ONESEINE TECHNOLOGY CO.,LTD
| Packaging Details | Vacuun bag |
| Delivery Time | 5-8 working days |
| Payment Terms | T/T,Western Union |
| Supply Ability | 1000000000pcs/mon |
| Product | COB Immersion Gold Aluminum PCB Board |
| Attributes | Aluminum,COB,Immersion Gold,Ultra High |
| Pcb Surface Finishing | ENIG |
| Cu Thickness | 2/0oz |
| Legend | PSR-4000 |
| Board Color | green solder mask, white silk screen |
| Pcb Thickness | 0.2mm-4mm |
| Thermal conductivity | 1.0-8.0 W/mK |
| Place of Origin | Shenzhen,China |
| Brand Name | ONESEINE |
| Certification | ISO9001,ISO14001 |
| Model Number | ONE-102 |
View Detail Information
Explore similar products
Double Sided Copper Core MCPCB 2oz for LED Lighting
2 Layer Aluminum Core PCB Board 1.6mm with Copper Foil
IPC Class2 Quick Turn Metal Core PCB Board for LED Street Lights
1oz Single Sided Aluminum MCPCB Board for LED Tube Lights
Product Specification
| Packaging Details | Vacuun bag | Delivery Time | 5-8 working days |
| Payment Terms | T/T,Western Union | Supply Ability | 1000000000pcs/mon |
| Product | COB Immersion Gold Aluminum PCB Board | Attributes | Aluminum,COB,Immersion Gold,Ultra High |
| Pcb Surface Finishing | ENIG | Cu Thickness | 2/0oz |
| Legend | PSR-4000 | Board Color | green solder mask, white silk screen |
| Pcb Thickness | 0.2mm-4mm | Thermal conductivity | 1.0-8.0 W/mK |
| Place of Origin | Shenzhen,China | Brand Name | ONESEINE |
| Certification | ISO9001,ISO14001 | Model Number | ONE-102 |
| High Light | COB led mcpcb board ，ODM led mcpcb board ，ODM blank mcpcb | ||
COB Immersion Gold Aluminum PCB Board For Ultra High Thermal Conductivity Product
PCB parameter:
Material:high thermal conductivity aluminum pcb substrate
Brand:Oneseine
Thickness:2mm
Copper:2OZ
Certificate:ULE354470/ISO/SGS/IATF16949
Soldermask:White
Thermal conductivity coefficient:2.0w/m.k
Surface finish:Immersion gold
E-Test:100%
Next-Generation Metal Core PCB Technology: Pushing Thermal and Electrical Boundaries
Material Innovations Redefining Performance
Beyond conventional metals, engineered composites now dominate high-stress applications:
Carbon-Nanotube Reinforced Aluminum boosts thermal conductivity to 350 W/mK while reducing CTE to 8 ppm/°C (NASA JPL 2023)
Vapor-Chamber Embedded Cores utilize phase-change fluids to achieve effective thermal conductivities >800 W/mK in 5G mmWave arrays
Anisotropic Graphite Foils laminated between copper layers provide in-plane σ=1700 W/mK for EV battery management systems
Additive-Manufactured Microchannel Cores enable active liquid cooling with 0.05°C/W thermal resistance at 2kW dissipation
Revolutionized Manufacturing Paradigms
Industry 4.0 technologies transform production:
AI-Driven Thermal Simulation
Neural networks optimize core thickness within ±0.02mm tolerance using real-time CFD feedback
Predictive void detection during lamination reduces scrap rates to <0.3%
Atomic Layer Deposition (ALD)
50nm Al₂O₃ dielectric coatings withstand 300V/μm fields
Conformal nanocoatings enable 0.1mm bend radii in flexible hybrids
Magnetic Field-Assisted Bonding
Aligns ceramic fillers in dielectric layers, boosting thermal conductivity 40%
Eliminates traditional adhesives reducing thermal impedance
Thermal-Electrical Co-Design Breakthroughs
Advanced modeling reveals counterintuitive relationships:
Negative CTE Alloys (e.g., ZrW₂O₈) enable zero-thermal-warp designs for space-grade PCBs
Fractal Via Arrays improve heat spreading efficiency by 65% versus grid patterns
Gradient Core Architectures transition from 3mm copper (power section) to 0.8mm aluminum (periphery) in single boards
Topological Insulator Interfaces reduce electron-phonon scattering losses at semiconductor junctions
Extreme Environment Validation
New testing protocols address emerging challenges:
Hypersonic Thermal Shock: 10s cycles between -196°C (LN₂) and 650°C (MIL-STD-810H Method 520.6)
Orbital Particle Radiation: 100kGy gamma exposure testing per ESCC 22900
Multi-Physics Corrosion: Combined thermal cycling (85°C↔125°C) with 95% RH salt fog (ASTM G85 Annex A5)
Electrodynamic Vibration: 100Grms random profiles simulating rocket launch (NASA GEVS-7000)
Quantum Leap Applications
Fusion Reactor Diagnostics: Tungsten-copper cores withstand 1000°C plasma-facing loads
Cryogenic Qubit Control: Ultra-low CTE molybdenum boards (0.3 ppm/K @ 4K)
Hypersonic Radomes: Transparent aluminum oxynitride RF windows with embedded thermal pipes
Neural Implants: Biocompatible niobium cores with PEEK dielectric coatings
Economic and Sustainability Impact
Additive Manufacturing reduces material waste from 40% to <3%
Digital Twins cut prototype iterations by 80%
Recyclable Metal Matrix cores achieve 98% reusability rate
AI-Optimized Thickness saves 15,000 tons copper/year industry-wide
Company Details
Business Type:
Manufacturer
Year Established:
2013
Total Annual:
1000000-5000000
Employee Number:
100~200
Ecer Certification：
Verified Supplier
ONESEINE TECHNOLOGY CO., LTD., a prominent manufacturer of printed circuit boards (PCBs) established in 2013 , specializes in the production of High-Frequency PCBs, Multilayer PCBs (1-24 layers), FR-4 PCBs, and Rigid-Flexible PCBs. Our comprehensive services encompass quick-turn prototyping, Rogers+... ONESEINE TECHNOLOGY CO., LTD., a prominent manufacturer of printed circuit boards (PCBs) established in 2013 , specializes in the production of High-Frequency PCBs, Multilayer PCBs (1-24 layers), FR-4 PCBs, and Rigid-Flexible PCBs. Our comprehensive services encompass quick-turn prototyping, Rogers+...
Get in touch with us
Leave a Message, we will call you back quickly!