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{"title":"Black Oil 4 Layer HDI Multilayer PCB Board With HASL \/ OSP \/ ENIG Surface","imgUrl":"https:\/\/img.chinax.com\/nimg\/28\/c5\/5d3f320a416192a3c96256c2d032-200x200-1\/black_oil_4_layer_hdi_multilayer_pcb_board_with_hasl_2f_osp_2f_enig_surface.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROHS, CE","Place of Origin":"China"}}
{"title":"4 Layer HDI Rigid Flex PCB Soft And Hard Combination PCB Board Multi Level","imgUrl":"https:\/\/img.chinax.com\/nimg\/4d\/04\/90c0ca32b416b85a8afc3b41b3f8-200x200-1\/4_layer_hdi_rigid_flex_pcb_soft_and_hard_combination_pcb_board_multi_level_design.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROSE, CE","Place of Origin":"China"}}
{"title":"4 Layer High Density Interconnect PCB HDI Flexible PCB Miniaturization Design","imgUrl":"https:\/\/img.chinax.com\/nimg\/01\/2e\/8f57840653885ab8b79a21811e7e-200x200-1\/4_layer_high_density_interconnect_pcb_hdi_flexible_pcb_miniaturization_design.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROHS, CE","Place of Origin":"China"}}
HDI PCB (High-Density Interconnect Printed Circuit Board) is a PCB that achieves higher circuit density by using thinner lines, smaller apertures and denser wiring design. This PCB technology can achieve more circuit connections in a limited space by adopting more advanced manufacturing processes and design technologies, and is widely used in mobile phones, tablets, computers, equipment, automobiles, electronics and other medical fields.
Microvia technology: One of the key technologies of HDI PCB is microvia technology, which uses laser or mechanical drilling to create tiny holes (gener less than 0.2mm) on the circuit board, and these microvias are used to achieve connections between layers.
Multilayer wiring: HDI PCBs typically employ a multilayer design, connecting different circuit layers through blind and buried vias. Interconnection each layer is achieved through microvias, blind vias, or buried vias, which enhances the density and integration of the circuit board.
Blind and buried via design: Blind vias are holes that connect only the outer and inner layers, while buried vias are holes that connect the inner layers. The use of these holes can further reduce the volume of the circuit board and increase the wiring density.
Surface treatment and assembly: The surface treatment of HDI PCBs requires higher precision and reliability. Common surface treatments include gold plating, silver pl, OSP (Organic Metal Surface Treatment), etc. In addition, the assembly process of HDI PCBs usually requires fine welding technology to ensure the close connection between and the circuit board.
High-precision process: In the manufacturing process of HDI PCB, high-precision etching technology is required to ensure the correct manufacturing of fine lines precision holes. At the same time, it is necessary to precisely control variables such as current density, temperature, and pressure to ensure the consistency and high performance of the.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Trading Company
Year Established:
1995
Total Annual:
84,094,800-84,094,800
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of...
