Beijing Silk Road Enterprise Management Services Co., Ltd.
| Insulation Resistance(IR) | 10MΩ |
| Operating Temperature | -40℃~+85℃ |
| DC Resistance(DCR) | 1.2Ω |
| Voltage Rating - DC | 50V |
| Number of Lines | 2 |
| Voltage Withstand | - |
| Description | 2Line Common Mode Choke Surface Mount-4P 3.2x1.6mm 2.2kΩ@100MHz 200mA DCR 1.2Ω |
| Mfr. Part # | CMC1206S-222T |
| Package | SMD-4P,3.2x1.6mm |
| Model Number | CMC1206S-222T |
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Product Specification
| Insulation Resistance(IR) | 10MΩ | Operating Temperature | -40℃~+85℃ |
| DC Resistance(DCR) | 1.2Ω | Voltage Rating - DC | 50V |
| Number of Lines | 2 | Voltage Withstand | - |
| Description | 2Line Common Mode Choke Surface Mount-4P 3.2x1.6mm 2.2kΩ@100MHz 200mA DCR 1.2Ω | Mfr. Part # | CMC1206S-222T |
| Package | SMD-4P,3.2x1.6mm | Model Number | CMC1206S-222T |
The Chip Common Mode Choke Coils, specifically the CMC0805S and CMC1206S Series, are wire-wound chip common mode chokes designed for effective noise suppression. These magnetically shielded inductors are constructed with a Ni-Zn ferrite core and cover plates, utilizing copper wire and silver/nickel/tin electrodes. They are suitable for various electronic applications requiring impedance for common mode noise filtering. Available in tape and reel packaging, these components meet stringent reliability and performance standards.
| Part Number | Dimensions (L x W x T) (mm) | Nominal Impedance () | Test Frequency (MHz) | Max. DC Resistance () | Rated Voltage (Vdc) | Max. Rated Current (mA) | Min. Insulation Resistance (M) |
|---|---|---|---|---|---|---|---|
| CMC0805S-670T | 2.00.2 x 1.20.2 x 1.20.2 | 67 | 100 | 0.25 | 50 | 400 | 10 |
| CMC0805S-700T | 2.00.2 x 1.20.2 x 1.20.2 | 70 | 100 | 0.30 | 50 | 400 | 10 |
| CMC0805S-750T | 2.00.2 x 1.20.2 x 1.20.2 | 75 | 100 | 0.30 | 50 | 400 | 10 |
| CMC0805S-900T | 2.00.2 x 1.20.2 x 1.20.2 | 90 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-121T | 2.00.2 x 1.20.2 x 1.20.2 | 120 | 100 | 0.30 | 50 | 370 | 10 |
| CMC0805S-161T | 2.00.2 x 1.20.2 x 1.20.2 | 160 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-181T | 2.00.2 x 1.20.2 x 1.20.2 | 180 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-261T | 2.00.2 x 1.20.2 x 1.20.2 | 260 | 100 | 0.40 | 50 | 300 | 10 |
| CMC0805S-301T | 2.00.2 x 1.20.2 x 1.20.2 | 300 | 100 | 0.42 | 50 | 290 | 10 |
| CMC0805S-361T | 2.00.2 x 1.20.2 x 1.20.2 | 360 | 100 | 0.45 | 50 | 280 | 10 |
| CMC0805S-371T | 2.00.2 x 1.20.2 x 1.20.2 | 370 | 100 | 0.45 | 50 | 280 | 10 |
| CMC0805S-451T | 2.00.2 x 1.20.2 x 1.20.2 | 450 | 100 | 0.50 | 50 | 250 | 10 |
| CMC0805S-601T | 2.00.2 x 1.20.2 x 1.20.2 | 600 | 100 | 0.60 | 50 | 220 | 10 |
| CMC0805S-901T | 2.00.2 x 1.20.2 x 1.20.2 | 900 | 100 | 0.90 | 50 | 150 | 10 |
| CMC1206S-900T | 3.20.2 x 1.60.2 x 1.80.2 | 90 | 100 | 0.30 | 50 | 370 | 10 |
| CMC1206S-161T | 3.20.2 x 1.60.2 x 1.80.2 | 160 | 100 | 0.40 | 50 | 340 | 10 |
| CMC1206S-261T | 3.20.2 x 1.60.2 x 1.80.2 | 260 | 100 | 0.50 | 50 | 310 | 10 |
| CMC1206S-371T | 3.20.2 x 1.60.2 x 1.80.2 | 370 | 100 | 0.50 | 50 | 300 | 10 |
| CMC1206S-601T | 3.20.2 x 1.60.2 x 1.80.2 | 600 | 100 | 0.80 | 50 | 260 | 10 |
| CMC1206S-801T | 3.20.2 x 1.60.2 x 1.80.2 | 800 | 100 | 0.90 | 50 | 240 | 10 |
| CMC1206S-102T | 3.20.2 x 1.60.2 x 1.80.2 | 1000 | 100 | 1.00 | 50 | 230 | 10 |
| CMC1206S-142T | 3.20.2 x 1.60.2 x 1.80.2 | 1400 | 100 | 1.00 | 50 | 220 | 10 |
| CMC1206S-202T | 3.20.2 x 1.60.2 x 1.80.2 | 2000 | 100 | 1.20 | 50 | 200 | 10 |
