Payment Terms | T/T |
Delivery Time | 5-30 days |
Layer | 18 Layer |
Material | FR4 |
Board Thickness | 0.2-10mm |
Surface Finish | ENIG |
Pin Space | 0.25mm |
Application | Consumer Electronics |
Certification | ISO, UL, IPC, Reach |
Place of Origin | China |
View Detail Information
Explore similar products
High Density PCB Micro BGA Package Assembly Service Integrated Solution
High Precision BGA Assembly Electronic Prototype Board IPC-A-610 Certified
Medical Prototype PCB Motherboard Assembly Ball Grid Array BGA Customized
0.2mm-10mm PCB Circuit Board BGA Assembly 14 Layer For Industrial Control
Product Specification
Payment Terms | T/T | Delivery Time | 5-30 days |
Layer | 18 Layer | Material | FR4 |
Board Thickness | 0.2-10mm | Surface Finish | ENIG |
Pin Space | 0.25mm | Application | Consumer Electronics |
Certification | ISO, UL, IPC, Reach | Place of Origin | China |
High Light | ENIG BGA Assembly ,FR4 BGA Assembly ,ENIG pcba bga assembly smt pcb |
Consumer Electronics BGA Assembly
♦ What Is BGA Assembly?
BGA (Ball Grid Array) assembly is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath the package, allowing for:
♦ Key Features of Contract Manufacturing:
♦ Common Challenges in BGA Assembly:
♦ Technical Parameters
PCB Assembly Capability | |||||
Item |
Normal |
Special | |||
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm |
2. Quality Guaranteed:
3. Premium Service:
Would you like details on BGA rework or inspection techniques?
Contact us via email : sales@dqspcba.com
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification:
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
Get in touch with us
Leave a Message, we will call you back quickly!