Ultra-Thin Polyimide Tape (Thin PI Tape / Low-Profile Insulation Tape) – Thin PI

Product Specification

1. Product Overview

Nomay Ultra-Thin Polyimide Tape is a single-sided adhesive tape combining thin polyimide film with silicone or selected acrylic pressure-sensitive adhesive. Common purchasing terms include thin PI film tape, low-profile insulation tape and precision masking tape.

The product focuses on reducing material build-up in compact electronic assemblies while providing suitable masking, electrical separation and handling performance. Applications include PCB and FPC masking, selected battery-tab insulation and precision die-cut parts.

Select the backing and adhesive together: a thin backing alone does not establish a thin finished tape.

2. Product Construction

Backing: Thin polyimide film.
Adhesive: Silicone pressure-sensitive adhesive or acrylic pressure-sensitive adhesive for selected constructions.
Adhesive side: Single-sided.
Typical color: Amber.
Formats: Self-wound rolls, liner-backed rolls, narrow strips, sheets and custom die-cut parts.

For preliminary selection, nominal backing thicknesses around 12.5–25 μm may be considered, subject to film grade and model confirmation. The exact nominal thickness and tolerance must be stated in the supplied specification.

Finished tape thickness equals backing thickness plus adhesive thickness, excluding any removable release liner. A tape made with 12.5 μm film is not automatically a 12.5 μm finished adhesive tape.

3. Thickness and Dimensional Selection

Specify both the desired backing thickness and the maximum permitted finished tape thickness.

Thinner backing can improve flexibility and reduce build-up. A thicker backing within the selected range can offer easier handling and greater mechanical robustness, depending on the film grade.

Adhesive thickness affects surface contact, edge behavior and finished assembly height. Reducing adhesive coating too far may compromise bonding to textured or uneven surfaces.

Available slit widths, roll lengths and dimensional tolerances depend on the selected construction and converting method. Provide the required dimensions rather than assuming that every thickness is available in every roll size.

For die-cut parts, include feature sizes, corner radii, tolerances, liner requirements and placement method.

4. Key Features and Buyer Benefits

Low Assembly Build-Up
A controlled backing and adhesive combination helps fit insulation or masking into assemblies with limited thickness allowance.

Flexible Conformability
Thin PI film can follow suitable contours and small steps with less bending stiffness than a thicker backing of the same grade.

Precision Masking
Narrow strips and drawing-based shapes support localized protection around PCB and FPC features. Masking accuracy also depends on cutting tolerances, placement and adhesive edge behavior.

Compact Electrical Insulation
The film provides a thin electrical-separation layer for suitable electronic components. Finished-tape electrical performance must match the assembly requirements.

Custom Die Cutting
Liner-backed constructions support small strips, discs, frames and insulation parts for repeatable application.

Application-Specific Versions
Low-static, black light-blocking and silicone-controlled constructions may be requested, subject to specification and model confirmation. These are optional requirements rather than standard properties of every ultra-thin tape.

5. Silicone and Acrylic Adhesive Options

Silicone adhesive grades may be selected for heat-exposed masking and other suitable insulation applications. Confirm adhesion, heating conditions and removal behavior for the chosen model.

Acrylic adhesive grades may suit insulation attachment or selected temporary masking processes. Acrylic chemistry alone does not establish higher adhesion, permanent bonding or a particular temperature limit.

Where downstream coating or bonding is sensitive to silicone transfer, specify the contamination requirement. An acrylic adhesive does not automatically establish that the liner, converting process and complete finished roll meet that requirement.

Select the adhesive using the actual substrate, temperature profile, dwell time and intended removal or service conditions.

6. Temperature and Process Performance

Temperature performance belongs to the complete tape construction, not the bare PI film alone.

Selected silicone constructions may be evaluated for short masking processes up to 260°C. The exact model, exposure time, heating cycles, substrate and removal conditions must be confirmed before this becomes an order specification.

Acrylic constructions require their own temperature assessment. Do not transfer silicone-grade limits to acrylic versions.

Short-term masking performance does not establish a continuous operating temperature or insulation thermal class. For tape remaining in an assembly, evaluate adhesion, creep and electrical performance after the required aging conditions.