| CMC1206S-222T | 3.20.2 x 1.60.2 x 1.80.2 | 2200 | 100 | 1.20 | 50 | 200 | 10 |
| Reliability Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40~+85 | |
| Solder ability | Electrode surface solder coverage: 80% | Dip pads in flux and dip in solder pot(96.5Sn/3.0Ag/0.5Cu)at 2455 for 51s. |
| Resistance to Soldering | Impedance shall not change more than 20% | Dip pads in flux and dip in solder pot(96.5Sn/3.0Ag/0.5Cu)at 2605 for 101s. |
| Insulation Resistance | 10 M | The rated voltage is applied between the two windings for a minute. |
| Vibration | Impedance shall not change more than 20% | Amplitude 1.5mm, frequency 10~55Hz, for 2h in each of three axes (X, Y, Z). |
| Adhesion of electrode | The end electrode did not fall off after the test. | CMC0805 Series: 5 N; CMC1206 Series: 10 N. Keep time: (101)s; Speed: 1.0 mm/s. |
| Low temperature resistance | Impedance shall not change more than 20% | Subjected to -402 for 1000 h. |
| High Temperature resistance | Impedance shall not change more than 20% | Subjected to 852 for 1000 h. |
| Temperature Characteristic | Impedance variation rate shall not exceed 20% | Hold at 202, -402, 202, 852 for 4h each. Calculate deviation based on 202. |
| Thermal Shock | Impedance shall not change more than 20% | +85 for 60 min -40 for 60 min, 32 cycles. Transition time: 2-3 min. |
| High temperature load | Impedance shall not change more than 20% | Apply rated current. Subjected to 852 for 1000 h. |
| Static Humidity | Impedance shall not change more than 20% | Subjected to 90%-95% RH at 602 for 1000 h. |
| Bending strength | No visible mechanical damage. | Bend down 2 mm at a bending rate of (10.5) mm/s, keep time 5 sec. |
| Solvent Resistance | Impedance shall not change more than 20% | Soak in isopropyl alcohol solution at 235 for 50.5 min. |
| Package Type | Reel Quantity (Pcs) | Box Quantity (Pcs) | Case Quantity (Pcs) |
|---|---|---|---|
| 0805 | 3000 | 9000 (3 Reels) | 45000 (1.5 Cases) |
| 1206 | 2000 | 6000 (3 Reels) | 30000 (1.5 Cases) |
| Soldering Method | Details |
|---|---|
| Reflow Soldering | Use rosin-based flux (halide content < 0.2%). Use lead-free solder (96.5Sn/3.0Ag/0.5Cu). Temperature difference between solder and ferrite surface: max 150 during pre-heating. Temperature difference during cooling: max 100. |
| Iron Soldering | Tip temperature: 350 (Max). Power: 30W (Max). Dwell time: < 5s. Avoid touching coils or encapsulation. |
| Cleaning Condition | Details |
|---|---|
| Cleaning Temperature | 60 (Max) |
| Cleaning Time | 5 minutes (Max) |
| Ultrasonic Power | 200W (Max) |
| Storage Requirement | Details |
|---|---|
| Storage Period | Use within 6 months from inspection date. If exceeded, check solder ability. |
| Storage Conditions | Temperature: -10 to +40, Relative Humidity: 30-70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging on a pallet. |
| ODS Usage | Details |
|---|---|
| Substances Used | CCl4 (Carbon Tetrachloride), HCFC are not used in production. |
| Notes | Details |
|---|---|
| RoHS Directive | Products comply with RoHS directive. |
| Product Evaluation | Ensure your product is evaluated and confirmed against your specifications when our product is mounted. |
| Usage Deviation | No warranty against failure caused by use deviating from this specification. |
| Handling | Do not touch wire with sharp objects such as tweezers to prevent wire breakage. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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