Double-Sided Polyimide Tape (Double-Coated PI Tape / High-Temperature PI Bonding

Product Specification

1. Product Overview

Nomay Double-Sided Polyimide Tape combines a PI film carrier with pressure-sensitive adhesive on both sides. Common names include double-coated PI tape, high-temperature double-sided tape and PI bonding tape.

The product family supports selected FPCB mounting, insulation attachment, component fixation, heat-resistant film splicing and custom die-cut mounting applications.

Selected silicone adhesive constructions can be evaluated for silicone-foam and silicone-rubber bonding. Silicone and acrylic versions require separate selection according to both bonding surfaces, temperature, load and service life.

2. Product Construction

Carrier: Polyimide film
Side A: Silicone or acrylic pressure-sensitive adhesive, as specified
Side B: Silicone or acrylic pressure-sensitive adhesive, as specified
Adhesive Side: Double-sided
Release Format: Single-liner roll or separately protected double-liner construction
Appearance: Typically amber, subject to the selected carrier and construction
Supply Formats: Liner-backed rolls, adhesive sheets, strips, pads, frames and custom die-cut parts

Total tape thickness = Side A adhesive + PI carrier + Side B adhesive.

Removable release liners are excluded from total tape thickness. Liner thickness and the overall supplied thickness must be stated separately where needed for converting or equipment setup.

3. Key Features and Buyer Benefits

Two-Surface Bonding
Adhesive on both sides allows a component or insulation material to be attached to a second surface.

Thin Carrier-Supported Construction
The PI carrier supports handling and dimensional control during suitable mounting and converting operations.

Heat-Resistant Assembly
Selected constructions can be evaluated for elevated-temperature processes. The complete adhesive joint must meet the required temperature, duration and load.

A/B-Side Adhesion Options
Different adhesion levels can be evaluated where the two surfaces or removal requirements differ. A/B-side designation does not automatically mean two different adhesive chemistries.

Silicone-Foam Bonding Options
Selected silicone adhesive versions can be evaluated against the customer's actual foam formulation and surface condition.

Precision Converting
Liner-backed rolls can be converted into repeatable mounting shapes with defined orientation and placement features.

4. Adhesive and Surface Selection

Silicone Adhesive
Evaluate selected silicone constructions for compatible thermal mounting, temporary fixation or silicone-material bonding. Confirm adhesion to both surfaces rather than assuming that silicone adhesive bonds equally well to all silicone foams.

Acrylic Adhesive
Evaluate selected acrylic constructions for permanent mounting, insulation attachment and applications requiring different adhesive chemistry. Holding performance and heat resistance depend on the selected formulation.

A/B-Side Design
Specify which side contacts each material. Different coating weights or adhesive grades may be needed to balance attachment, release and processing requirements.

Silicone-Sensitive Processes
Acrylic adhesive alone does not establish that the complete tape is silicone-free. Confirm release coatings, liners and converting conditions when contamination restrictions apply.

5. Reference Specifications and Customization

The following are industry reference constructions, not confirmed Nomay stock specifications. Final availability and performance must be confirmed for the selected model.

Double-Sided Silicone Reference Constructions:

• Approximately 0.025 mm PI carrier with 0.038 mm silicone adhesive on each side

• Approximately 0.102 mm total tape thickness, excluding liner

• A thicker reference uses approximately 0.051 mm PI with the same adhesive thickness on each side, giving approximately 0.127 mm total thickness

• Published comparison constructions list temperature capability up to 260°C, subject to application conditions

Double-Sided Acrylic Reference Construction:

• Approximately 0.025 mm PI carrier with 0.038 mm acrylic adhesive on each side

• Approximately 0.102 mm total tape thickness, excluding liner

• A published comparison construction lists temperature capability up to 155°C

These dimensions are rounded metric conversions. Confirm nominal dimensions and tolerances on the final specification.

Width: Custom slit widths according to carrier availability, adhesive construction, liner and winding requirements.

Roll Length: Approximately 33 m is an industry reference for the cited constructions. Nomay finished-roll and master-roll lengths require separate confirmation.

Peel Adhesion: Specify Side A and Side B separately using the actual bonding surfaces and agreed test method.

Release Liner: Confirm material, thickness, release treatment, release force and single- or double-liner arrangement.

Do not apply ordinary single-sided PI thickness, peel adhesion, temperature or master-roll ranges to this double-sided product.

6. Application Industries

• FPC and FPCB assembly

• Electronic component assembly

• Battery and energy-storage assembly

• Flexible-heater manufacturing

• Automotive electronics and sensors

• Silicone foam and gasket converting

• Heat-resistant film and web processing

• Precision die-cut converting

Suitability depends on the complete bonded assembly and operating conditions.

7. Application Scenarios

FPCB Mounting
For attaching flexible circuits or selected parts to fixtures or compatible components. Confirm temporary versus permanent use, bending, temperature, holding force and removal requirements. This tape is not automatically a substitute for FPC coverlay or structural stiffener adhesive.

