Studio Technology Co., Ltd.
| Delivery Time | 5-25 working days(varies by product) |
| Packaging Details | ESD Protective Packaging |
| Payment Terms | T/T |
| Supply Ability | 100,000 pieces per month |
| Place of Origin | China |
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Product Specification
| Delivery Time | 5-25 working days(varies by product) | Packaging Details | ESD Protective Packaging |
| Payment Terms | T/T | Supply Ability | 100,000 pieces per month |
| Place of Origin | China | ||
| High Light | tested turnkey pcba ，fct validation turnkey pcba | ||
Quality verification is not an afterthought—it is an integral part of the manufacturing process. The most advanced assembly capability is meaningless without the inspection and testing systems to verify every board's performance and reliability. At Studio, we treat testing as a first-class capability. Our Tested Turnkey PCBA with In-House X-Ray & FCT Validation delivers fully verified boards backed by comprehensive in-house testing capabilities.
Our testing infrastructure is comprehensive: AOI, SPI, 3D X-Ray, ICT, flying probe testers, FCT, and an accredited reliability laboratory. All testing is performed in-house, by the same team that assembled your boards, ensuring immediate feedback, rapid issue resolution, and complete accountability. 12 fully automated SMT production lines feed into our inspection and testing systems, creating an integrated quality verification ecosystem.
| Equipment | Purpose | Why It Matters |
|---|---|---|
| SPI (Solder Paste Inspection) | 3D measurement of paste volume, height, area | Prevents printing defects before reflow |
| AOI (Automated Optical Inspection) | Visual inspection of placement and solder joints | Identifies misalignment, bridging, and polarity errors |
| 3D X-Ray Inspection | Volumetric inspection of BGA, QFN, LGA, and hidden joints | Detects voids, head-in-pillow, and insufficient wetting |
| ICT (In-Circuit Tester) | Component-level electrical validation with bed-of-nails fixture | Confirms each component's electrical performance |
| Flying Probe Tester | Fixture-less electrical testing for prototypes and high-mix | Cost-effective, flexible electrical testing |
| FCT (Functional Circuit Test) | Power-on testing simulating real-world operation | Confirms board works as designed in actual conditions |
| Test Level | What Is Verified | Equipment |
|---|---|---|
| Incoming Component | Component authenticity, spec compliance | LCR tester, visual inspection |
| Pre-Reflow | Solder paste volume, height, area | SPI (3D) |
| Post-Reflow | Component placement, solder joint quality | AOI, 3D X-Ray |
| Electrical | Component-level connectivity and values | ICT / Flying Probe |
| Functional | Full board performance under simulated operation | FCT |
| Environmental | Reliability under thermal, humidity, vibration stress | Reliability Laboratory |
For products requiring qualification in extreme environments, our reliability laboratory provides:
| Environmental Test | Test Condition Range |
|---|---|
| Thermal Cycling | -65°C to +150°C, controlled ramp rates |
| Thermal Shock | Extreme temperature transitions, rapid changes |
| Humidity Testing | 85°C / 85% RH, controlled environment |
| Vibration Testing | Random and sine vibration per industry standards |
| Mechanical Shock | Impact testing per required specifications |
| Burn-In Testing | Extended operation at elevated temperature |
| Temperature/Humidity Bias | High-temperature, high-humidity with bias voltage |
Incoming Component Inspection – All components undergo LCR testing and visual verification upon receipt. Component authenticity is confirmed, and certificates are archived.
SPI (Solder Paste Inspection) – Immediately after paste printing, 3D SPI verifies paste volume, height, and area. Defects are flagged and corrected before reflow.
AOI (Automated Optical Inspection) – After reflow, AOI verifies component placement, solder joint quality, and polarity. Visual defects are identified and corrected.
3D X-Ray Inspection – For BGA, QFN, LGA, and other hidden-joint components, 3D X-Ray provides volumetric inspection to detect voids and insufficient wetting.
ICT / Flying Probe Testing – Component-level electrical validation confirms each component is correctly connected and within specification.
FCT (Functional Circuit Test) – Full power-on testing under simulated operating conditions verifies board functionality exactly as designed.
Environmental Testing (Optional) – For products requiring qualification, reliability lab testing validates performance under thermal, humidity, vibration, and shock stress.
Full In-House Testing – All inspection and testing performed internally
3D X-Ray Inspection – Volumetric inspection for hidden BGA/QFN joints
FCT Validation – Full functional verification under simulated operating conditions
Reliability Laboratory – Environmental testing for extreme applications
Immediate Feedback – In-house testing = faster issue resolution
Single Accountability – The same team that assembled your boards verifies them
Full Traceability – Test data linked to individual board serial numbers
12 Automated SMT Lines – Precision assembly integrated with testing systems
When quality is non-negotiable, comprehensive testing is essential. With Studio's Tested Turnkey PCBA with In-House X-Ray & FCT Validation, you get fully verified boards backed by in-house testing capability and a single accountable team. Contact us today to discuss your testing requirements and project specifications.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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