Gold Finger Masking Polyimide Tape (PCB Wave Solder Tape / PI Solder Masking

Product Specification

1. Product Overview

Nomay Gold Finger Masking Polyimide Tape is a single-sided silicone adhesive tape for protecting PCB gold fingers, edge connectors, plated contacts and designated no-solder areas during selected soldering processes.

Common names include gold finger masking tape, PCB wave solder tape, PI solder masking tape and edge connector masking tape.

The amber translucent PI backing assists placement along contact edges and masking boundaries. Rolls, pre-cut strips, pull-tab parts and custom die-cut masks support different PCB geometries and production methods.

Low-static versions are available on request where unwinding or removal near sensitive components requires controlled static generation.

2. Product Construction

Backing Material: Amber or golden translucent polyimide film
Adhesive: Silicone pressure-sensitive adhesive
Adhesive Side: Single-sided
Color: Brown / Amber
Formats: Slit rolls, pre-cut strips, liner-backed rolls, pull-tab parts and custom die-cut masks

Finished tape thickness consists of the PI backing and adhesive layer. A removable release liner is excluded unless specifically stated.

Backing thickness, adhesive coating, tape width and converted shape must be matched to the PCB surface, masking boundary and removal method.

3. Key Features and Buyer Benefits

Gold-Finger and Contact Protection
The selected tape forms a temporary barrier over contacts and no-solder areas during a validated soldering process, helping limit unwanted solder and flux contact.

Heat-Resistant Masking
PI film and silicone adhesive can be selected for the required preheat and soldering profile. Performance depends on the complete tape construction and exposure conditions.

Visual Placement
The translucent amber film can help operators check contact edges, position and overlap where the covered features remain visible.

Adhesion and Removal Balance
The adhesive must hold the masking boundary during processing while allowing acceptable removal afterward. The highest peel strength is not automatically the best choice.

Pre-Cut and Die-Cut Formats
Repeatable strips and shaped masks can reduce manual cutting and support consistent placement. Pull-tab features can assist removal when correctly positioned.

Low-Static Options
Separately selected low-static constructions can help reduce charging during unwinding or removal. Confirm the required voltage limits and test conditions.

4. Available Specifications

Thickness: Nomay's stated range for matching PI/silicone constructions is 0.012–0.1 mm, with thicker constructions available on request. Confirm whether the value refers to PI backing thickness or finished tape thickness.

Backing Thickness: Selected according to finished thickness, flexibility, masking geometry and handling requirements. Confirm backing and adhesive thicknesses together.

Width: 0.1–1040 mm across matching constructions, subject to converting requirements. The actual masking width must provide suitable coverage and edge contact around the protected area. Narrow slit widths require tolerance and winding confirmation.

Finished Roll Length: Customized according to thickness, width and winding requirements.

Pre-Cut Length: Matched to PCB contact dimensions, masking boundary and handling requirements.

Master Roll Length: Approximately 3000 m, 1000 m or 600 m, matched to the selected thickness and construction.

Color: Brown / Amber.

Peel Adhesion: Nomay's stated range is 10–1000 g. Confirm the force-unit convention, specimen width and peel-test conditions before using this range as an acceptance specification.

Temperature Resistance: 260–300°C across selected matching silicone constructions. The applicable model, actual tape exposure, dwell time and complete soldering profile require confirmation. This is not a continuous service rating or blanket approval for direct molten-solder contact.

Low-Static Performance: Specified separately by maximum unwind or removal voltage and agreed test conditions. Standard masking tape is not automatically low-static.

Dimensions, thermal performance, adhesion and any low-static requirement must be confirmed together for the selected construction.

5. Soldering Process Selection

Wave Soldering
Confirm preheating, flux type, solder-pot temperature, board travel speed, contact duration and the orientation of the masked area.

Selective Soldering
Confirm nozzle path, local heat exposure, adjacent components, masking clearances and whether the tape will contact solder directly.

Dip Soldering
Confirm immersion geometry, exposure duration, edge contact and the complete heating and removal cycle. Suitability must be established on the actual board.

Reflow or Repeated Heating
Evaluate separately when the masked PCB passes through a reflow oven or multiple heat cycles. Wave-solder suitability alone does not validate another thermal profile.

Solder-pot temperature and actual tape temperature are not necessarily identical. Provide both process settings and measured board or tape temperatures where available.

6. Application Procedure

Step 1: Identify the gold fingers, plated contacts and no-solder areas requiring protection.

Step 2: Define the masking boundary, placement tolerance and any areas that must remain exposed.

Step 3: Select the tape construction against the PCB finish, flux, thermal profile, adhesion and removal requirements.

Step 4: Specify low-static performance if the assembly contains sensitive components and the process requires controlled charging.

Step 5: Clean and dry the PCB surface using a method compatible with the board and contact finish.

Step 6: Align the tape and apply uniform pressure across the masking area, especially along the edges. Avoid wrinkles, bubbles, gaps and lifted edges.

