TCK Series SMT Thermal Profiler With RF Transceiver 0.1C Resolution And Hi Temp

TCK Series Thermal Profiler is a professional high-precision temperature profiling device specially designed for SMT reflow oven and industrial thermal process monitoring. As a core thermal profiling equipment for electronic manufacturing, this thermal profile tester supports multi-channel synchronous temperature collection, featuring 80000 data points per channel and ultra-high 0.1℃ temperature resolution, ensuring full and accurate recording of the entire heating and cooling temperature curve of production batches.

Equipped with built-in RF transceiver module, the reflow oven thermal profiler realizes stable wireless data transmission, supporting real-time data viewing and offline data storage. Matched with professional high-temperature adhesive tape, it can firmly fix thermocouples on PCB boards and workpieces, adapting to high-temperature industrial environments without falling off or failing. Widely applicable to daily temperature detection, process calibration and quality optimization of various thermal processing equipment, it is an essential precision testing tool for standardized SMT production lines.

1. Thermal profiler
2. Insulation box
3. Temperature test line
4. Data download line
5. Charger
6. Hi-temp adhesive tape
7. Software CD
8. “+” screwdriver
9. Tweezers
10. Insulated gloves
11. Solder wire
12. Scissors
13. Instrument box
14. User Manual
15. Acceptance Certificate
16. RF Transceiver (Choose Composition)
17. Wave Test System (Choose Composition)

1. Thermocouple: K-type thermocouple
2. Sampling interval:0.05sec---600sec Set with software
3. Record data:80000 point/channel, Can record 20 sets profile
4. Resolution: 0.1℃
5. Temperature measuring range: 0—1000℃
6. Temperature measuring accuracy: ±1.0℃
7. Total power: ≤120mW
8. Operating voltage:3.6VDC, rechargeable battery
9. Dimensions: 195(L)×82(W)×21(H)mm 195(L)×103(W)×21(H)mm
10. Insulation box:245(L)×100(W)×30(H)mm
11. Start Mode : Manual, specified time or specified temperature
12. Record mode: Monitor/Record
13. Connection mode:USB/RF
14. Software version:Profilermanager 2.0

• PWI
• Peak Temp,Times of overtop the Temp
• Times of between Temp(Reflow)
• Slope of between Temp(Reflow)
• Slope of between Times(Wave)

• SMT Reflow Process Validation: Establish and verify optimal soak, peak, and TAL (Time Above Liquidus) parameters for new product introductions (NPI).
• Wave & Selective Soldering: Monitor preheat gradients and solder pot temperatures to prevent cold joints or PCB delamination.
• Curing & Bonding Processes: Profile UV/thermal cure ovens for underfill, conformal coating, and adhesive bonding applications.
• Automotive & Aerospace Electronics: Generate auditable thermal records required by IATF 16949, AS9100, and other quality management systems.
• Contract Manufacturing (EMS): Rapid changeover verification between customer jobs to ensure first-pass yield consistency.
• Failure Analysis & R&D: Diagnose tombstoning, voiding, or wetting issues by correlating thermal data with defect maps.

1. True Global Compatibility: Universal voltage charging, metric/imperial toggle, and multi-language software eliminate regional barriers—deploy anywhere without reconfiguration.
2. Lower Cost of Ownership: Replaceable heat shields and field-serviceable thermocouple connectors reduce long-term expenses versus sealed-unit competitors.
3. Software That Speaks Your Language: Intuitive UI requires minimal training; built-in PWI removes guesswork so operators—not just engineers—can validate profiles confidently.
4. Supply Chain Resilience: Standardized components and global calibration partnerships ensure fast turnaround, avoiding extended downtime waiting for factory repairs.
5. Scalable Product Family: Start with TCK-3 for basic lines and upgrade to TCK-12 for complex automotive boards—all using the same software platform and accessories.

Stop guessing and start profiling. Request a free demo unit evaluation or download our sample thermal profile report to see the TCK Series in action. Our application engineers are ready to help you select the right channel configuration and heat shield for your specific oven and board complexity.