China factories

Chat Now Send Email
China factory - Shenzhen Jiaqing Circuit Co., Ltd.

Shenzhen Jiaqing Circuit Co., Ltd.

  • China,Shenzhen
  • Verified Supplier
  1. Home
  2. Products
  3. About Us
  4. Contact Us

Leave a Message

we will call you back quickly!

Submit Requirement
China High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages
China High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

  1. China High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

  1. MOQ:
  2. Price: Negotiate
  3. Get Latest Price
Payment Terms L/C,D/A,D/P,T/T
Line/Space Capability 10/10 μm to 30/30 μm (SAP/MSAP)
Glass Transition Temperature 180°C – 225°C (DSC)
Core Thickness 40 – 200 μm
Via Diameter 50 – 100 μm
Surface Finish ENIG, ENEPIG, OSP
Layer Count 2 – 12 layers
Material BT (Bismaleimide Triazine) resin
Delivery Time 15-30 Days
Brand Name Jiaqing Circuit
Certification ISO9001
Place of Origin China

View Detail Information

Inquiry by Email Get Latest Price
Chat online Now Ask for best deal
  1. Product Details
  2. Company Details

Product Specification

Payment Terms L/C,D/A,D/P,T/T Line/Space Capability 10/10 μm to 30/30 μm (SAP/MSAP)
Glass Transition Temperature 180°C – 225°C (DSC) Core Thickness 40 – 200 μm
Via Diameter 50 – 100 μm Surface Finish ENIG, ENEPIG, OSP
Layer Count 2 – 12 layers Material BT (Bismaleimide Triazine) resin
Delivery Time 15-30 Days Brand Name Jiaqing Circuit
Certification ISO9001 Place of Origin China

BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate redistributes fine-pitch die bumps (40-130 μm pitch) to the coarser BGA ball array (400-1000 μm pitch) that interfaces with the main PCB. Available in 2-12 layer configurations with core thicknesses of 40-200 μm, these substrates support FC-CSP package sizes from 3*3 mm to 19*19 mm with bump pitches down to 0.15 mm.

Key Applications
Mobile AP & Logic ICs
FC-CSP packages on BT substrates offer compact form factors (3*3 mm to 19*19 mm) with fine bump pitch (≥0.15 mm), ideal for space-constrained mobile devices.
RF Modules & Wireless Communication
BT's stable Dk (3.4-4.0) and low Df (0.004-0.010) at 1 GHz provide reliable signal integrity for RF front-end modules and wireless transceivers.
System-in-Package (SiP) Integration
Multi-chip modules benefit from BT's dimensional stability and fine-line capability, enabling high-density interconnect for complex system integration.
Automotive & Industrial Electronics
High Tg (180-225°C) and excellent moisture resistance make BT substrates suitable for automotive-grade MCUs and industrial control applications requiring extended temperature cycling.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2012

  • Total Annual:

    20000000-50000000

  • Employee Number:

    201~300

  • Ecer Certification:

    Verified Supplier

Jiaqing Circuit was founded in 2012 in Shenzhen, China. We own a 5,000 square meter manufacturing plant with a monthly PCB production capacity of 20,000 square meters, capable of manufacturing 2-48 layer PCBs. We deliver one-stop solutions including PCB design, PCB fabrication, BOM component sourcin... Jiaqing Circuit was founded in 2012 in Shenzhen, China. We own a 5,000 square meter manufacturing plant with a monthly PCB production capacity of 20,000 square meters, capable of manufacturing 2-48 layer PCBs. We deliver one-stop solutions including PCB design, PCB fabrication, BOM component sourcin...

+ Read More

Get in touch with us

  • Reach Us
  • Shenzhen Jiaqing Circuit Co., Ltd.
  • Building 1, Area A, Third Industrial Zone, Gonghe Community, Shajing Subdistrict, Bao'an District, Shenzhen
  • https://www.jqpcb.com/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement