Beijing Silk Road Enterprise Management Services Co.,LTD
| Voltage Rating | 50V |
| Capacitance | 10uF |
| Temperature Coefficient | X5R |
| Tolerance | ±10% |
| Description | 10uF ±10% 50V Ceramic Capacitor X5R 0805 |
| Replaces Part Number | AIDE CAPACITOR |
| Package | 0805 |
| Model Number | Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805X5R106K500NT for High Voltage Power Supply Circuits |
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Product Specification
| Voltage Rating | 50V | Capacitance | 10uF |
| Temperature Coefficient | X5R | Tolerance | ±10% |
| Description | 10uF ±10% 50V Ceramic Capacitor X5R 0805 | Replaces Part Number | AIDE CAPACITOR |
| Package | 0805 | Model Number | Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805X5R106K500NT for High Voltage Power Supply Circuits |
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | |
| 4. Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | |
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T (Tape/Reel), P (Bag packing) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.20 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.500.20 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1.250.20 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 1.600.30 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 0.800.20 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.250.20 | |
| Specification and Testing Method | ||
| 1. Temperature | -55~+125 | |
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) |
| 4. Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF) |
| 5. IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| 6. Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s |
| 8. Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| 9. Flexural Strength | No damage. Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11. Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| 12. Temperature Moisture Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading), X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature: 402, Humidity: 90~95%RH, time: 50024 hours. Test after place 242 hours normal temp & humidity. |
| 13. High Temperature Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading), X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test after place 48 hours under normal pressure & temperature. |
| 14. PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB. Pressing direction based on diagrams. IR measurement. |
| Embossed Plastic Taping | ||
| Code | Tape size A, B, C, D, E, F, G, H, J, T | (See Page 8 for detailed dimensions) |
| Paper Tape Reel Packing | ||
| Code | Paper size W1, L1, D, C, B, P1, P2, P0, d, t | (See Page 9 for detailed dimensions) |
| Reel Dimensions | ||
| Unit: mm | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Taping Specification | ||
| Top tape peeling strength | (a) Paper Taping: Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | |
| Packing Quantity | (See Page 11 for details per size and packing type) | |
| Precautions For Use | ||
| 1. Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |
| 2. Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |
| 3. Optimum Solder Amount for Reflow Soldering | ||
| 4. Recommended Soldering Method | (See Page 13 for details per size, temperature characteristics, rated voltage, capacitance) | RReflow Soldering, WWave Soldering |
| 10. The temperature profile for soldering | Keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>300
Ecer Certification：
Verified Supplier
Beijing Silk Road Enterprise Management Services Co.,LTD is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture. &nbs... Beijing Silk Road Enterprise Management Services Co.,LTD is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture. &nbs...
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