ESD Polyimide Tape (Anti-Static PI Tape / Low-Static PI Tape) – Single-Sided

Product Specification

1. Product Overview

Nomay ESD Polyimide Tape is a single-sided PI film tape for masking and protection in static-sensitive electronic assembly. Common product names include anti-static PI tape and low-static polyimide tape.

This page focuses on the silicone adhesive construction. Low-static and static-dissipative versions are selected according to the customer's process and required ESD test results. These functions are not automatically present together in every version.

Low-static performance concerns charge generation during operations such as unwinding and removal. Static-dissipative performance concerns controlled charge movement through or across the specified material. A resistance measurement alone does not establish low unwind or removal voltage.

2. Product Construction

Backing: Polyimide film with an ESD treatment or surface coating selected for the required function
Adhesive: Silicone pressure-sensitive adhesive
Adhesive Side: Single-sided
Base Color: Brown / Amber
Formats: Self-wound rolls, slit rolls, liner-backed rolls and custom die-cut parts

The position and type of ESD treatment depend on the selected construction. Performance on the backing surface must not be assumed to apply to the adhesive surface.

Finished tape thickness includes the PI film, adhesive and any additional coating. A removable release liner is excluded unless specifically stated.

Black versions require separate construction and performance confirmation. Black color alone does not demonstrate ESD performance.

3. Base Material and Adhesive Selection

Polyimide Film
The PI backing supports heat-resistant masking and thin protective constructions. Surface treatment, coating and film thickness must be selected together with the ESD requirement.

Silicone Adhesive
Silicone adhesive is suitable for evaluation in temporary solder masking and other selected thermal processes. Adhesion, removal behavior and contamination compatibility depend on the complete construction and process.

Alternative Adhesive
A low-static acrylic version can be evaluated separately when a different adhesive chemistry is required. Standard acrylic adhesive is not automatically low-static. A non-silicone adhesive also does not establish that the liner, coating and converting process are silicone-free.

4. Specification and Customization Range

The following base-construction ranges apply only where the ESD version retains the matching PI film and silicone adhesive structure. They are not guaranteed ESD specifications for every finished version.

Thickness: Base-construction range of 0.012–0.1 mm; thicker constructions can be evaluated on request. Confirm whether the requested value refers to PI backing thickness or finished tape thickness, including any ESD coating.

Backing Thickness: Selected to match finished thickness, flexibility, electrical requirements and the ESD treatment.

Width: Base-construction range of 0.1–1040 mm. ESD-version availability, coating uniformity, slit tolerance and winding suitability require confirmation, especially for narrow widths.

Finished Roll Length: Matched to thickness, width, winding requirements and the selected ESD construction.

Master Roll Length: Approximately 3000 m, 1000 m or 600 m for matching base constructions. The applicable length must be confirmed after selecting the ESD treatment and thickness.

Color: Brown / Amber; other colors require separate confirmation.

Peel Adhesion: Base-construction range of 10–1000 g, using Nomay's stated unit. Final ESD-version adhesion, force-unit convention, specimen width and test conditions must be confirmed.

Temperature Resistance: The matching PI/silicone base family has a stated range of 260–300°C. The finished ESD version requires separate confirmation of exposure time, adhesion, removal behavior and ESD performance during or after heating, as applicable. Continuous service temperature must be specified separately.

Supply Format: Slit rolls, liner-backed rolls or die-cut parts according to the confirmed construction.

5. ESD Performance Selection

Low-Static Version
Specify the maximum acceptable voltage during unwinding, liner removal, application or peeling from the actual substrate. Include tape width, operating speed, measurement arrangement, conditioning, temperature and relative humidity.

Static-Dissipative Version
Specify the required resistance or charge-decay criterion, the surface being tested and the test method. Identify backing-side, adhesive-side, surface-to-surface or resistance-to-ground requirements as applicable.

Surface resistance and surface resistivity are different measurements. Report the measured quantity, unit and electrode arrangement explicitly.

If charge dissipation relies on a path to ground, confirm that path in the actual assembly. A dissipative surface does not automatically provide an effective grounding connection through the adhesive.

If both low charging and static dissipation are required, verify both. Do not apply one unverified resistance range to the entire product family.

6. Key Features and Buyer Benefits

• PI backing for selected heat-resistant masking processes

• Low-static options for processes sensitive to unwind or removal charging

• Static-dissipative options matched to specified electrical measurements

• Single-sided adhesive construction for direct placement

• Custom widths and converted shapes

• Liner-backed options for die cutting and controlled placement

The selected version must meet the agreed ESD, thermal, adhesion and cleanliness requirements together.

7. Application Procedure

Step 1: Identify the static-sensitive component and the operation that creates the ESD concern.