Step 7: Position any pull tab outside the required sealed boundary and away from solder contact, moving equipment and nearby components.

Step 8: Run the board through the agreed soldering and cooling process.

Step 9: Remove at the validated temperature, angle and speed. Inspect for solder penetration, flux contamination, adhesive residue, tape fragments and surface damage.

Step 10: Complete a trial through the entire process before mass production.

7. Application Industries

• PCB assembly and electronics manufacturing services

• Wave and selective soldering operations

• Automotive electronic control units

• Battery-management and power-control boards

• Inverters and charging modules

• Industrial control electronics

• Electronic component assembly

• Precision die-cut converting

The tape's suitability is determined by the board and soldering process, rather than the industry name alone.

8. Application Scenarios

PCB Gold-Finger Masking
For temporary protection of connector contacts during board assembly. Confirm contact finish, protected dimensions and the acceptable surface condition after removal.

Edge-Connector Protection
For masking contact areas while nearby joints are soldered. Match width, placement tolerance and edge contact to the PCB geometry.

No-Solder-Area Masking
For designated flat areas that must remain free of unwanted solder. Openings or complex shapes may require die-cut masks, plugs or other process-specific protection; flat tape is not automatically suitable for every geometry.

Low-Static Masking
For selected processes where unwinding or peeling occurs near static-sensitive components. Verify charging behavior through the actual process, including removal after heating.

Repeat-Production PCB Masks
Pre-cut strips and die-cut shapes can support fixed board layouts. Confirm pull-tab design, liner release, dispensing direction and placement method.

9. Performance and Operating Conditions

Masking Edge Integrity
Adhesive contact around the protected area must remain adequate throughout processing. Surface contamination, insufficient pressure, wrinkles or lifting can allow solder or flux ingress.

Temperature
Confirm the applicable temperature and duration for the selected model. A film that survives heating does not necessarily maintain adequate adhesion, masking performance or clean removal.

Peel Adhesion
Specify the PCB or contact surface, specimen width, peel angle, test speed, dwell time and conditioning. Do not interpret the stated g range as g/25 mm or convert it to N/25 mm without an agreed basis.

Removal and Residue
Clean removal is a process-dependent selection target. Specify allowable residue and surface changes, and validate against the actual contact finish after soldering.

Flux and Chemical Compatibility
Evaluate the selected tape against the actual flux, cleaning agents and process materials. Confirm silicone compatibility where subsequent coating or bonding is involved.

Electrical Contact Condition
Where required, assess connector contact performance after masking and removal, including any effects of remaining contamination. Appearance alone may not establish acceptable contact performance.

10. Low-Static and Custom Options

Low-Static Construction
Specify maximum acceptable unwind and removal voltage, humidity, temperature, conditioning, speed, measurement arrangement and actual bonding surface.

Surface resistance is a different measurement and cannot replace unwind or removal-voltage testing.

Combined Thermal and Low-Static Requirements
Confirm both properties on the same finished construction. Changes to adhesive, backing, liner or converting format may require revalidation.

Pull Tabs and Die-Cut Shapes
Custom strips, frames and shaped masks can be evaluated against the board drawing. A pull-tab feature must not compromise the masking boundary.

Additional Testing
Application-specific testing or certification can be arranged according to the agreed standard, model and delivery requirements.

11. Comparison and Selection Guide

Gold Finger Masking PI vs. General Amber PI
Gold finger masking describes the application; amber describes the appearance. Constructions may overlap, but soldering profile, contact protection and removal criteria determine the appropriate model.

Standard vs. Low-Static Masking Tape
Choose according to the assembly's defined static-control requirements. Standard tape must not be assumed to provide verified low-static performance.

Rolls vs. Pre-Cut Parts
Rolls suit changing dimensions and flexible manual use. Pre-cut strips or die-cut parts suit repeat layouts and controlled placement.

Masking Tape vs. Broader ESD Protection
Low-static masking tape can address charging associated with the tape operation. It does not replace the complete ESD-control process.

12. Send Your Application Requirements

For model selection, sample evaluation and quotation, please provide:

• PCB application and soldering method

• PCB substrate, solder-mask surface and contact finish

• Gold-finger dimensions and masking boundary

• Preheat profile, solder-pot temperature and actual board or tape temperature where available

• Dwell or contact time, heating cycles and cooling conditions

• Flux and cleaning materials

• Backing thickness, finished tape thickness and tolerances

• Width and finished-roll, master-roll or pre-cut length

• Roll, liner-backed, pull-tab or die-cut format

• Peel adhesion and test method

• Removal temperature, angle, speed and allowable residue

• Standard or low-static requirement

• Maximum unwind or removal voltage and test conditions, if applicable

• Drawing, placement tolerance and packaging requirements

• Order quantity and destination country

• Any required testing or certification standard

Nomay will confirm the suitable construction, process parameters, sample requirements, minimum order quantity and quotation. Required testing or certification will be scoped to the agreed model and standard, with completion requirements confirmed before order acceptance.