Beijing Silk Road Enterprise Management Services Co., Ltd.
| Current Rating | 300mA |
| Number of Circuits | 1 |
| DC Resistance(DCR) | 600mΩ |
| Tolerance | ±25% |
| Impedance @ Frequency | 1.5kΩ@100MHz |
| Description | 600mΩ ±25% 1.5kΩ@100MHz 1206 Ferrite Beads and Chips RoHS |
| Mfr. Part # | CBG321609U152T |
| Package | 1206 |
| Model Number | CBG321609U152T |
View Detail Information
Explore similar products
Multilayer Ferrite Chip Beads for EMI Suppression Chilisin BBUP00321611121Y00
Compact multilayer chip ferrite beads FH CBM201209U181T for EMI RFI noise
High Current Multilayer Chip Ferrite Beads FH CBM201209U220T Suitable for SMT
Multilayer chip ferrite beads FH CBM160808U220T designed for EMI RFI suppression
Product Specification
| Current Rating | 300mA | Number of Circuits | 1 |
| DC Resistance(DCR) | 600mΩ | Tolerance | ±25% |
| Impedance @ Frequency | 1.5kΩ@100MHz | Description | 600mΩ ±25% 1.5kΩ@100MHz 1206 Ferrite Beads and Chips RoHS |
| Mfr. Part # | CBG321609U152T | Package | 1206 |
| Model Number | CBG321609U152T |
The CBG321609U Series is a range of chip ferrite beads designed for noise suppression. These components are manufactured using a Ni-Cu-Zn ferrite system and pure silver inner electrodes, with Ni/Sn plating on the terminal electrodes. They are suitable for reflow soldering and offer various impedance and current ratings.
| Part NO. | Impedance () | Tolerance | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | Rated Current (mA)max |
| CBG321609U000T | 0 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U050T | 5 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U070T | 7 | 011 | 0.05 | 100 | 50 | 2200 |
| CBG321609U090T | 9 | 513 | 0.05 | 100 | 50 | 2000 |
| CBG321609U110T | 11 | 715 | 0.05 | 100 | 50 | 2000 |
| CBG321609U150T | 15 | 921 | 0.05 | 100 | 50 | 2000 |
| CBG321609U190T | 19 | 1225 | 0.05 | 100 | 50 | 2000 |
| CBG321609U260T | 26 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U310T | 31 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U600T | 60 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U700T | 70 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U800T | 80 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U101T | 100 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U121T | 120 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U151T | 150 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U181T | 180 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U221T | 220 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U301T | 300 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U501T | 500 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U601T | 600 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U801T | 800 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U102T | 1000 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U122T | 1200 | 25% | 0.60 | 100 | 50 | 300 |
| CBG321609U152T | 1500 | 25% | 0.60 | 50 | 50 | 300 |
| CBG321609U182T | 1800 | 25% | 0.80 | 50 | 50 | 100 |
| CBG321609U202T | 2000 | 25% | 1.00 | 50 | 50 | 100 |
| CBG321609U252T | 2500 | 25% | 1.20 | 50 | 50 | 50 |
| CBG321609U302T | 3000 | 25% | 1.50 | 50 | 50 | 50 |
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s |
| Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 3216 series. Keep time: 101S |
| Low temperature | No mechanical damage. Impedance change: within 30% | Temperature:-552; Testing time:1000 +240/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000 +240/-0 h; Temperature: 1252 |
| Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h |
| High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000 +240/-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
| Size | A | B | C | N | G |
| 321609 | 1782.0 | 22.02.0 | 12.51.5 | 572.0 | 8 |
| Size | Paper tape |
| 321609 | (Dimensions not fully specified, only 'Paper tape' mentioned) |
| Size | REEL | BOX | CASE |
| 321609 | 4000 | 40000 | 240000 |
| Soldering Conditions | Details |
| Reflow soldering profile | Products should be soldered within the allowable range indicated by the slanted line. Un-enough pre-heating may cause cracks on the ferrite. Temperature difference between solder and ferrite surface limited to 150 max during pre-heating. Temperature difference between product surface and solvent after soldering limited to 100 max. |
| Iron soldering | Soldering Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes). |
| Cleaning Conditions | Details |
| Cleaning Temperature | 60 (max) |
| Cleaning Time | 1 minute (min) |
| Ultrasonic output power | 200W (max) |
| Storage Requirements | Details |
| Storage period | Within 1 year from the factory inspection date. Inspection number can be confirmed by markings on the outer packaging. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
Get in touch with us
Leave a Message, we will call you back quickly!