Beijing Silk Road Enterprise Management Services Co.,LTD
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Manufacturer of a wide range of products which include M2S025T-1VFG256,XCZU5EV-1SFVC784E,XCZU9EG-1FFVB1156E,etc
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | M2S025 |
| Product Status | Active |
| Peripherals | DDR, PCIe, SERDES |
| Primary Attributes | FPGA - 25K Logic Modules |
| Series | SmartFusion®2 |
| Package | Tray |
| Mfr | Microchip Technology |
| Supplier Device Package | 256-FPBGA (17x17) |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 256-LBGA |
| Number of I/O | 138 |
| RAM Size | 64KB |
| Speed | 166MHz |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 256KB |
| Description | IC SOC CORTEX-M3 166MHZ 256FBGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | M2S025T-1VFG256 |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XCZU5 |
| Product Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 784-FCBGA (23x23) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 784-BFBGA, FCBGA |
| Number of I/O | 252 |
| RAM Size | 256KB |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| Description | IC SOC CORTEX-A53 784FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | XCZU5EV-1SFVC784E |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XCZU9 |
| Product Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 1156-BBGA, FCBGA |
| Number of I/O | 328 |
| RAM Size | 256KB |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| Description | IC SOC CORTEX-A53 1156FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | XCZU9EG-1FFVB1156E |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XCZU15 |
| Product Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 900-FCBGA (31x31) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 900-BBGA, FCBGA |
| Number of I/O | 204 |
| RAM Size | 256KB |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| Description | IC SOC CORTEX-A53 900FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | XCZU15EG-2FFVC900E |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Series | Versal™ AI Core |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1369-BGA (35x35) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 1369-BFBGA |
| Number of I/O | 500 |
| RAM Size | - |
| Speed | 450MHz, 1.08GHz |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| Description | IC VERSAL AI-CORE FPGA 1369BGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | XCVC1702-2LSENSVG1369 |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 160K Logic Elements |
| Series | Arria 10 SX |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 484-UBGA (19x19) |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 484-BFBGA |
| Number of I/O | 192 |
| RAM Size | 256KB |
| Speed | 1.5GHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 1.5GHZ 484UBGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | 10AS016C3U19I2SG |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XCZU4 |
| Product Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 900-FCBGA (31x31) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 900-BBGA, FCBGA |
| Number of I/O | 204 |
| RAM Size | 256KB |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| Description | IC SOC CORTEX-A53 900FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | XCZU4EG-1FBVB900I |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | 5CSEMA5 |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 85K Logic Elements |
| Series | Cyclone® V SE |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 896-FBGA (31x31) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 896-BGA |
| Number of I/O | MCU - 181, FPGA - 288 |
| RAM Size | 64KB |
| Speed | 925MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 925MHZ 896FBGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | 5CSEMA5F31C6N |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 270K Logic Elements |
| Series | Arria 10 SX |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 1152-FBGA, FC (35x35) |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 1152-BBGA, FCBGA |
| Number of I/O | 384 |
| RAM Size | 256KB |
| Speed | 1.5GHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | 10AS027H2F35I1HG |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Series | Versal™ AI Core |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 2197-FCBGA (45x45) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 2197-BFBGA, FCBGA |
| Number of I/O | 770 |
| RAM Size | 256KB |
| Speed | 450MHz, 1.08GHz |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| Description | IC VERSAL AICORE FPGA 2197BGA |
| Stock | In Stock |
| Shipping Method | LCL, FCL, Express |
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Model Number | XCVC1802-2LSEVSVA2197 |
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