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Shenzhen Jiaqing Circuit Co., Ltd.

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IC Substrate Board

Manufacturer of a wide range of products which include Rogers PCB,Heavy Copper PCB 3oz to 20oz High Current Carrying Capacity for Power Electronic,BT PCB,etc

Quality Rogers PCB for sale

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Rogers PCB

  1. MOQ: 1 PCS

  2. Price: Price Negotiable

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Surface finish ENIG, HASL, Silver, Gold
Layer count 1 to 16 layers
Delivery Time 5-15 working days, rush orders available
Current Capacity >100A (design dependent)
Frequency range Up to 40 GHz or higher
Solder mask color Green, Black, White, Blue
Coefficient Of Thermal Expansion (Cte) 10 to 20 ppm/°C
Payment Terms L/C, D/A, D/P, T/T
Dissipation factor (Df) 0.001 to 0.005
Application Wireless communication, radar systems, satellite, aerospace, and high-speed digital circuits
Board thickness 0.1 mm to 3.0 mm
Supply Ability 20000 Sq.m / Month
Material PTFE (Teflon), Rogers, Ceramic, or FR4
Impedance control ±5% or better
Thermal conductivity 0.3 to 3.0 W/m·K
Packaging Details Anti-static bag, vacuum packing with desiccant & humidity indicator card, packed in carton boxes
Productname RF Microwave High-Frequency PCB
Dielectric constant (Dk) 2.2 to 10.2 (depending on material)
Minimum tracewidth 0.05 mm
Model Number Rogers PCB
Certification ISO9001
Brand Name JQPCB
Place of Origin China

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Quality Heavy Copper PCB 3oz to 20oz High Current Carrying Capacity for Power Electronic for sale

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Heavy Copper PCB 3oz to 20oz High Current Carrying Capacity for Power Electronic

  1. MOQ:

  2. Price: Negotiate

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Copper Weight (Outer Layers) 3oz – 20oz (105μm – 700μm)
Frequency Range 1GHz – 100GHz
Surface Finish ENIG, HASL (lead-free), OSP, Immersion Tin
Delivery Time 15-30 Days
Payment Terms L/C,D/A,D/P,T/T
Material Options Rogers (4000/3000 series), PTFE, Arlon, Nelco, Taconic
Current Capacity >100A (design dependent)
Copper Weight (Inner Layers) 1oz – 20oz (stackable to 200oz)
Brand Name Jiaqing Circuit
Certification ISO9001
Place of Origin China

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Quality BT PCB for sale

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BT PCB

  1. MOQ: 1 PCS

  2. Price: Price Negotiable

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Surface Finish ENIG, ENEPIG, OSP
Rohs compliance Yes
Solder mask color Green / Blue / Red / Black / White
Payment Terms L/C, D/A, D/P, T/T
Product name IC Substrate Board
Minimum spacing 2 mil (0.05mm)
Board size Customizable up to 500mm x 500mm
Via type Blind, Buried, Through-hole
Delivery Time 5-15 working days, rush orders available
Layer Count 2 – 18 layers
Minimum line width 2 mil (0.05mm)
Via Diameter 50 – 100 μm
Operating temperature -40°C to 150°C
Core Thickness 40 – 200 μm
Supply Ability 20000 Sq.m / Month
Material BT Resin / FR4 / Ceramic
Application IC packaging, semiconductor devices
Packaging Details Anti-static bag, vacuum packing with desiccant & humidity indicator card, packed in carton boxes
Surface finish ENIG / HASL / OSP
Model Number BT Resin PCB IC Substrate, BGA Packaging Substrate
Certification ISO9001
Brand Name JQPCB
Place of Origin China

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Quality High Tg Low CTE BT IC Substrate For Memory And Mobile AP Packages Thermal Stability for sale

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High Tg Low CTE BT IC Substrate For Memory And Mobile AP Packages Thermal Stability

  1. MOQ:

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Payment Terms L/C,D/A,D/P,T/T
Delivery Time 15-30 Days
Place of Origin China
Certification ISO9001
Brand Name Jiaqing Circuit

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Quality High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages for sale

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High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

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Payment Terms L/C,D/A,D/P,T/T
Line/Space Capability 10/10 μm to 30/30 μm (SAP/MSAP)
Glass Transition Temperature 180°C – 225°C (DSC)
Core Thickness 40 – 200 μm
Via Diameter 50 – 100 μm
Surface Finish ENIG, ENEPIG, OSP
Layer Count 2 – 12 layers
Material BT (Bismaleimide Triazine) resin
Delivery Time 15-30 Days
Brand Name Jiaqing Circuit
Certification ISO9001
Place of Origin China

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Quality High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications for sale

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High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications

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Glass Transition Temperature 180°C – 225°C (DSC)
Via Diameter 50 – 100 μm
Line/Space Capability 10/10 μm to 30/30 μm (SAP/MSAP)
Surface Finish ENIG, ENEPIG, OSP
Delivery Time 15-30 Days
Layer Count 2 – 12 layers
Material BT (Bismaleimide Triazine) resin
Payment Terms L/C,D/A,D/P,T/T
Core Thickness 40 – 200 μm
Place of Origin China
Brand Name Jiaqing Circuit
Certification ISO9001

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Quality High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications for sale

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High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications

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Core Thickness 40 – 200 μm
Glass Transition Temperature 180°C – 225°C (DSC)
Layer Count 2 – 12 layers
Payment Terms L/C,D/A,D/P,T/T
Via Diameter 50 – 100 μm
Surface Finish ENIG, ENEPIG, OSP
Material BT (Bismaleimide Triazine) resin
Delivery Time 15-30 Days
Line/Space Capability 10/10 μm to 30/30 μm (SAP/MSAP)
Place of Origin China
Certification ISO9001
Brand Name Jiaqing Circuit

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Quality High Density Coreless ETS BT IC Substrate for Ultra-Thin FC-CSP and SiP for sale

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High Density Coreless ETS BT IC Substrate for Ultra-Thin FC-CSP and SiP

  1. MOQ:

  2. Price: Negotiate

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Payment Terms L/C,D/A,D/P,T/T
Line/Space Capability 10/10 μm to 30/30 μm (SAP/MSAP)
Delivery Time 15-30 Days
Glass Transition Temperature 180°C – 225°C (DSC)
Layer Count 2 – 12 layers
Via Diameter 50 – 100 μm
Surface Finish ENIG, ENEPIG, OSP
Core Thickness 40 – 200 μm
Material BT (Bismaleimide Triazine) resin
Brand Name Jiaqing Circuit
Place of Origin China
Certification ISO9001

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Get in touch with us

  • Reach Us
  • Shenzhen Jiaqing Circuit Co., Ltd.
  • Building 1, Area A, Third Industrial Zone, Gonghe Community, Shajing Subdistrict, Bao'an District, Shenzhen
  • https://www.jqpcb.com/

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