Dongguan Xingqiang Circuit Board Technology Co., Ltd.
| Payment Terms | ,T/T,Western Union |
| Supply Ability | 3000 |
| Delivery Time | 7-10 work days |
| Min. Hole Size | 0.1mm |
| Standard | IPC Class3 |
| Impedance Control | Yes |
| Solder Mask | Green/Red/Black/Blue/White |
| Through-Hole Capability | Yes |
| Board Thickness | 0.2mm~5.0mm |
| Surface Finish | HASL, ENIG, OSP |
| Surface Mount Capability | Yes |
| Surface Treatment | HASL Lead Free |
| Copper Thickness | 1-4 oz |
| Max Board Size | 528 mm x 600 mm |
| Type | SMT Assembly |
| Brand Name | xingqiang |
| Model Number | Varies by goods condition |
| Certification | ROHS, CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | ,T/T,Western Union | Supply Ability | 3000 |
| Delivery Time | 7-10 work days | Min. Hole Size | 0.1mm |
| Standard | IPC Class3 | Impedance Control | Yes |
| Solder Mask | Green/Red/Black/Blue/White | Through-Hole Capability | Yes |
| Board Thickness | 0.2mm~5.0mm | Surface Finish | HASL, ENIG, OSP |
| Surface Mount Capability | Yes | Surface Treatment | HASL Lead Free |
| Copper Thickness | 1-4 oz | Max Board Size | 528 mm x 600 mm |
| Type | SMT Assembly | Brand Name | xingqiang |
| Model Number | Varies by goods condition | Certification | ROHS, CE |
| Place of Origin | China | ||
| High Light | OSP Process Automotive PCB Board ，Automotive PCB Board Double Sided ，IPC Class 3 Standard Automotive PCB | ||
Double-sided OSP process
Organic protective film: The OSP layer, typically 0.1-0.3μm thick, adheres tightly to the copper surface, providing oxidation resistance without compromising the original flatness of the copper.
Double-sided application: Uniformly applied to both sides of the board, ensuring consistent protection and solderability across all exposed copper pads and traces.
Process compatibility: Works well with standard PCB substrates (such as FR-4) and integrates seamlessly into conventional manufacturing workflows, with no negative impact on solder mask materials (e.g., red, blue, or green inks).
Excellent solderability retention: The organic film is easily removed during soldering, allowing for good wetting of the copper surface by solder, reducing the risk of cold solder joints and ensuring reliable connections, even for fine-pitch components.
Cost-effectiveness: Compared to gold immersion or hot air solder leveling (HASL), the OSP process is simpler, requires fewer production steps, and has lower material costs, making it ideal for cost-sensitive applications.
Environmental friendliness: Uses non-toxic organic compounds, avoiding heavy metals (like lead or gold) in large quantities, and generates less hazardous waste, aligning with modern environmental regulations.
Thin and flat surface: The ultra-thin OSP layer does not significantly alter the board’s thickness or surface flatness, making it suitable for high-density circuit designs and applications where dimensional precision is critical.
Company Details
Business Type:
Manufacturer,Trading Company
Year Established:
1995
Total Annual:
84,094,800-84,094,800
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of...
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