Beijing Silk Road Enterprise Management Services Co., Ltd.
| Description | Ferrite Beads and Chips RoHS |
| Mfr. Part # | CBU160808X221T |
| Model Number | CBU160808X221T |
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Product Specification
| Description | Ferrite Beads and Chips RoHS | Mfr. Part # | CBU160808X221T |
| Model Number | CBU160808X221T |
Multilayer Chip Ferrite Ultra-High Current Beads (CBU series) are designed for miniature volume applications requiring low DC resistance and large current ratings. They offer low magnetic leakage, preventing cross-coupling between inductors and ensuring high reliability. Leadless and suitable for high-density SMT, these beads boast excellent solderability and resistance to thermal shock, making them ideal for reflow soldering. They are used for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication equipment, computers, and LCD TVs.
| Part Number | Dimensions (mm) (LWT) | Impedance () at 100MHz | DCR () Max | Rated Current (mA) Max |
| CBU100505X100T | 1.00.50.5 | 10 | 0.018 | 3100 |
| CBU100505X330T | 1.00.50.5 | 33 | 0.022 | 3000 |
| CBU100505X600T | 1.00.50.5 | 60 | 0.032 | 2500 |
| CBU100505X800T | 1.00.50.5 | 80 | 0.038 | 2300 |
| CBU100505X121T | 1.00.50.5 | 120 | 0.050 | 2000 |
| CBU100505X181T | 1.00.50.5 | 180 | 0.085 | 1600 |
| CBU100505X221T | 1.00.50.5 | 220 | 0.095 | 1500 |
| CBU100505X331T | 1.00.50.5 | 330 | 0.150 | 1200 |
| CBU100505X471T | 1.00.50.5 | 470 | 0.200 | 1000 |
| CBU100505X601T | 1.00.50.5 | 600 | 0.230 | 900 |
| CBU160808X220T | 1.60.80.8 | 22 | 0.010 | 6000 |
| CBU160808X300T | 1.60.80.8 | 30 | 0.010 | 5000 |
| CBU160808X700T | 1.60.80.8 | 70 | 0.020 | 4000 |
| CBU160808X101T | 1.60.80.8 | 100 | 0.030 | 3000 |
| CBU160808X121T | 1.60.80.8 | 120 | 0.025 | 3000 |
| CBU160808X221T | 1.60.80.8 | 220 | 0.040 | 2500 |
| CBU160808X331T | 1.60.80.8 | 330 | 0.070 | 1700 |
| CBU160808X471T | 1.60.80.8 | 470 | 0.120 | 1500 |
| CBU160808X601T | 1.60.80.8 | 600 | 0.150 | 1300 |
| CBU160808X102T | 1.60.80.8 | 1000 | 0.200 | 1000 |
| CBU160808U600T | 1.60.80.8 | 60 | 0.025 | 3500 |
| CBU160808U800T | 1.60.80.8 | 80 | 0.025 | 3500 |
| CBU160808U101T | 1.60.80.8 | 100 | 0.040 | 3000 |
| CBU160808U121T | 1.60.80.8 | 120 | 0.040 | 2000 |
| CBU160808U181T | 1.60.80.8 | 180 | 0.070 | 2000 |
| CBU160808U221T | 1.60.80.8 | 220 | 0.090 | 2000 |
| CBU160808U301T | 1.60.80.8 | 300 | 0.150 | 2000 |
| CBU160808U501T | 1.60.80.8 | 500 | 0.150 | 1500 |
| CBU160808U601T | 1.60.80.8 | 600 | 0.150 | 1500 |
| CBU160808U801T | 1.60.80.8 | 800 | 0.200 | 1200 |
| CBU160808U102T | 1.60.80.8 | 1000 | 0.300 | 1000 |
| CBU201209U800T | 2.01.20.9 | 80 | 0.025 | 3500 |
| CBU201209U101T | 2.01.20.9 | 100 | 0.025 | 3500 |
| CBU201209U151T | 2.01.20.9 | 150 | 0.050 | 3000 |
| CBU201209U181T | 2.01.20.9 | 180 | 0.050 | 3000 |
| CBU201209U221T | 2.01.20.9 | 220 | 0.050 | 3000 |
| CBU201209U301T | 2.01.20.9 | 300 | 0.050 | 3000 |
| CBU201209U501T | 2.01.20.9 | 500 | 0.090 | 2500 |
| CBU201209U601T | 2.01.20.9 | 600 | 0.090 | 2500 |
| CBU201209U102T | 2.01.20.9 | 1000 | 0.110 | 2000 |
| CBU201209U122T | 2.01.20.9 | 1200 | 0.180 | 1000 |
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No mechanical damage. 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120 ~ 150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu) solder, Solder temperature: 2453, Immersion tin depth:10mm, Duration : 30.3s, Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu) solder, Solder temperature: 2605, Immersion tin depth:10mm, Duration : 101s, Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series7N for 1608 series10N for 2012 series. Keep time 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature:-552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate, For 10.5 mm/s compression speed, curvature: 2mm, hold time20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30%. | Amplitude modulation: 1.5mm, Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Impedance change: within 30%. | Testing time: 10000 +24 h, Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30%. | Humidity: 90% to 95% RH, Temperature: 602, Testing time: 10000 +24 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30%. | Impose current: at rated current, Testing time: 10000 +24 h, Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30%. | Temperature: -55 for 303min +125 for 303min, Number of cycles: 100 |
Packaging Quantity:
Reflow Soldering Profile:
Hand Soldering:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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