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System On Chip (SoC)

Manufacturer of a wide range of products which include DRV5013ADQDBZTQ1,APS11500LLHALT-1SL1A,M2S025T-1VFG256,etc

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Category Sensors, Transducers Magnetic Sensors Switches (Solid State)
Function Latch
Product Status Active
Features Temperature Compensated
Package Tape & Reel (TR) Cut Tape (CT) Digi-Reel®
Series Automotive, AEC-Q100
Mfr Texas Instruments
Output Type Open Drain
Polarization South Pole
Current - Supply (Max) 2.7mA (Typ)
Voltage - Supply 2.7V ~ 38V
Sensing Range 5mT Trip, -5mT Release
Current - Output (Max) 30mA
Operating Temperature -40°C ~ 125°C (TA)
Technology Hall Effect
Test Condition -40°C ~ 125°C
Base Product Number DRV5013
Description MAGNETIC SWITCH LATCH

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Category Sensors, Transducers Magnetic Sensors Switches (Solid State)
Function Unipolar Switch
Product Status Active
Features -
Mounting Type Surface Mount
Package Tape & Reel (TR)
Series Automotive, AEC-Q100
Supplier Device Package SOT-23W
Output Type Open Drain
Polarization South Pole
Mfr Allegro MicroSystems
Current - Supply (Max) 6.9mA
Voltage - Supply 3V ~ 24V
Sensing Range 6mT Trip, 1mT Release
Package / Case SOT-23W
Current - Output (Max) -
Operating Temperature -40°C ~ 150°C (TA)
Technology Hall Effect
Test Condition -40°C ~ 150°C
Base Product Number APS115
Description MAGNETIC SWITCH UNIPOLAR SOT23W

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S025
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 25K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 256-FPBGA (17x17)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 256-LBGA
Number of I/O 138
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 256FBGA
Stock In Stock
Shipping Method LCL, FCL, Express
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XCZU5
Product Status Active
Peripherals DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Mfr AMD
Supplier Device Package 784-FCBGA (23x23)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 784-BFBGA, FCBGA
Number of I/O 252
RAM Size 256KB
Speed 500MHz, 600MHz, 1.2GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
Description IC SOC CORTEX-A53 784FCBGA
Stock In Stock
Shipping Method LCL, FCL, Express
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XCZU9
Product Status Active
Peripherals DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Mfr AMD
Supplier Device Package 1156-FCBGA (35x35)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1156-BBGA, FCBGA
Number of I/O 328
RAM Size 256KB
Speed 500MHz, 600MHz, 1.2GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
Description IC SOC CORTEX-A53 1156FCBGA
Stock In Stock
Shipping Method LCL, FCL, Express
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XCZU15
Product Status Active
Peripherals DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Mfr AMD
Supplier Device Package 900-FCBGA (31x31)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 900-BBGA, FCBGA
Number of I/O 204
RAM Size 256KB
Speed 533MHz, 600MHz, 1.3GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
Description IC SOC CORTEX-A53 900FCBGA
Stock In Stock
Shipping Method LCL, FCL, Express
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DDR, DMA, PCIe
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Series Versal™ AI Core
Package Tray
Mfr AMD
Supplier Device Package 1369-BGA (35x35)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MPU, FPGA
Package / Case 1369-BFBGA
Number of I/O 500
RAM Size -
Speed 450MHz, 1.08GHz
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
Description IC VERSAL AI-CORE FPGA 1369BGA
Stock In Stock
Shipping Method LCL, FCL, Express
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 160K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 484-UBGA (19x19)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 484-BFBGA
Number of I/O 192
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 484UBGA
Stock In Stock
Shipping Method LCL, FCL, Express
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XCZU4
Product Status Active
Peripherals DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Mfr AMD
Supplier Device Package 900-FCBGA (31x31)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 900-BBGA, FCBGA
Number of I/O 204
RAM Size 256KB
Speed 500MHz, 600MHz, 1.2GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
Description IC SOC CORTEX-A53 900FCBGA
Stock In Stock
Shipping Method LCL, FCL, Express
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number 5CSEMA5
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 85K Logic Elements
Series Cyclone® V SE
Package Tray
Mfr Intel
Supplier Device Package 896-FBGA (31x31)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 896-BGA
Number of I/O MCU - 181, FPGA - 288
RAM Size 64KB
Speed 925MHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 925MHZ 896FBGA
Stock In Stock
Shipping Method LCL, FCL, Express
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram

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