Silicone-Foam and Gasket Attachment
For selected silicone foam, rubber or gasket materials after validation of adhesion, surface treatment, compression and recovery forces. The tape attaches the gasket; it does not by itself establish the gasket's sealing performance.

Battery Insulation Attachment
For securing selected dielectric films or protective parts in battery assemblies. Confirm voltage, edge protection, adhesive aging and mechanical stresses. It is not an internal battery separator or a thermal-runaway barrier.

Flexible-Heater Mounting
For selected heater or insulation attachment tasks. Evaluate holding strength during thermal cycling and the effect of the tape on heat transfer. Ordinary PI bonding tape is not automatically thermally conductive.

Heat-Resistant Film Splicing
For suitable overlap joints between compatible films. Confirm web speed, tension, temperature, overlap length and the thickness step through rollers or processing equipment.

Custom Die-Cut Mounting Parts
For pads, frames, rings and other adhesive shapes supplied to the customer's drawing. Specify Side A/Side B orientation, liner handling and placement sequence.

8. Application Procedure

Step 1: Identify both bonding materials, surface finishes and the required joint function.

Step 2: Specify temperature, load direction, bonded area, service life and temporary or permanent use.

Step 3: Confirm carrier thickness, both adhesive layers, total tape thickness and liner construction.

Step 4: Clean and dry both surfaces using methods compatible with the materials.

Step 5: Apply the first side with uniform pressure. Remove the liner at the correct assembly stage, align the second component and apply the specified pressure.

Step 6: Allow the adhesive-specific dwell time before loading or processing, as confirmed during selection.

Step 7: Test the complete joint under the intended thermal, mechanical, chemical and environmental conditions.

Step 8: If removal is required, inspect both bonded surfaces for residue, adhesive transfer or damage.

9. Performance and Operating Conditions

Temperature Under Load
A tape may tolerate a brief thermal exposure yet fail to hold a loaded component at that temperature. Specify continuous temperature, peak temperature, duration, load and allowable movement.

Peel Adhesion
Measure or specify Side A and Side B separately where surfaces or coatings differ. Include substrate, specimen width, angle, speed, dwell time and conditioning.

Shear and Holding Power
Mounting and splicing require evaluation of creep or movement under load. Peel strength alone does not establish holding performance. Confirm load direction, bonded area, test temperature and duration.

Foam Recovery
Compressed foam can apply a sustained separating force to the joint. Assess bonding after compression, recovery and aging using the actual foam.

Removal and Residue
Double-sided tape contacts two surfaces. Validate removal behavior on both, particularly after heating or long dwell periods.

Electrical Performance
Confirm dielectric requirements for the complete tape and assembled insulation design. Carrier-film data alone is insufficient.

10. Custom Options

A/B Adhesion
Different adhesion levels can be evaluated on request. Identify the intended permanent side, removable side or preferred assembly sequence.

Liner Configuration
Single- or double-liner formats can be selected for roll processing, staged assembly or die cutting. Confirm release behavior on each adhesive side.

Die-Cut Features
Custom tabs, frames and placement features can be evaluated for easier handling and repeatable positioning.

Special Requirements
Flame-performance, low-outgassing or ESD requirements can be evaluated where relevant to the application. These require separate construction selection and applicable test data.

11. Comparison and Selection Guide

Single-Sided vs. Double-Sided PI
Choose single-sided tape when one adhesive surface and an exposed PI backing are required. Choose double-sided tape when two surfaces need to be bonded through a PI carrier.

Same vs. Different A/B Adhesion
Select according to the two substrates and required bond behavior. Different sides must be identified consistently on drawings and packaging.

Silicone vs. Acrylic
Compare actual surface compatibility, temperature, holding performance and contamination requirements.

PI-Carrier Tape vs. Transfer Adhesive
PI tape includes a carrier that affects thickness and flexibility. Carrier-free transfer adhesive is a different construction and must be assessed separately.

Temporary Fixation vs. Permanent Mounting
Temporary use requires controlled removal; permanent use requires aging and load-bearing assessment. One model is not automatically suitable for both.

12. Send Your Application Requirements

For selection, sample evaluation and quotation, please provide:

• Application and temporary or permanent bonding requirement

• Side A and Side B materials and surface finishes

• Adhesive preference and required adhesion on each side

• Continuous temperature, peak temperature and exposure time

• Heating cycles and expected service life

• Load, load direction, bonded area and allowable movement

• Carrier thickness, total tape thickness and tolerances

• Width and finished-roll or master-roll length

• Single- or double-liner requirements

• Roll, adhesive-sheet or die-cut format

• Foam grade, compression and recovery conditions, if applicable

• Web tension and speed for splicing applications

• Removal, residue and contamination requirements

• Electrical-insulation requirements

• Drawing, orientation, placement tolerance and packaging

• Order quantity and destination country

• Any required testing or certification standard

Nomay will confirm the appropriate construction, technical specification, sample requirements, minimum order quantity and quotation. Required testing or certification can be arranged according to the agreed model, standard and completion requirements.