| Insulation Resistance(IR) | 10MΩ |
| Operating Temperature | -40℃~+125℃ |
| DC Resistance(DCR) | 200mΩ |
| Voltage Rating - DC | 50V |
| Number of Lines | 2 |
| Voltage Withstand | 125V |
| Description | 2Line Common Mode Choke Surface Mount-4P 2x1.2mm 30Ω@100MHz 450mA DCR 200mΩ |
| Mfr. Part # | ACM2012-2P-300TF |
| Package | SMD-4P,2x1.2mm |
| Model Number | ACM2012-2P-300TF |
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Product Specification
| Insulation Resistance(IR) | 10MΩ | Operating Temperature | -40℃~+125℃ |
| DC Resistance(DCR) | 200mΩ | Voltage Rating - DC | 50V |
| Number of Lines | 2 | Voltage Withstand | 125V |
| Description | 2Line Common Mode Choke Surface Mount-4P 2x1.2mm 30Ω@100MHz 450mA DCR 200mΩ | Mfr. Part # | ACM2012-2P-300TF |
| Package | SMD-4P,2x1.2mm | Model Number | ACM2012-2P-300TF |
These wire wound chip common mode filters offer a compact and low-profile solution for preventing common mode noise at high frequencies. They are designed for excellent solderability and can operate in temperatures ranging from -40 to +125. Applications include USB2.0 interfaces in PCs and peripheral equipment, small digital AV equipment, and LVDS lines in Note PCs and LCDs, as well as audio lines.
| Part Number | Common-Mode Impedance Z() at 100MHz | Rated Voltage Vdc(V) | DC Resistance Rdc() Max. | Rated Current Idc(mA) Max. | Insulation Resistance (M)Min. |
| ACM2012-2P-300TF | 30 25% | 450 | 0.20 | 50 | 10 |
| ACM2012-2P-670TF | 67 25% | 400 | 0.25 | 50 | 10 |
| ACM2012-2P-900TF | 90 25% | 400 | 0.30 | 50 | 10 |
| ACM2012-2P-121TF | 12025% | 370 | 0.30 | 50 | 10 |
| ACM2012-2P-161TF | 16025% | 350 | 0.35 | 50 | 10 |
| ACM2012-2P-181TF | 18025% | 330 | 0.35 | 50 | 10 |
| ACM2012-2P-201TF | 20025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-221TF | 22025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-261TF | 26025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-361TF | 36025% | 280 | 0.45 | 50 | 10 |
| ACM2012-2P-601TF | 60025% | 200 | 0.55 | 50 | 10 |
| ACM2012-2P-671TF | 67025% | 150 | 0.60 | 50 | 10 |
| ACM2012-2P-801TF | 80025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-901TF | 90025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-102TF | 100025% | 150 | 1.30 | 50 | 10 |
| ACM2012-2P-222TF | 220025% | 100 | 2.00 | 50 | 10 |
A: 2.0 0.2 mm
B: 1.2 0.2 mm
C: 1.2 0.2 mm
Unit: mm
0.4 0.8 1.0 0.4 1.2 2.6
Solder Specifications: Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255C 5C. The terminal electrode and the ferrite must not be damaged.
Strength on pc board bending ability: Solder a chip to test substrate, and then laterally apply a strength load 0.5Kg in the arrow direction. The terminal electrode and the ferrite must not be damaged.
Soldering condition: Solder a chip to a test substrate, bend the substrate by 2mm and then return.
Recommendation soldering condition: Apply cream solder to the test circuit board. It is mounted on the recommendation soldering condition.
High temperature resistance: Temperature: +1252, Applied voltage: Rated voltage, Applied current: Rated current, Testing time: 50012 hours. Measurement: After placing for 24 hours min. insulation resistance: >10(M), DC resistance: standard value inside.
Low temperature resistance: Temperature: -402, Testing time: 50012 hours. Measurement: After placing for 24 hours min.
Thermal cycle: Temperature: -40,+125 kept stabilized for 30 minutes each. Cycle: 100 cycle. Measurement: After placing for 24 hours min.
Humidity: Temperature: +852, Humidity: 90 to 95%RH, Applied current: Rated current, Applied voltage: Rated voltage, Testing time: 50012 hours. Measurement: After placing for 24 hours min.
Vibration: Frequency: 10 to 50 Hz, Amplitude: 1.52 mm, Dimension and times: X, Y and Z directions for 2 hours each.
Packaging Form: Material of carrier tape: Polystyrene, Material of cover tape: Polyester. There shall not continuation more than two vacancies of the product.
Cover Tape Peel Strength: The force for tearing off cover tape is 0.1~0.69(N) in the arrow direction at the following conditions: Temperature: 5 ~ 35, Humidity: 45 ~ 85%, Atmospheric pressure: 860 ~ 1060 hpa.
Packing Quantity: 2000 pcs./reel (180 mm reel T type).
Reflow: until two times. 150 (60sec. Min. 150sec Max.), 217 (10sec. Max.), 255 (5 seconds max. at 260). Natural cooling.
Iron Soldering: Use a solder iron of less than 30W when soldering, do not allow the soldering iron tip directly touch the ferrite body outside of terminal electrode.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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