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Manufacturer of a wide range of products which include DRV5013ADQDBZTQ1,APS11500LLHALT-1SL1A,M2S025T-1VFG256,etc
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| Category | Sensors, Transducers Magnetic Sensors Switches (Solid State) | 
| Function | Latch | 
| Product Status | Active | 
| Features | Temperature Compensated | 
| Package | Tape & Reel (TR) Cut Tape (CT) Digi-Reel® | 
| Series | Automotive, AEC-Q100 | 
| Mfr | Texas Instruments | 
| Output Type | Open Drain | 
| Polarization | South Pole | 
| Current - Supply (Max) | 2.7mA (Typ) | 
| Voltage - Supply | 2.7V ~ 38V | 
| Sensing Range | 5mT Trip, -5mT Release | 
| Current - Output (Max) | 30mA | 
| Operating Temperature | -40°C ~ 125°C (TA) | 
| Technology | Hall Effect | 
| Test Condition | -40°C ~ 125°C | 
| Base Product Number | DRV5013 | 
| Description | MAGNETIC SWITCH LATCH | 
 
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| Category | Sensors, Transducers Magnetic Sensors Switches (Solid State) | 
| Function | Unipolar Switch | 
| Product Status | Active | 
| Features | - | 
| Mounting Type | Surface Mount | 
| Package | Tape & Reel (TR) | 
| Series | Automotive, AEC-Q100 | 
| Supplier Device Package | SOT-23W | 
| Output Type | Open Drain | 
| Polarization | South Pole | 
| Mfr | Allegro MicroSystems | 
| Current - Supply (Max) | 6.9mA | 
| Voltage - Supply | 3V ~ 24V | 
| Sensing Range | 6mT Trip, 1mT Release | 
| Package / Case | SOT-23W | 
| Current - Output (Max) | - | 
| Operating Temperature | -40°C ~ 150°C (TA) | 
| Technology | Hall Effect | 
| Test Condition | -40°C ~ 150°C | 
| Base Product Number | APS115 | 
| Description | MAGNETIC SWITCH UNIPOLAR SOT23W | 
 
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) | 
| Base Product Number | M2S025 | 
| Product Status | Active | 
| Peripherals | DDR, PCIe, SERDES | 
| Primary Attributes | FPGA - 25K Logic Modules | 
| Series | SmartFusion®2 | 
| Package | Tray | 
| Mfr | Microchip Technology | 
| Supplier Device Package | 256-FPBGA (17x17) | 
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 
| Operating Temperature | 0°C ~ 85°C (TJ) | 
| Architecture | MCU, FPGA | 
| Package / Case | 256-LBGA | 
| Number of I/O | 138 | 
| RAM Size | 64KB | 
| Speed | 166MHz | 
| Core Processor | ARM® Cortex®-M3 | 
| Flash Size | 256KB | 
| Description | IC SOC CORTEX-M3 166MHZ 256FBGA | 
| Stock | In Stock | 
| Shipping Method | LCL, FCL, Express | 
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | 
 
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) | 
| Base Product Number | XCZU5 | 
| Product Status | Active | 
| Peripherals | DMA, WDT | 
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 
| Series | Zynq® UltraScale+™ MPSoC EV | 
| Package | Tray | 
| Mfr | AMD | 
| Supplier Device Package | 784-FCBGA (23x23) | 
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Operating Temperature | 0°C ~ 100°C (TJ) | 
| Architecture | MCU, FPGA | 
| Package / Case | 784-BFBGA, FCBGA | 
| Number of I/O | 252 | 
| RAM Size | 256KB | 
| Speed | 500MHz, 600MHz, 1.2GHz | 
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
| Flash Size | - | 
| Description | IC SOC CORTEX-A53 784FCBGA | 
| Stock | In Stock | 
| Shipping Method | LCL, FCL, Express | 
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | 
 
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) | 
| Base Product Number | XCZU9 | 
| Product Status | Active | 
| Peripherals | DMA, WDT | 
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 
| Series | Zynq® UltraScale+™ MPSoC EG | 
| Package | Tray | 
| Mfr | AMD | 
| Supplier Device Package | 1156-FCBGA (35x35) | 
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Operating Temperature | 0°C ~ 100°C (TJ) | 
| Architecture | MCU, FPGA | 
| Package / Case | 1156-BBGA, FCBGA | 
| Number of I/O | 328 | 
| RAM Size | 256KB | 
| Speed | 500MHz, 600MHz, 1.2GHz | 
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
| Flash Size | - | 
| Description | IC SOC CORTEX-A53 1156FCBGA | 
| Stock | In Stock | 
| Shipping Method | LCL, FCL, Express | 
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | 
 
