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The MGRC3225L601T-2-LF is a Common Mode Choke Coil designed for noise suppression in general electronic equipment. This wire-wound chip component offers reliable performance and is suitable for applications in office supply equipment, telecommunications systems, measuring equipment, and household equipment. It is RoHS compliant and manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Type: Wire Wound Chip Common Mode Choke Coil
Series: MGRC3225
Material Code: L (For Larger Current)
Packing Style: T (Taping)
Lead Free: Yes
RoHS Compliant: Yes
Technical Specifications
Part No.
Dimensions (LW)
Common-mode Impedance Z () at 100MHz
DC Resistance Rdc (m) Max
Rated Current Idc (mA) Max
Rated Voltage Vdc (V) Max
Insulation Resistance (M) Min
Operating Temperature Range
MGRC3225L601T-2-LF
3.2 2.5 mm
600 25%
120
1000
50
10
-40 to +85
Dimensions
A (mm)
B (mm)
C (mm)
(mm)
(mm)
(mm)
(mm)
3.2 0.2
2.5 0.2
2.1 0.2
0.90
0.90
0.60
0.60
Testing Conditions
Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH
In Case of Doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa
Reliable Performance
No.
Item
Specifications
Test Methods
1
Solder-Ability
Terminal area shall be at least 95% covered.
Solder: 96.5% Sn +3.0%Ag+0.5%Cu, Temperature: 2455, Flux: rosin, Duration: 3.50.5s
2
Leaching Resistance
1) No case deformation or change in appearance. 2) |Z/Z0| 20%
Peak temperature: 260+5/-0; Reflow: 2 times; Temperature curve as specified.
3
Terminal Strength
The terminal and body should be no damage.
Solder a chip to test substrate, then laterally apply a load 10N in the X, Y and Z directions.
4
Bending Strength
No mechanical damage should be noticed.
Soldering a chip to a test substrate, bend the substrate by 2mm and then return.
5
Vibration
1) No mechanical damage shall be noticed. 2) |Z/Z0| 20%
Frequency: 10 to 55Hz, Amplitude: 1.5mm, Direction and time: X, Y and Z directions for 2 hours each.
6
Humidity resistance
-
Test condition: Temp.: 852, Humidity: 90%~95%, Test time: 100024 h. Measurement method: Stabilize at normal condition for (242) hours before test.
7
High temperature resistance
-
Test condition: Applied rated current. Temp.: 852, Test time: 100024 h. Measurement method: Stabilize at normal condition for (242) hours before test.
8
Low temperature resistance
-
Test condition: Temp.: -402, Test time: 100024 h. Measurement method: Stabilize at normal condition for (242) hours before test.
9
Thermal shock (Temperature cycle)
-
Test condition: 1) Temp.: -40, time: 303min; 2) Temp.: +85, time: 303min, 5 cycles. Measurement method: Stabilize at normal condition for (242) hours before test.
Recommended Soldering Conditions
Profile Feature
Lead-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3 /second max.
Preheat Temperature Min (Tsmin)
150
Preheat Temperature Max (Tsmax)
200
Preheat Time (tsmin to tsmax)
60-180 seconds
Time maintained above Temperature (TL)
217
Time maintained above Time (tL)
60-150 seconds
Peak/Classification Temperature (Tp)
255
Peak/Classification Time (Tp)
30 seconds max.
Time within 5 C of actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
6 /second max.
Time 25 C to Peak Temperature
8 minutes max.
Packaging
Taping Style: T (Taping)
Reel Diameter: 180 mm
Packing Quantity (180 mm reel, T type): 1500pcs/reel
Storage Conditions
Temperature: -10 to 40
Humidity: 70% RH
Avoid exposure to high temperature, high humidity, dust, and harmful gases.
Keep packages sealed until use.
Solderability guaranteed for 12 months from the date of delivery under specified storage conditions.
Transportation
Cases shall not be damaged, destroyed, or exposed to rain.
Warning and Attentions
Handling: Wear static control bands, use properly grounded devices, use non-magnetic tweezers.
PCB Handling: Avoid stresses during board splitting. Use appropriate devices for board separation.
Mechanical Considerations: Avoid excessive mechanical shocks. Do not apply shock or power during transportation.
Pick-up Pressure: Do not apply pressure to winding parts or ferrite core exposure parts.
Usage Precautions: Do not apply current in excess of rated current. Keep away from magnetic fields. Consider potential changes in electrical characteristics due to heat or resin coating stress. Ensure proper adhesive use if applicable. Pay attention to heat radiation when mounting components closely. Avoid magnetic coupling due to narrow component spacing.
Soldering: Refer to recommended conditions. Avoid flux residue on wire parts.
Cleaning: Max cleaning temperature 60 (40 for fluoride/alcohol). Ultrasonic cleaning power 20W/l, frequency 28-40 KHz, time 5 minutes. Use recommended cleaners. Ensure no residual flux/cleaner. Dry completely after rinsing.
Circuit Design
Intended Use: General electronic equipment (office supply, telecommunications, measuring, household).
Not Intended For: Mission-critical equipment or systems requiring special quality and high reliability (traffic, safety, aerospace, nuclear control, medical life-support systems). Contact sales department for such uses.
Company Profile
Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
Company Profile
Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...