Beijing Silk Road Enterprise Management Services Co.,LTD
| Voltage Rating | 25V |
| Capacitance | 2.2uF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 2.2uF ±10% 25V Ceramic Capacitor X7R 0603 |
| Replaces Part Number | AIDE CAPACITOR |
| Package | 0603 |
| Model Number | Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R225K250NT featuring Au Ag Ni Sn terminals for enhanced durability |
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Product Specification
| Voltage Rating | 25V | Capacitance | 2.2uF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 2.2uF ±10% 25V Ceramic Capacitor X7R 0603 | Replaces Part Number | AIDE CAPACITOR |
| Package | 0603 | Model Number | Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R225K250NT featuring Au Ag Ni Sn terminals for enhanced durability |
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various temperature characteristics (C0G, X7R, X5R) and are constructed with ceramic dielectric, inner and outer electrodes, and nickel and tin layers for termination.
| Item | Description |
|---|---|
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V |
| 6. Terminal Composition | Au/Ag-Ni-Sn |
| 7. Packing | T (Tape/Reel), P (Bag packing) |
| Item | Description |
|---|---|
| 1 | Ceramic dielectric |
| 2 | Inner electrode |
| 3 | Outer electrode |
| 4 | Nickel layer |
| 5 | Tin layer |
| Part Number | Dimension L (mm) | Dimension W (mm) | Dimension T (mm) | WB (mm) |
|---|---|---|---|---|
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
| No. | Item | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1 | Temperature | -55~+125 | |
| 2 | Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital calliper |
| 3 | Static Capacity | Meet standard specification and tolerance |
|
| 4 | Dissipation Factor (DF) |
|
|
| 5 | IR Insulation Resistance |
| Testing condition : Rated voltage Time:605s Humidity:75% Temperature:255 Current :50mA |
| 6 | Hi-pot (DC) |
| Voltage Raising time:110S, Voltage maintaining time2S |
| 7 | Solderability | soldering area90% | Pre-heating temperature 80-120,time10-30s, lead free solder, flux Soldering temperature 2455 Solder time 20.5s |
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200,time102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature , time :242 hours. |
| 9 | Flexural strength | No damage Electro static capacity change rate C/C10% | Base boardAl2O3 /PCB PCB dimension Thickness: 1.6mm Length: 100mm Width: 40mm Flexural depth: 1mm Bend speed: 0.5mm/sec. Test it under the flexural status |
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N Duration: 101S |
| 11 | Thermal shock |
| Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours,start to testing. Run 5 cycles Thermal shock. Test it after place 242hours normal temp & humidity |
| 12 | Temperature moisture exposure |
| Temperature 402 Humidity 90~95%RH time 500+24 hours Test it after place 242hours normal temp & humidity |
| 13 | High temperature exposure |
| Temperature 1253 Time 100048 hours Charging and discharging current 50mA Max. Voltage 100VV250V 2x Rated voltage 250VV1KV 1.5x rated voltage 1KVV 1.2x rated voltage Test it after place 48hours under normal pressure & temperature |
| 14 | PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2. |
| Code | Tape size | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | T | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | T | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | T | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | T | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | T | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Code | Paper size | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Type | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | |
| 0805 | 4000 | 3000 |
| 1206 | T1.35mm: 3000 T1.35mm: 2000 | |
| 1210 | T1.60mm: 3000 T1.60mm: 2000 | |
| 1808 | 1000 | |
| 1812 | T1.85mm: 1000 T1.85mm: 800 | |
| 1812 | 500 |
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent potential issues like burn out, flaming, or glowing, it is crucial to adhere to the following precautions and application notes. For handling inquiries, please contact the engineering section or factory.
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf: R C1uf: R/W | R/W | |
| Y5V | / | C1uf: R C1uf: R/W | R/W | |
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf: R C4.7uf: R/W | R/W | |
| Y5V | / | C1uf: R C1uf: R/W | R/W | |
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf: R C10uf: R/W | R/W | |
| Y5V | / | C10uf: R C10uf: R/W | R/W | |
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method key: RReflow Soldering, WWave Soldering
During preheating, ensure the temperature difference between the soldering temperature and the surface temperature of the chips is T150.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>300
Ecer Certification：
Verified Supplier
Beijing Silk Road Enterprise Management Services Co.,LTD is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture. &nbs... Beijing Silk Road Enterprise Management Services Co.,LTD is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture. &nbs...
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