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) | 
| Base Product Number | XCZU15 | 
| Product Status | Active | 
| Peripherals | DMA, WDT | 
| Primary Attributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | 
| Series | Zynq® UltraScale+™ MPSoC EG | 
| Package | Tray | 
| Mfr | AMD | 
| Supplier Device Package | 900-FCBGA (31x31) | 
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Operating Temperature | 0°C ~ 100°C (TJ) | 
| Architecture | MCU, FPGA | 
| Package / Case | 900-BBGA, FCBGA | 
| Number of I/O | 204 | 
| RAM Size | 256KB | 
| Speed | 533MHz, 600MHz, 1.3GHz | 
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
| Flash Size | - | 
| Description | IC SOC CORTEX-A53 900FCBGA | 
| Stock | In Stock | 
| Shipping Method | LCL, FCL, Express | 
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | 
 
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) | 
| Product Status | Active | 
| Peripherals | DDR, DMA, PCIe | 
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells | 
| Series | Versal™ AI Core | 
| Package | Tray | 
| Mfr | AMD | 
| Supplier Device Package | 1369-BGA (35x35) | 
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Operating Temperature | 0°C ~ 100°C (TJ) | 
| Architecture | MPU, FPGA | 
| Package / Case | 1369-BFBGA | 
| Number of I/O | 500 | 
| RAM Size | - | 
| Speed | 450MHz, 1.08GHz | 
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 
| Flash Size | - | 
| Description | IC VERSAL AI-CORE FPGA 1369BGA | 
| Stock | In Stock | 
| Shipping Method | LCL, FCL, Express | 
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | 
 
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) | 
| Product Status | Active | 
| Peripherals | DMA, POR, WDT | 
| Primary Attributes | FPGA - 160K Logic Elements | 
| Series | Arria 10 SX | 
| Package | Tray | 
| Mfr | Intel | 
| Supplier Device Package | 484-UBGA (19x19) | 
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Operating Temperature | -40°C ~ 100°C (TJ) | 
| Architecture | MCU, FPGA | 
| Package / Case | 484-BFBGA | 
| Number of I/O | 192 | 
| RAM Size | 256KB | 
| Speed | 1.5GHz | 
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 
| Flash Size | - | 
| Description | IC SOC CORTEX-A9 1.5GHZ 484UBGA | 
| Stock | In Stock | 
| Shipping Method | LCL, FCL, Express | 
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | 
 
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) | 
| Base Product Number | XCZU4 | 
| Product Status | Active | 
| Peripherals | DMA, WDT | 
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 
| Series | Zynq® UltraScale+™ MPSoC EG | 
| Package | Tray | 
| Mfr | AMD | 
| Supplier Device Package | 900-FCBGA (31x31) | 
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Operating Temperature | -40°C ~ 100°C (TJ) | 
| Architecture | MCU, FPGA | 
| Package / Case | 900-BBGA, FCBGA | 
| Number of I/O | 204 | 
| RAM Size | 256KB | 
| Speed | 500MHz, 600MHz, 1.2GHz | 
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
| Flash Size | - | 
| Description | IC SOC CORTEX-A53 900FCBGA | 
| Stock | In Stock | 
| Shipping Method | LCL, FCL, Express | 
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | 
 
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) | 
| Base Product Number | 5CSEMA5 | 
| Product Status | Active | 
| Peripherals | DMA, POR, WDT | 
| Primary Attributes | FPGA - 85K Logic Elements | 
| Series | Cyclone® V SE | 
| Package | Tray | 
| Mfr | Intel | 
| Supplier Device Package | 896-FBGA (31x31) | 
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Operating Temperature | 0°C ~ 85°C (TJ) | 
| Architecture | MCU, FPGA | 
| Package / Case | 896-BGA | 
| Number of I/O | MCU - 181, FPGA - 288 | 
| RAM Size | 64KB | 
| Speed | 925MHz | 
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 
| Flash Size | - | 
| Description | IC SOC CORTEX-A9 925MHZ 896FBGA | 
| Stock | In Stock | 
| Shipping Method | LCL, FCL, Express | 
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | 
 
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