7. Application Industries and Scenarios

PCB and EMS Manufacturing
For localized masking where excessive tape thickness can interfere with access or placement. Validate edge lifting, process exposure and removal near sensitive features.

FPC and Flexible Electronics
For selected protection and low-profile insulation around flexible circuits and connectors. Repeated-bending applications require testing at the actual bend radius and cycle count.

Battery-Tab Insulation
For selected tab coverage and electrical separation where limited thickness is important. Assess sharp edges, burrs, puncture risk, voltage and any electrolyte exposure within the battery design.

Compact Electronic Assemblies
For insulation strips and protective parts in space-limited components, display assemblies and camera modules. Optical or low-static requirements require a suitable optional construction.

Precision Converting
For narrow slit rolls and custom die-cut shapes used in manual or automated placement. Small features require evaluation of cutting quality, liner release and handling strength.

8. Application Procedure

Clean and dry the substrate using a method compatible with the component. Remove oil, dust and other contamination.

Handle thin material carefully to avoid creases, stretched edges and tearing. A suitable release liner or application carrier may help with small or delicate parts.

Apply with uniform pressure and avoid excessive tension. Check for wrinkles, trapped air and lifted edges.

Run a sample through the complete production cycle, including heating, cooling and chemical exposure where relevant.

For temporary masking, remove at the agreed temperature, angle and speed. Inspect the tape and substrate for tearing, residue, staining or surface damage.

9. Electrical, Mechanical and Adhesion Validation

Electrical Performance
Confirm finished-tape breakdown performance under a defined method and conditioning. A breakdown-voltage result does not directly establish the permissible working voltage of an assembly.

Mechanical Performance
Evaluate puncture, tearing and edge damage where the tape contacts tabs, corners or rough surfaces. Lower thickness can reduce handling and puncture resistance compared with a thicker backing of the same material.

Adhesion and Holding
Specify peel adhesion with substrate, specimen width, peel angle, speed and dwell time. Permanent attachment also requires holding and creep assessment.

Masking and Removal
Evaluate adhesion after heating, edge lift and residue on the actual surface. Thin construction alone does not guarantee clean removal or precise masking edges.

Dimensional Stability
Confirm shrinkage, curl and part dimensions after the actual process. These can affect alignment in tightly spaced assemblies.

10. Comparison and Selection Guide

Thinner and Thicker PI Backings
Choose a thinner backing when flexibility and low build-up are priorities. Choose a thicker backing when handling strength and mechanical protection require greater emphasis.

Ultra-Thin and General Single-Sided PI Tape
Compare finished tape thickness, not product names alone. General-purpose tape may be preferable when the assembly permits additional thickness and requires more mechanical robustness.

Adhesive Tape and Pure PI Film
Choose adhesive tape for direct attachment. Choose uncoated film when the insulation is mechanically retained or incorporated through another bonding process.

Self-Wound Rolls and Liner-Backed Parts
Rolls suit variable-length masking. Liner-backed parts support delicate shapes, repeatable geometry and controlled placement.

11. Handling, Storage and Special Requirements

Keep material protected in its original packaging in a clean, dry environment. Follow the storage conditions and shelf life confirmed for the selected model.

Protect exposed adhesive and cut edges from contamination. Confirm liner release force when parts will be dispensed automatically.

State any ESD, light-blocking, low-outgassing, flame-retardant or silicone-control requirement before selection. Relevant custom versions require agreed performance criteria and supporting model information.

12. Request Samples and a Quotation

Please provide:

• Application and bonding substrate.
• Temporary masking or permanent insulation.
• Preferred silicone or acrylic adhesive.
• Required PI backing thickness.
• Maximum finished tape thickness and tolerance.
• Peak temperature, exposure time and heating cycles.
• Continuous service temperature, where applicable.
• Width, roll length or die-cut drawing.
• Minimum feature size and placement method.
• Peel adhesion, holding or removal requirements.
• Electrical, puncture and repeated-bending requirements.
• Low-static, light-blocking or contamination requirements.
• Liner and packaging requirements.
• Quantity and destination country.

Nomay will confirm the appropriate model, construction, technical parameters, sample arrangement, minimum order quantity and quotation.