Step 2: Define low-charging, resistance or charge-decay acceptance criteria.

Step 3: Confirm the bonding substrate, adhesive compatibility and contamination limits.

Step 4: Select backing thickness, finished thickness, width, roll length and converting format.

Step 5: Apply to a clean, dry surface with uniform pressure, avoiding stretching, wrinkles and lifted edges.

Step 6: Validate unwinding, liner removal, placement, heating and final peeling under representative process conditions.

Step 7: Verify ESD performance after any thermal exposure or converting operation that could change the coating or surface properties.

8. Application Industries and Scenarios

PCB and EMS Assembly
For selected solder-masking operations around gold fingers, edge connectors and no-solder areas on static-sensitive assemblies. Confirm edge sealing, temperature profile and removal charging.

FPC Assembly
For temporary fixation and localized protection of flexible circuits. Confirm flexibility, dimensional requirements, adhesion and removal behavior on the actual circuit surface.

Semiconductor Back-End Assembly
For selected external masking or protection operations after confirming particles, ionic contamination, outgassing, silicone-transfer and residue requirements. Suitability for wafer processing, dicing or die attachment is not established by the ESD designation.

Camera and Sensor Modules
For localized protection or positioning where static generation matters. Evaluate cleanliness, component sensitivity and adhesive compatibility; the tape is not automatically optical-grade or light-blocking.

BMS and Power-Electronics Assembly
For selected temporary masking and protection of control boards and electronic components. Confirm electrical clearances and the location of any dissipative surface. ESD performance does not establish high-voltage insulation or thermal-runaway protection.

Custom Die-Cut Parts
For masking and protection shapes supplied on a suitable liner. Confirm drawing tolerances, liner-release behavior, placement method and ESD performance after converting.

9. Thermal, Adhesion and Electrical Performance

Temperature and ESD Retention
PI backing survival at temperature does not prove that the adhesive and ESD treatment retain their required performance. Confirm the complete temperature profile and whether ESD measurements are required during heating, after cooling or both.

Peel Adhesion
Specify substrate, specimen width, peel angle, speed, dwell time and conditioning. Do not interpret the stated g range as g/25 mm or convert it to N/25 mm without an agreed test basis.

Removal and Residue
Removal behavior depends on the adhesive, surface, pressure, temperature, dwell time and peeling conditions. Residue-free removal is not guaranteed for every process.

Electrical Insulation
A dissipative coating can affect the electrical behavior of the finished tape. Where insulation is also required, verify the relevant breakdown-voltage, leakage and clearance requirements separately.

Cleanliness
Define acceptable particles, residue, ionic contamination, outgassing and silicone transfer where these affect the process. The ESD designation alone does not establish cleanroom or semiconductor-process suitability.

10. Comparison and Selection Guide

Choose Low-Static PI Tape when the priority is limiting charge generated during unwinding, liner removal or peeling.

Choose Static-Dissipative PI Tape when a specified surface must provide controlled charge movement under an agreed resistance or decay test.

Specify Both Functions when the process requires both low charging and controlled dissipation.

Choose Standard PI Tape when masking or insulation is required without a defined ESD-performance requirement.

Evaluate a Separate Acrylic or Non-Silicone Version when the process requires different adhesive chemistry or contamination control.

Choose by measured performance and process compatibility, rather than color or the words “anti-static” alone.

11. Important Selection Notes

• Ordinary PI tape is not automatically ESD-safe.

• Low charging, resistance and charge decay are separate performance indicators.

• Tested backing-side performance does not establish adhesive-side performance.

• Changes to thickness, coating, liner, slitting or heating may require revalidation.

• Base-construction ranges do not guarantee every finished ESD version.

• Tape selection must fit the customer's wider ESD-control process.

• Complete application testing before mass production.

12. Send Your Application Requirements

For selection, sample evaluation and quotation, please provide:

• Application and static-sensitive component

• Bonding substrate and surface condition

• Low-static, static-dissipative or combined requirement

• Maximum unwind, liner-removal or peel voltage, if applicable

• Required resistance or charge-decay criterion

• Tested surface, test method and measurement arrangement

• Temperature, relative humidity, conditioning and operating speeds

• Adhesive and contamination requirements

• Continuous temperature, peak process temperature and exposure time

• Backing thickness, finished thickness and tolerances

• Width and finished-roll or master-roll length

• Liner or die-cut drawing requirements

• Peel adhesion, residue and electrical-insulation requirements

• Order quantity and destination country

• Required testing or certification standard

Nomay will confirm the suitable construction, technical specification, sample requirements, minimum order quantity and quotation. Required testing or certification can be arranged according to the agreed standard and product scope, with completion requirements confirmed before order acceptance.