HONGKONG KINGTECH PCB SOLUTION LIMITED
Products
Manufacturer of a wide range of products which include Compact HDI PCB Board 0.3mm HDI Printed Circuit Boards ISO Certificate,Drill Hole Size 0.07mm Hdi High Density Interconnect PCB Board Custom,UL HDI PCB Board Electronics HDI C...
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Max. Board size | 540*620 |
| BGA Pitch | 0.3mm |
| Vias Aspect Ratio | 16:1 |
| Warpage | ≤0.4% |
| Board Thickness | 0.2-3.2mm |
| Misalignment of layers | +/- 0.06 |
| Min. Line widthe/space | 0.04mm/ 0.04mm |
| Blind Hole Aspect Ratio | 1:1 |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Copper thickness | 1/3-8 |
| Min. Core Thickness | 0.05 |
| Max. Board size | 540*620 |
| Warpage | ≤0.4% |
| Blind Hole Aspect Ratio | 1:1 |
| Vias Aspect Ratio | 16:1 |
| Min. Mechanical Drill Hole size | 0.1mm |
| Impedance Control | ±8% |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Min. Line widthe/space | 0.04mm/ 0.04mm |
| Impedance Control | ±8% |
| Board Thickness | 0.2-3.2mm |
| BGA Pitch | 0.3mm |
| Misalignment of layers | +/- 0.06 |
| Vias Aspect Ratio | 16:1 |
| Min. Laser Drill Hole size | 0.07mm |
| Min. Mechanical Drill Hole size | 0.1mm |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Min. Mechanical Drill Hole size | 0.1mm |
| Max. Board size | 540*620 |
| Blind Hole Aspect Ratio | 1:1 |
| Warpage | ≤0.4% |
| Board Thickness | 0.2-3.2mm |
| Misalignment of layers | +/- 0.06 |
| Min. Line widthe/space | 0.04mm/ 0.04mm |
| Min. Core Thickness | 0.05 |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| BGA Pitch | 0.3mm |
| Blind Hole Aspect Ratio | 1:1 |
| Max. Board size | 540*620 |
| Min. Mechanical Drill Hole size | 0.1mm |
| Warpage | ≤0.4% |
| Impedance Control | ±8% |
| Vias Aspect Ratio | 16:1 |
| Board Thickness | 0.2-3.2mm |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Misalignment of layers | +/- 0.06 |
| Vias Aspect Ratio | 16:1 |
| Warpage | ≤0.4% |
| Min. Mechanical Drill Hole size | 0.1mm |
| Impedance Control | ±8% |
| Blind Hole Aspect Ratio | 1:1 |
| BGA Pitch | 0.3mm |
| Max. Board size | 540*620 |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Max. Board size | 540*620 |
| Impedance Control | ±8% |
| Copper thickness | 1/3-8 |
| Min. Laser Drill Hole size | 0.07mm |
| Min. Mechanical Drill Hole size | 0.1mm |
| Misalignment of layers | +/- 0.06 |
| Blind Hole Aspect Ratio | 1:1 |
| Board Thickness | 0.2-3.2mm |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Blind Hole Aspect Ratio | 1:1 |
| Max. Board size | 540*620 |
| Min. Laser Drill Hole size | 0.07mm |
| Min. Line widthe/space | 0.04mm/ 0.04mm |
| Min. Mechanical Drill Hole size | 0.1mm |
| Min. Core Thickness | 0.05 |
| Board Thickness | 0.2-3.2mm |
| Impedance Control | ±8% |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Warpage | ≤0.4% |
| Blind Hole Aspect Ratio | 1:1 |
| BGA Pitch | 0.3mm |
| Impedance Control | ±8% |
| Vias Aspect Ratio | 16:1 |
| Misalignment of layers | +/- 0.06 |
| Copper thickness | 1/3-8 |
| Min. Core Thickness | 0.05 |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
MOQ: 1pcs
Price: By quote
| Packaging Details | Vacuum packing |
| Delivery Time | 2-7days |
| Payment Terms | By quote |
| Supply Ability | 500000 SQM per month |
| Blind Hole Aspect Ratio | 1:1 |
| Max. Board size | 540*620 |
| Copper thickness | 1/3-8 |
| Misalignment of layers | +/- 0.06 |
| Min. Laser Drill Hole size | 0.07mm |
| Impedance Control | ±8% |
| Min. Core Thickness | 0.05 |
| Warpage | ≤0.4% |
| Brand Name | Kingtech |
| Place of Origin | China |
| Certification | GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000 |
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