Studio Technology Co., Ltd.
| Delivery Time | 5-25 working days(varies by product) |
| Packaging Details | ESD Protective Packaging |
| Payment Terms | T/T |
| Supply Ability | 100,000 pieces/month |
| Place of Origin | China |
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Product Specification
| Delivery Time | 5-25 working days(varies by product) | Packaging Details | ESD Protective Packaging |
| Payment Terms | T/T | Supply Ability | 100,000 pieces/month |
| Place of Origin | China | ||
| High Light | advanced turnkey pcba ，smt turnkey pcba | ||
Modern electronics design pushes the limits of manufacturing capability. High-density interconnects, micro-BGA packages, fine-pitch components, and complex mixed-technology boards require precision placement and advanced inspection that standard SMT lines cannot provide. At Studio, we specialize in these demanding assemblies. Our Advanced SMT Turnkey PCBA with BGA & Fine-Pitch Support delivers precision manufacturing for the most complex PCB designs.
Our advanced SMT capability is powered by 12 fully automated SMT production lines equipped with high-precision placement machines. We support 01005 components, micro-BGA (0.3mm pitch), QFN, LGA, and fine-pitch devices with exceptional accuracy. Automated wave soldering, programmable robotic soldering, and comprehensive inspection equipment—AOI, SPI, 3D X-Ray, ICT, FCT, flying probe testers, and an accredited reliability laboratory—ensure every board meets the highest quality standards.
| Component Type | Capability | Application |
|---|---|---|
| 01005 Components | Ultra-small passives (0.4mm × 0.2mm) | Miniaturized designs, wearables, mobile devices |
| Micro-BGA | 0.3mm pitch and below | High-density ICs, processors, memory |
| BGA (Ball Grid Array) | Full X-Ray inspection for hidden joints | Processors, FPGAs, ASIC |
| QFN (Quad Flat No-Lead) | Precision placement and thermal pad soldering | Power ICs, RF modules, sensors |
| LGA (Land Grid Array) | Surface mount with array of pads | Processors, high-density modules |
| Fine-Pitch QFP | 0.4mm/0.5mm lead pitch | Controllers, interface ICs |
| CSP (Chip Scale Package) | Near-die-size packaging | Memory, sensors, compact ICs |
| 0201 Components | Standard small passives | General high-density designs |
| Soldering Process | Application | Key Feature |
|---|---|---|
| Automated Reflow Soldering | SMT components with optimized thermal profiles | Multi-zone ovens with precise temperature control |
| Automated Wave Soldering | Through-hole components on mixed-technology boards | Programmable profiles, lead-free and leaded options |
| Selective Soldering | Through-hole components on SMT-dense boards | Precision nozzle positioning, minimal thermal stress |
| Robotic Soldering | Complex assemblies, component-level rework | Programmable, consistent, high-precision joints |
| Vapor Phase Reflow | Sensitive or complex assemblies | Even heating, oxygen-free environment |
Advanced SMT components require advanced inspection methods:
| Inspection Method | Purpose | Why It Matters |
|---|---|---|
| SPI (Solder Paste Inspection) | 3D measurement of paste volume, height, area | Prevents insufficient or excessive solder paste |
| AOI (Automated Optical Inspection) | Visual inspection of placement and joints | Identifies misalignment, polarity, and bridging |
| 3D X-Ray Inspection | Hidden-joint inspection for BGA, QFN, LGA | Detects voids, head-in-pillow, and insufficient wetting |
| ICT (In-Circuit Test) | Component-level electrical validation | Confirms each component is correctly connected |
| Flying Probe Test | Fixture-less electrical testing | Cost-effective for complex, high-mix boards |
| FCT (Functional Circuit Test) | Power-on verification of board function | Confirms board operates as designed |
Complex, high-density designs require a manufacturing partner with advanced SMT capability and precision quality systems. With Studio's Advanced SMT Turnkey PCBA with BGA & Fine-Pitch Support, you get the precision, inspection capability, and engineering expertise to bring your most demanding designs to life. Contact us today to discuss your advanced SMT project requirements.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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