Non-Silicone Polyimide Tape (Silicone-Free Adhesive PI Tape / Acrylic PI

Product Specification

1. Product Overview

Nomay Non-Silicone Polyimide Tape is a single-sided tape combining polyimide film with an acrylic pressure-sensitive adhesive or another specified non-silicone adhesive system. Common purchasing terms include silicone-free adhesive PI tape, acrylic PI insulation tape and low-contamination masking tape.

Its main purpose is to reduce silicone-transfer risk in processes where surface contamination can affect coating, printing, adhesive bonding or electronic assembly. The polyimide backing also provides electrical separation and dimensional stability during suitable thermal processes.

Available constructions are selected for temporary masking, insulation attachment or custom die-cut components. Adhesion, removal behavior and temperature capability depend on the selected adhesive grade.

2. Product Construction

Backing: Polyimide film.
Adhesive: Acrylic pressure-sensitive adhesive or another specified non-silicone formulation.
Adhesive side: Single-sided.
Color: Amber; black constructions may be requested.
Formats: Slit rolls, sheets, strips and custom die-cut parts.
Release format: Self-wound or liner-backed, subject to construction confirmation.

Finished tape thickness means the combined backing and adhesive thickness, excluding any removable release liner. Backing thickness and adhesive coating thickness must be specified separately when they affect fit, flexibility or insulation performance.

For silicone-sensitive applications, the construction review also covers release treatments, liners, cores, converting materials and packaging.

3. What Non-Silicone Means

A non-silicone adhesive formulation helps reduce a potential source of silicone transfer. It does not automatically establish that every component of the finished roll meets a particular contamination limit.

Silicone refers to a family of polymeric materials; silicon is a chemical element. A total-silicon measurement alone does not identify the source or prove the presence of transferable silicone.

Specify whether the requirement concerns:

• No intentionally added silicone in the adhesive.
• No intentionally added silicone throughout the agreed product construction.
• Limits for specified siloxanes or other extractable silicone-related substances.
• Surface transfer after tape application, heating and removal.
• A customer-defined elemental silicon limit.

For analytical limits, identify the target substance, sampling procedure, extraction conditions, measurement method, reporting units and detection limit.

4. Specifications and Custom Sizes

Backing thickness, finished tape thickness and adhesive coating weight are selected together according to the application. Nomay will confirm the available construction and tolerances before sampling or quotation.

A 33 m roll length can be used as an initial reference for this product category. Other lengths, slit widths, sheets and die-cut dimensions are subject to model and converting confirmation.

Peel adhesion must be specified with the substrate, specimen width, peel angle, test speed, dwell time and conditioning. Initial adhesion and adhesion after heating may differ substantially.

For precision parts, provide the drawing, dimensional tolerances, liner requirements and delivery format. Narrow slitting and small die-cut features must be evaluated against film thickness, adhesive behavior and handling requirements.

5. Key Features and Buyer Benefits

Reduced Silicone-Transfer Risk
A specified non-silicone adhesive helps protect downstream coating, printing and bonding operations from an avoidable source of silicone transfer.

Heat-Resistant Process Protection
The polyimide backing supports dimensional stability during elevated-temperature processing. Dedicated adhesive grades can be evaluated for high-temperature masking.

Electrical Insulation
The film provides an insulating barrier for selected electronic components and assemblies. Finished-tape dielectric performance depends on the complete construction and thickness.

Controlled Adhesion and Removal
Adhesive selection can prioritize temporary masking or longer-term attachment. Removal behavior is evaluated after the actual dwell time and process exposure.

Custom Converting
Rolls, strips and liner-backed die-cut parts support repeatable positioning and reduce manual trimming during assembly.

Application-Specific Options
Low-static, low-outgassing, low-VOC and black light-blocking constructions may be requested, subject to specification and model confirmation. These are separate performance requirements, not automatic properties of every non-silicone tape.

6. Temperature and Process Selection

Select the complete tape against the actual heating profile, including peak temperature, exposure time, heating cycles, substrate and removal conditions.

General insulation grades and dedicated solder-masking grades can have different temperature limits even when both use acrylic adhesive. A general-purpose acrylic temperature range must not be treated as the maximum capability of every non-silicone construction.

For processes approaching 260°C, request evaluation of a dedicated high-temperature masking grade. Nomay must confirm the specific construction and exposure conditions before this temperature is included in an order specification.

Short-term masking performance does not establish a continuous operating temperature or an electrical insulation thermal class. Bare-film temperature capability must not be used as the finished tape rating.

