| Insulation Resistance(IR) | 10MΩ |
| Operating Temperature | -40℃~+125℃ |
| DC Resistance(DCR) | 59mΩ |
| Number of Lines | 2 |
| Voltage Rating - DC | 50V |
| Description | Common Mode Choke Surface Mount-4P 4.7x4.5mm 700Ω@100MHz 2.2A DCR 59mΩ |
| Mfr. Part # | MACM4520-701 |
| Package | SMD-4P,4.7x4.5mm |
| Model Number | MACM4520-701 |
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Product Specification
| Insulation Resistance(IR) | 10MΩ | Operating Temperature | -40℃~+125℃ |
| DC Resistance(DCR) | 59mΩ | Number of Lines | 2 |
| Voltage Rating - DC | 50V | Description | Common Mode Choke Surface Mount-4P 4.7x4.5mm 700Ω@100MHz 2.2A DCR 59mΩ |
| Mfr. Part # | MACM4520-701 | Package | SMD-4P,4.7x4.5mm |
| Model Number | MACM4520-701 |
The MACM4520-701 is a chip common mode inductor designed for low profile, high current power supplies, battery powered devices, and DC/DC converters. It features ROHS compliance, super low resistance, ultra-high current rating, and high performance realized by a metal dust core. This inductor operates effectively in a frequency range up to 1MHz and has a recommended operating temperature range of -40 to +125.
| Product NO | Z () 100MHZ/0.1V (MIN) | Z () 100MHZ/0.1V (TYP) | DCR (m) max | Rated Current (A) max | IR (M) MIN | Rated Voltage (V) | Marking |
| MACM4520-701 | 500 | 700 | 59 | 2.2 | 10 | 50 | 701 |
| Dimension | Value (mm) |
| A | 4.700.50 |
| B | 4.500.50 |
| C | 2.20Max |
| D | 2.70Typ |
| E | 0.80Typ |
| F | 1.25Typ |
| G | 1.00Typ |
| NO. | ITEM | DESCRIPTION | SUPPLIER |
| 1 | CORE | FERRITE | SINCORES OR EQ |
| 2 | WIRE | 2UEW P180 | PACIFIC OR EQ |
| 3 | TAPE | DM | HENGRENXIN OR EQ |
| 4 | SOLDER | Sn99.3 :Cu0.7 | SHENMAO OR EQ |
| 5 | INK | WHITE | BON MARK |
| Characteristic | Description |
| Ambient Temperature | All test data is based on 25 ambient. |
| Temperature Rise | DC current(A) that will cause an approximate T40. |
| Operating Temperature Range | -40~+125. |
| Part Temperature Limit | The part temperature (ambient + temp rise) should not exceed 125 under worst case operating conditions. Circuit design, component, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the application. |
| Item | Specification and Requirement | Test Method |
| Solder ability test | Terminals area must have 95% min solder coverage. | Solder heat proof: (1) Preheating: 16010 for 90 seconds (2) Retention time: 2455 for 20.5 seconds. |
| Vibration test | Inductance change: Within5% Without mechanical damage such as break. | (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period. (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions. (3) Amplitude: 1.5 mm Max. |
| Shock test | Inductance change: Within5% Without mechanical damage such as break. | (1) Peak value: 100G. (2) Duration of pulse: 11ms. (3) Times in each positive and negative direction of 3 mutual perpendicular directions. |
| Thermal shock | Inductance change: Within5% Without mechanical damage such as break. | (1) Repeat 100 cycles: (-402, 303 minutes) -> Room temperature, 5 minutes -> (+1252, 303 minutes) -> Room temperature, 5 minutes. (2) Recovery: 48+4/-0 hours of recovery under the standard condition after the test. (see Note1) |
| High temperature life test | Inductance change: Within5% Without mechanical damage such as break. | (1) Environment condition: 852. Applied current: Rated current. (2) Duration: 1000+4/-0 hours (see Note1). |
| Humidity Resistance | Inductance change: Within5% Without mechanical damage such as break. | (1) Environment condition: 602, Humidity: 90~95%. Applied current: Rated current. (2) Duration: 1000+4/-0 hours (see Note1). |
| Low temperature life test | Inductance change: Within5% Without mechanical damage such as break. | (1) Store temperature -402 for total 1000+4/-0 hours. |
| High temperature life test | Inductance change: Within5% Without mechanical damage such as break. | (1) Store temperature +1252 for total 1000+4/-0 hours. |
| Item | Specification |
| Tape width | 12mm |
| Distance | 8mm |
| Pull-of force | 20-120g |
| Reel (Diameter 178mm) | 1000PCS/Reel |
| Inner Box | 4000PCS/Box |
| Outer Box | 20000PCS/Box |
| PE Bag | 4000PCS/Bag |
| Method | Specification |
| Reflow Soldering Method | Refer to Reflow Profile diagram. |
| Soldering iron method | 3505 Max. 3 seconds. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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