Noise Suppression Wire Wound Chip Common Mode Choke Coil Microgate MGRC7060M301T

Product Specification

Product Overview

The MGRC7060 series of Common Mode Choke Coils are designed for effective noise suppression. These winding wire common mode choke coils are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. and are RoHS compliant. They are suitable for applications requiring reliable performance and are available in taping or bulk packaging styles.

Product Attributes

• Brand: MICROGATE
• Manufacturer: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
• Origin: Shenzhen, China
• Certifications: RoHS Compliant
• Product Type: Wire Wound Chip Common Mode Choke Coil

Technical Specifications

Dimensions

Reliability & Testing

Recommended Soldering Conditions

Reflow Soldering Conditions

Refer to J-STD-020D for reflow soldering curve. Ensure appropriate solder volume to avoid mechanical stress. Prevent solder from adhering to the wire part and check for flux residue after soldering.

Iron Soldering Conditions

• Pre-heating: 150, 1 minute
• Tip temperature: 350 max
• Soldering iron output: 30W max
• Soldering iron tip diameter: 1mm max
• Soldering time: 3 seconds max

Packaging

• Packaging quantities: 1500 PCS/Reel
• Peeling strength of cover tape: 10 to 100 grams in the arrow direction

Storage

• Storage period: Products over 12 months old should be examined. Solderability should be checked if this period is exceeded.
• Storage conditions: Temperature: -40 ~ +60; Humidity: 5~85%RH.
• Avoid corrosive gases (sulfur, chlorine, acid).
• Store on palettes to prevent humidity and dust influence.
• Store in a warehouse without heat shock, vibration, or direct sunlight.
• Store under airtight packaged condition.

Warning and Attentions

General Handling Precautions

• Wear static control bands to protect against ESD.
• Ensure all devices (soldering iron, measuring instruments) are properly grounded.
• Use non-magnetic tweezers when handling chips.
• When splitting PC boards, avoid stresses of deflection or twisting. Use appropriate devices for board separation.
• Do not apply excessive mechanical shocks or power during transportation.
• Avoid pushing or applying shock to the winding part or ferrite core exposure part.

Precautions on Use

• Do not apply current in excess of the rated current value.
• Keep clear of strong magnetic fields (speakers, coils).
• Electrical characteristics may vary due to hot energy and mechanical stress during soldering.
• Coating products with resin may change electrical characteristics due to curing stress; evaluate reliability in your application.
• When using adhesive for preliminary assembly, check land pattern size, adhesive type, amount, and hardening.
• Pay attention to heat radiation when mounting components nearby.
• Narrow spacing between components may cause magnetic coupling in open magnetic circuit designs.
• Do not touch wires with sharp terminals to avoid damage.
• Do not add shock or power to soldered products.
• Do not touch electrodes with bare hands to avoid deteriorating solderability due to grease or oil.

PCB Bending Design

• Design PCBs to avoid mechanical stress from board warp or deflection.
• Consider product location on PCB separation.
• Exercise care when splitting PCB boards, inserting/removing connectors, or fastening threads to avoid stress.
• Locate products in the sideways direction to mechanical stress.
• Mechanical force can deteriorate bonding strength and cause product cracks. Board separation should be done with appropriate devices.

Recommended PCB Design for SMT Land-Patterns

• Use recommended PCB pads and solder paste; contact manufacturer for changes.
• Solder amount affects mechanical stress resistance; design land patterns for appropriate solder fillets.
• Separate soldering points with solder-resist when jointly soldering multiple parts on the same land/pad.
• Refer to product specification for recommended land dimensions.

Cleaning

• Cleaning temperature: 60 Max (40 Max for fluoride and alcohol type cleaner).
• Ultrasonic cleaning: Power 20W/l Max, Frequency 28-40 KHz, Time 5 minutes Max. Avoid resonance.
• Cleaners: Isopropyl alcohol (IPA), HCFC-225, Aqueous agents (Surface Active Agent Type, Hydrocarbon Type, Higher Alcohol Type, Alkali saponifier Type).
• Ensure no residual flux or cleaner after cleaning. Dry completely after rinsing with de-ionized water.
• Some products may become slightly whitened, but performance is unaffected.
• Take care of the winding part during cleaning.
• Parts can be subjected to reflow soldering after cleaning once solvent has volatilized.