7. Application Industries and Scenarios

PCB and FPC Processing
Selected grades can be evaluated for solder masking and temporary protection of areas that will subsequently be bonded or conformally coated. Confirm the soldering profile, edge lifting, removal behavior and surface cleanliness.

Semiconductor Packaging
Suitable constructions may be evaluated for selected packaging and component-protection operations. Define particle, ionic contamination, outgassing and static-control requirements where relevant.

Optical Coating and Display Assembly
The tape can be considered for masking or protecting surfaces associated with coating and bonding operations. Evaluate surface transfer, coating adhesion and optical cleanliness after removal. Vacuum processes require separate outgassing assessment.

Battery and Electronics Assembly
Selected constructions can provide insulation strips, process-protection parts and component attachment. Confirm dielectric requirements, temperature, chemical exposure and whether the tape remains in the assembly.

Motor and Coil Insulation
Suitable adhesive grades may be evaluated for insulation attachment or wrapping. Oil, refrigerant and solvent compatibility must be checked using the actual fluid and service conditions.

Precision Die-Cut Components
Liner-backed parts can support repeatable placement in electronics and industrial assemblies. Specify the dimensions, release behavior, cleanliness and packaging requirements.

8. Application Procedure

Prepare a clean, dry substrate using a cleaning method compatible with the assembly.

Apply the tape with uniform pressure. Avoid excessive stretching, trapped air, wrinkles and contaminated edges.

Allow the agreed dwell time before processing. Check adhesion on rough surfaces, low-surface-energy materials and tightly curved features.

Run a sample through the complete production cycle, including heating, cooling and chemical exposure where applicable.

For temporary masking, remove the tape at the agreed temperature, angle and speed. Inspect the surface for residue, staining, edge marks and damage.

Where coating or bonding follows removal, include that downstream operation in the trial. Visual cleanliness alone may not establish process compatibility.

9. Performance Validation

Silicone Transfer and Cleanliness
Assess the agreed substances or surface-transfer criteria on the selected finished construction. Include the liner and converting process when they fall within the customer's requirement.

Adhesion and Holding
Measure peel adhesion under defined conditions. For permanent attachment or loaded assemblies, also evaluate shear holding, creep and thermal aging.

Low-Static Performance
When requested, assess unwind and removal charge as well as relevant resistance measurements. Non-silicone chemistry alone does not establish ESD performance.

Low Outgassing and Low VOC
Specify the relevant test conditions and acceptance limits. A non-silicone adhesive is not automatically suitable for vacuum or low-emission applications.

Electrical and Chemical Performance
Confirm dielectric performance and compatibility with actual solvents, oils, refrigerants or process chemicals. Results for the backing alone do not establish the performance of the complete tape.

10. Comparison and Selection Guide

Non-Silicone PI Tape and Silicone Adhesive PI Tape
Choose according to contamination requirements, heating profile, adhesion and removal behavior. Dedicated non-silicone grades may support high-temperature masking; silicone adhesive grades may suit processes that permit their chemistry.

Non-Silicone PI Tape and General Acrylic PI Tape
Both may use acrylic adhesive. The distinction is the defined silicone-control requirement and the scope of construction, handling and testing needed for the application.

Temporary Masking and Permanent Insulation
Temporary masking prioritizes process hold and acceptable removal. Permanent insulation also requires evaluation of aging, creep, electrical performance and long-term adhesion.

Standard and Low-Static Constructions
Request a low-static version when charge generated during unwinding or removal presents a process concern.

Rolls and Die-Cut Parts
Choose rolls for flexible masking lengths and wrapping. Choose die-cut parts for repeated geometry, controlled placement and assembly efficiency.

11. Handling and Storage

Keep the tape in its original packaging in a clean, dry environment, away from direct sunlight and contamination sources. Follow the storage conditions and shelf life confirmed for the selected model.

For silicone-sensitive work, use agreed handling materials and keep exposed adhesive and cut edges protected. Confirm whether dedicated packaging, liners or converting controls are required.

Store and handle samples under the same conditions intended for production material so that trial results remain relevant.

12. Request Samples and a Quotation

Please provide:

• Application and bonding substrate.
• Temporary masking or permanent attachment.
• Silicone-control scope and acceptance criteria.
• Peak and continuous temperatures, exposure time and heating cycles.
• Required backing thickness and finished tape thickness.
• Width, roll length or die-cut drawing.
• Adhesion, removal and residue requirements.
• Low-static, light-blocking, low-VOC or outgassing requirements.
• Electrical and chemical exposure requirements.
• Liner, cleanliness and packaging requirements.
• Trial quantity, production quantity and destination country.

Nomay will review the requirements, confirm a suitable construction and provide sample and quotation details for production validation.