Common Mode Noise Filter MetalLions ACT4532L-110-2P-TF Wire Wound Chip Chokes

Product Specification

Wire Wound Chip Common Mode Chokes ACT4532 Series

The ACT4532 Series Wire Wound Chip Common Mode Chokes are designed for high-frequency common mode noise filtering. Their winding type enables a small size and low profile, making them ideal for space-constrained applications. These chokes offer excellent solderability and a wide operating temperature range of -40~+125. They are particularly effective in preventing common mode noise in automotive CAN-BUS and signal lines.

Product Attributes

• Brand: Metal-Lions (derived from www.metal-lions.com)
• Certifications: Hazardous Substance Free Products (F)

Technical Specifications

Dimensions

Land Pattern:

• A: 4.5 0.2 mm
• B: 3.2 0.2 mm
• C: 2.8 0.2 mm
• D1: 1.0 Typ. mm
• D2: 1.2 Typ. mm

Explanation of Part Number

ACT 4532L - 101 - 2P - T F

• 1: Product Series: Wire Wound Chip Common Mode Filters
• 2: Dimensions
• 3: Number of Lines: 2
• 4: Inductance (H): 101=100uH
• 5: Packing (Tape & Reel)
• 6: F: Hazardous Substance Free Products

Applications

• Common mode noise filtering for automotive CAN-BUS and signal line

Reliability Test

Solderability: Electrodes shall be at least 95% covered with new solder coating. Pre-heating: 150 , 1min; Solder Composition: Sn/3.0Ag/0.5Cu; Solder Temperature: 2555 ; Immersion Time: 41sec.

Resistance to Soldering Heat: Appearance: No damage. Inductance change shall be within 20%. Pre-heating: 150, 1min; Solder Composition: Sn/Ag3.0/Cu0.5; Solder Temperature: 2555; Immersion Time: 101sec.

Resistance to Solvents: Inductors must withstand 6 minutes of alcohol or water. No change in appearance or obliteration of marking.

Terminal strength: The forces applied on the right conditions must not damage the terminal electrode and the ferrite. Appendix 1 Note (AEC-Q200-006): Force of 1.8 kg for 60 seconds.

Mechanical Shock: Pulse shape: Half-sine waveform; Impact acceleration: 100g; Pulse duration: 6ms; Number of shocks: 18 shocks (3 shocks for each face); Orientation: Bottom, top, left, right, front and rear faces.

Board Flex: Substrate Dimension: 100x40x1.6mm; Deflection: 2.0mm; Keeping Time: 60 sec.

Vibration: Vibration waveform: Sine waveform; Vibration frequency: 10Hz~2000Hz; Vibration acceleration: 5g; Sweep rate: 0.764386otcave/minute; Duration of test: 12 cycles each of 3 orientations, 20 minutes for each cycle; Vibration axes: X, Y & Z. Inductance change shall be within 30%.

High Temperature Exposure (Storage): Biased Temperature: 852; Relative Humidity: 85%; Time: 1000hrs. Measured after exposure in the room condition for 24hrs.

Operational Life: Temperature: 1252; Applied Current: Rated Current; Time: 100024 hrs. Measured after exposure in the room condition for 24 hrs.

Temperature Cycling Test: Conditions: -40 to +125; Soak Mode Condition: 30 minutes. Measured after exposure in the room condition for 24hrs.

Humidity Test: Conditions: Temperature Cycling Time: 1000hrs. Measured after exposure in the room condition for 24hrs.

Packaging

Reel Dimension & Tape Dimension:

Reel Dimensions (Unit: mm):

• A: 13.20.5
• B: 602
• C: 130.5
• D: 1802

Tape Dimensions:

• W: 12.00 0.1
• P: 8.00 0.1
• E: 1.75 0.1
• F: 5.50 0.05
• P2: 2.00 0.05
• D: 1.50 0.1
• D1: 1.50 0.1
• Po: 4.00 0.2
• 10Po: 40.00

Tape Dimensions (Component Pocket):

• Ao: 3.57 0.1
• Bo: 4.80 0.1
• Ko: 2.80 0.1
• t: 0.30 +0.10/-0.00

Packaging Quantity: 500 PCS/Reel

Soldering Conditions

Reflow Soldering (Lead Free): Preheat circuit and products to 150; 260 tip temperature (max); Reflow times: no more than 2 times; Solder paste thickness: 0.08mm (best), 0.1mm (max).

Wave Soldering: Never contact the ceramic with the iron tip; 1.0mm tip diameter (max).

Hand Soldering: Use a 20 watt soldering iron with tip diameter of 1.0mm; Limit soldering time to 3 sec.