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Dongguan Xingqiang Circuit Board Technology Co., Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier
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China 1.2mm Thinkness 4 Layer PCB FR4 Printed Circuit Board Multi Layer Design
China 1.2mm Thinkness 4 Layer PCB FR4 Printed Circuit Board Multi Layer Design

  1. China 1.2mm Thinkness 4 Layer PCB FR4 Printed Circuit Board Multi Layer Design

1.2mm Thinkness 4 Layer PCB FR4 Printed Circuit Board Multi Layer Design

  1. MOQ: 5 square meters
  2. Price: NA
  3. Get Latest Price
Payment Terms ,T/T,Western Union
Supply Ability 3000㎡
Delivery Time 12-15 work days
Min. Solder Mask Clearance 0.1mm
Pcba Standard IPC-A-610E
Aspect Ratio 20:1
Board Thinkness 1.2mm
Minimum Line Space 3mil (0.075mm)
Surface Finishing HASL/OSP/ENIG
Materila FR4
Product Print Circuit Board
Brand Name xingqiang
Model Number Varies by goods condition
Certification ROHS, CE
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms ,T/T,Western Union Supply Ability 3000㎡
Delivery Time 12-15 work days Min. Solder Mask Clearance 0.1mm
Pcba Standard IPC-A-610E Aspect Ratio 20:1
Board Thinkness 1.2mm Minimum Line Space 3mil (0.075mm)
Surface Finishing HASL/OSP/ENIG Materila FR4
Product Print Circuit Board Brand Name xingqiang
Model Number Varies by goods condition Certification ROHS, CE
Place of Origin China
High Light 1.2mm Thinkness FR4 Printed Circuit BoardMulti Layer Design FR4 PCB

FR4 4-layer PCB

 

Advantages of Multilayer PCB:

  • Increase circuit board density
  • Reduce size
  • Better signal integrity
  • Adapt to high-frequency applications
  • better thermal management
  • Higher reliability

product Features:

  • Multi-layer design
  • Inner layer and outer layer
  •  through hole
  • Copper layer
  • Dielectric layer (dielectric material)

Manufacturing process:

  • Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
  • Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
  • Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
  •  Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).

 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company

  • Year Established:

    1995

  • Total Annual:

    84,094,800-84,094,800

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of...

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Get in touch with us

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  • Dongguan Xingqiang Circuit Board Technology Co., Ltd.
  • Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
  • https://www.multilayer-pcbs.com/

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