-300TF | 30 | 200 | 10 | 50 |
| FDCW2012-2-500TF | 50 | 250 | 10 | 50 |
| FDCW2012-2-750TF | 75 | 250 | 10 | 50 |
| FDCW2012-2-900TF | 90 | 300 | 10 | 50 |
| FDCW2012-2-121TF | 120 | 300 | 10 | 50 |
| FDCW2012-2-161TF | 160 | 350 | 10 | 50 |
| FDCW2012-2-181TF | 180 | 350 | 10 | 50 |
| FDCW2012-2-201TF | 200 | 350 | 10 | 50 |
| FDCW2012-2-221TF | 220 | 350 | 10 | 50 |
| FDCW2012-2-251TF | 250 | 400 | 10 | 50 |
| FDCW2012-2-261TF | 260 | 400 | 10 | 50 |
| FDCW2012-2-301TF | 300 | 400 | 10 | 50 |
| FDCW2012-2-361TF | 360 | 400 | 10 | 50 |
| FDCW2012-2-371TF | 370 | 450 | 10 | 50 |
| FDCW2012-2-481TF | 480 | 550 | 10 | 50 |
| FDCW2012-2-501TF | 500 | 550 | 10 | 50 |
| FDCW2012-2-601TF | 600 | 550 | 10 | 50 |
| FDCW2012-2-671TF | 670 | 600 | 10 | 50 |
| FDCW2012-2-681TF | 680 | 700 | 10 | 50 |
| FDCW2012-2-751TF | 750 | 800 | 10 | 50 |
| FDCW2012-2-801TF | 800 | 1000 | 10 | 50 |
| FDCW2012-2-901TF | 900 | 1000 | 10 | 50 |
| FDCW2012-2-102TF | 1000 | 1000 | 10 | 50 |
| Dimension | Unit:mm | A | B | C | D | E |
|---|---|---|---|---|---|---|
| FDCW2012 Series | 2.000.20 | 1.200.20 | 1.200.20 | 0.5TYP | 0.5TYP |
| Structure and Components | Part Name | Material Name |
|---|---|---|
| Structure | Lid | Ni-Zn Ferrite |
| Epoxy | Epoxy resin | |
| Wire | Enameled copper wire | |
| Core | Ni-Zn Ferrite | |
| Electrode structure | Ag+Ni+Sn plating |
| Operating Conditions | Value |
|---|---|
| Ambient Temperature | 25 C (for test data reference) |
| Operating Temperature Range | -40 C to +85 C |
| Maximum Part Temperature | 125 C (under worst case operating conditions, including ambient + temp rise) |
| Reliability Test Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating life | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Reflow 2 times 2. Temperature: 155 2 |
| Resistance to Soldering Heat | 1. No visible mechanical damage 2. Impedance change: Within20% | 1. Solder on PCB to Reflow test Peak Temp. 2605 510 secs, Cycles: 2 times. Re-flowing Profile: Please refer to Fig-1 2. Test board thickness: 1.5mm 3. Test board material: glass epoxy resin 4. Storage: standard atmospheric conditions for 1 hour before measurement. Product showed no damage under microscope. |
| High Temperature | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature: 1252 2. Duration: 1000 hours 3. Storage: standard atmospheric conditions for 1 hour before measurement. |
| Steady damp-heat | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature: 85 2. Humidity: 85% RH 3. Duration: 1000 hours 4. Storage: standard atmospheric conditions for 1 hour before measurement. |
| Mechanical Vibration | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Frequency: 10HZ55HZ10HZ/Min Cycles 2. Amplitude: 1.5 mm 3. Directions: X,Y,Z 4. Time: 2 hours in each direction (total of 6 hours) |
| Thermal Shock | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature and time: -40 for 303 min 125 for 303min, please refer to Fig-2 2. Transforming interval: Max. 3 Min 3. Tested cycle: 1000 cycles 4. Storage: standard atmospheric conditions for 1 hour before measurement. |
| Salt Spray | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Salt concentration: (5 1)% (mass percent) 2. pH value: 6.5 - 7.2 3. Temperature: 35 2 4. Humidity: 85% 5. Time: 24 hours 6. Inductance measurement after 1-2 hours in normal temperature and humidity: inductance value change cannot be more than 10% before test. |
| Terminal strength | No visible mechanical damage | 1. The electrode of the inductor is soldered to the PCB, to Fig-3 Then apply a force in the direction of the arrow. 2. 5N force. 3. Keep time: 10(1)s The first three tests were OK, and the force was applied until the peak value of the product peeling. The test speed was set in the range of 3 ~ 8mm/min. |
| Packaging Information | Type | W | P1 | A0 | B0 | K0 | t | E | F | P2 | D0 | D1 | P0 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Tape Packaging Dimensions (Unit:mm) | FDCW 2012 | 8.00 0.10 | 4.00 0.10 | 1.50 0.10 | 2.30 0.10 | 1.45 0.10 | 0.20 0.05 | 1.75 0.10 | 3.50 0.10 | 2.00 0.10 | 1.55 0.05 | 0.80 0.05 | 4.00 0.10 |
| Packaging Information | Type | Standard Quantity | Reel | Inner box | Carton box |
|---|---|---|---|---|---|
| Packaging Quantity | FDCW2012 | 2000 pcs / reel | 5Reel / box (10000 pcs) | 10 Middle boxes, (100000 pcs) |
| Packaging Information | Peel force of top cover tape |
|---|---|
| The peel speed shall be about 300mm/minute. The peel force of top cover tape shall be between 10 to 100gf. |
| Packaging Information | Type | A (mm) | B (mm) | C (mm) |
|---|---|---|---|---|
| Inner Box | 188 | 195 | 67 |
| Packaging Information | Packaging Type | L (mm) | W (mm) | H (mm) |
|---|---|---|---|---|
| Carton Packaging | 390 | 350 | 215 |
| Label Information | Content |
|---|---|
| Reel Label | Customer's part Number Lot Number Quantity date code |
| Shipping Label | Customer's part Number Manufacturer's part Number Quantity date code |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
Get in touch with us
Leave a Message, we will call you back quickly!