Products
Manufacturer of a wide range of products which include Rogers PCB,Heavy Copper PCB 3oz to 20oz High Current Carrying Capacity for Power Electronic,BT PCB,etc
MOQ: 1 PCS
Price: Price Negotiable
| Surface finish | ENIG, HASL, Silver, Gold |
| Layer count | 1 to 16 layers |
| Delivery Time | 5-15 working days, rush orders available |
| Current Capacity | >100A (design dependent) |
| Frequency range | Up to 40 GHz or higher |
| Solder mask color | Green, Black, White, Blue |
| Coefficient Of Thermal Expansion (Cte) | 10 to 20 ppm/°C |
| Payment Terms | L/C, D/A, D/P, T/T |
| Dissipation factor (Df) | 0.001 to 0.005 |
| Application | Wireless communication, radar systems, satellite, aerospace, and high-speed digital circuits |
| Board thickness | 0.1 mm to 3.0 mm |
| Supply Ability | 20000 Sq.m / Month |
| Material | PTFE (Teflon), Rogers, Ceramic, or FR4 |
| Impedance control | ±5% or better |
| Thermal conductivity | 0.3 to 3.0 W/m·K |
| Packaging Details | Anti-static bag, vacuum packing with desiccant & humidity indicator card, packed in carton boxes |
| Productname | RF Microwave High-Frequency PCB |
| Dielectric constant (Dk) | 2.2 to 10.2 (depending on material) |
| Minimum tracewidth | 0.05 mm |
| Model Number | Rogers PCB |
| Certification | ISO9001 |
| Brand Name | JQPCB |
| Place of Origin | China |
MOQ:
Price: Negotiate
| Copper Weight (Outer Layers) | 3oz – 20oz (105μm – 700μm) |
| Frequency Range | 1GHz – 100GHz |
| Surface Finish | ENIG, HASL (lead-free), OSP, Immersion Tin |
| Delivery Time | 15-30 Days |
| Payment Terms | L/C,D/A,D/P,T/T |
| Material Options | Rogers (4000/3000 series), PTFE, Arlon, Nelco, Taconic |
| Current Capacity | >100A (design dependent) |
| Copper Weight (Inner Layers) | 1oz – 20oz (stackable to 200oz) |
| Brand Name | Jiaqing Circuit |
| Certification | ISO9001 |
| Place of Origin | China |
MOQ: 1 PCS
Price: Price Negotiable
| Surface Finish | ENIG, ENEPIG, OSP |
| Rohs compliance | Yes |
| Solder mask color | Green / Blue / Red / Black / White |
| Payment Terms | L/C, D/A, D/P, T/T |
| Product name | IC Substrate Board |
| Minimum spacing | 2 mil (0.05mm) |
| Board size | Customizable up to 500mm x 500mm |
| Via type | Blind, Buried, Through-hole |
| Delivery Time | 5-15 working days, rush orders available |
| Layer Count | 2 – 18 layers |
| Minimum line width | 2 mil (0.05mm) |
| Via Diameter | 50 – 100 μm |
| Operating temperature | -40°C to 150°C |
| Core Thickness | 40 – 200 μm |
| Supply Ability | 20000 Sq.m / Month |
| Material | BT Resin / FR4 / Ceramic |
| Application | IC packaging, semiconductor devices |
| Packaging Details | Anti-static bag, vacuum packing with desiccant & humidity indicator card, packed in carton boxes |
| Surface finish | ENIG / HASL / OSP |
| Model Number | BT Resin PCB IC Substrate, BGA Packaging Substrate |
| Certification | ISO9001 |
| Brand Name | JQPCB |
| Place of Origin | China |
MOQ:
Price: Negotiate
| Payment Terms | L/C,D/A,D/P,T/T |
| Delivery Time | 15-30 Days |
| Place of Origin | China |
| Certification | ISO9001 |
| Brand Name | Jiaqing Circuit |
MOQ:
Price: Negotiate
| Payment Terms | L/C,D/A,D/P,T/T |
| Line/Space Capability | 10/10 μm to 30/30 μm (SAP/MSAP) |
| Glass Transition Temperature | 180°C – 225°C (DSC) |
| Core Thickness | 40 – 200 μm |
| Via Diameter | 50 – 100 μm |
| Surface Finish | ENIG, ENEPIG, OSP |
| Layer Count | 2 – 12 layers |
| Material | BT (Bismaleimide Triazine) resin |
| Delivery Time | 15-30 Days |
| Brand Name | Jiaqing Circuit |
| Certification | ISO9001 |
| Place of Origin | China |
MOQ:
Price: Negotiate
| Glass Transition Temperature | 180°C – 225°C (DSC) |
| Via Diameter | 50 – 100 μm |
| Line/Space Capability | 10/10 μm to 30/30 μm (SAP/MSAP) |
| Surface Finish | ENIG, ENEPIG, OSP |
| Delivery Time | 15-30 Days |
| Layer Count | 2 – 12 layers |
| Material | BT (Bismaleimide Triazine) resin |
| Payment Terms | L/C,D/A,D/P,T/T |
| Core Thickness | 40 – 200 μm |
| Place of Origin | China |
| Brand Name | Jiaqing Circuit |
| Certification | ISO9001 |
MOQ:
Price: Negotiate
| Core Thickness | 40 – 200 μm |
| Glass Transition Temperature | 180°C – 225°C (DSC) |
| Layer Count | 2 – 12 layers |
| Payment Terms | L/C,D/A,D/P,T/T |
| Via Diameter | 50 – 100 μm |
| Surface Finish | ENIG, ENEPIG, OSP |
| Material | BT (Bismaleimide Triazine) resin |
| Delivery Time | 15-30 Days |
| Line/Space Capability | 10/10 μm to 30/30 μm (SAP/MSAP) |
| Place of Origin | China |
| Certification | ISO9001 |
| Brand Name | Jiaqing Circuit |
MOQ:
Price: Negotiate
| Payment Terms | L/C,D/A,D/P,T/T |
| Line/Space Capability | 10/10 μm to 30/30 μm (SAP/MSAP) |
| Delivery Time | 15-30 Days |
| Glass Transition Temperature | 180°C – 225°C (DSC) |
| Layer Count | 2 – 12 layers |
| Via Diameter | 50 – 100 μm |
| Surface Finish | ENIG, ENEPIG, OSP |
| Core Thickness | 40 – 200 μm |
| Material | BT (Bismaleimide Triazine) resin |
| Brand Name | Jiaqing Circuit |
| Place of Origin | China |
| Certification | ISO9001 |
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