HONGKONG KINGTECH PCB SOLUTION LIMITED
Products
Manufacturer of a wide range of products which include 8 Layer Multilayer PCB Board Impedance Control Multilayer Pcb Assembly,Thermal Resistance Multi Layer Printed Circuit Board 0.14mm For Inner Layer,Immersion Silver Multilayer ...
MOQ:
Price:
| Min. Line Width/Space | 0.05/0.05mm |
| Max. Board size | 1000*600mm |
| Min. Vias Hole Size | 0.15mm |
| Max. Board thickness | 6.0mm |
| Misalignment of layers | 0.1mm |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Aspect Ratio | 20:1 |
| Layer | 2-48L |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Min. Vias Hole Size | 0.15mm |
| Layer | 2-48L |
| Min. PAD | 0.14mm For Inner Layer |
| Max. Board thickness | 6.0mm |
| Min. Core Thickness | 0.03mm |
| Misalignment of layers | 0.1mm |
| Aspect Ratio | 20:1 |
| Multi-Laminations | 4 Times |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Multi-Laminations | 4 Times |
| Max. Board thickness | 6.0mm |
| Aspect Ratio | 20:1 |
| Impedance Control | ±5% |
| Misalignment of layers | 0.1mm |
| Back drill | 0.15mm |
| Max. Board size | 1000*600mm |
| Min. Vias Hole Size | 0.15mm |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Multi-Laminations | 4 Times |
| Min. Line Width/Space | 0.05/0.05mm |
| Max. Board thickness | 6.0mm |
| Min. Core Thickness | 0.03mm |
| Layer | 2-48L |
| Back drill | 0.15mm |
| Max. Board size | 1000*600mm |
| Aspect Ratio | 20:1 |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Min. Line Width/Space | 0.05/0.05mm |
| Impedance Control | ±5% |
| Min. Vias Hole Size | 0.15mm |
| Misalignment of layers | 0.1mm |
| Layer | 2-48L |
| Min. PAD | 0.14mm For Inner Layer |
| Back drill | 0.15mm |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Multi-Laminations | 4 Times |
| Min. Core Thickness | 0.03mm |
| Max. Board size | 1000*600mm |
| Layer | 2-48L |
| Impedance Control | ±5% |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Max. Board thickness | 6.0mm |
| Aspect Ratio | 20:1 |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Min. Core Thickness | 0.03mm |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Misalignment of layers | 0.1mm |
| Multi-Laminations | 4 Times |
| Impedance Control | ±5% |
| Min. PAD | 0.14mm For Inner Layer |
| Max. Board thickness | 6.0mm |
| Min. Line Width/Space | 0.05/0.05mm |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Max. Board size | 1000*600mm |
| Misalignment of layers | 0.1mm |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Aspect Ratio | 20:1 |
| Back drill | 0.15mm |
| Min. PAD | 0.14mm For Inner Layer |
| Min. Line Width/Space | 0.05/0.05mm |
| Layer | 2-48L |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Min. Core Thickness | 0.03mm |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Max. Board thickness | 6.0mm |
| Back drill | 0.15mm |
| Layer | 2-48L |
| Misalignment of layers | 0.1mm |
| Impedance Control | ±5% |
| Min. Vias Hole Size | 0.15mm |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
MOQ:
Price:
| Aspect Ratio | 20:1 |
| Back drill | 0.15mm |
| Min. Vias Hole Size | 0.15mm |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Impedance Control | ±5% |
| Misalignment of layers | 0.1mm |
| Min. PAD | 0.14mm For Inner Layer |
| Min. Core Thickness | 0.03mm |
| Brand Name | Kingtech |
| Model Number | Multilayer |
| Place of Origin | China |
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