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Product Specification
High Light | 2 Layer RF Microwave PCB ,0.6mm RF Microwave PCB ,Rigid Printed RF PCB Board |
It's happy to introduce our newly shipped 2-layer rigid printed circuit board (PCB) made from RT/duroid 6035HTC PTFE Ceramic, which features top-quality performance. Constructed using a lead-free process, this PCB is capable of operating within a temperature range of -40℃ to +85℃, making it suitable for various applications.
The 2-layer rigid PCB has a measurement of 132mm x 101mm with a minimum trace/space of 9/9 mils and a minimum hole size of 0.3mm. The board has no blind or buried vias and has a finished board thickness of 0.6mm with a finished copper weight of 1.5 oz (2.1 mils) all layers. The via plating thickness is 1 mil and the surface finish is immersion silver. The solder pads do not have any silkscreen, and the board has undergone 100% electrical testing.
The PCB consists of 35 components, 90 total pads, and 26 thru-hole pads. It also has 64 top SMT pads, 0 bottom SMT pads, 46 vias, and 12 nets.
The artwork supplied is Gerber RS-274-X, and technical support is available through contacting Ivy at sales10@bichengpcb.com.
Why should use RT/duroid 6035 HTC PCB?
When it comes to selecting the right PCB material for high-performance applications, RT/duroid 6035HTC PTFE Ceramic is an excellent choice. This hydrocarbon/ceramic-based material boasts outstanding properties and characteristics, making it the ideal choice for high-frequency and high-temperature applications.
Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.6 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
Dissipation Factor | 0.0013 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
Volume Resistivity | 108 | MΩ.cm | A | IPC-TM-650, 2.5.17.1 | |
Surface Resistivity | 108 | MΩ | A | IPC-TM-650, 2.5.17.1 | |
Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
Moisure Absorption | 0.06 | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 | |
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
Thermal Conductivity | 1.44 | W/m/k | 80℃ | ASTM C518 | |
Density | 2.2 | gm/cm3 | 23℃ | ASTM D792 | |
Copper Peel Stength | 7.9 | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-Free Process Compatible | Yes |
Properties and Characteristics of RT/duroid 6035HTC Material:
RT/duroid 6035HTC material features a dielectric constant of 3.50±0.05 and a low dissipation factor of 0.0013, making it an optimal choice for high-frequency applications. This material also exhibits good thermal conductivity, electrical strength, and mechanical properties, enabling it to withstand high temperatures and harsh environments. Additionally, RT/duroid 6035HTC material is lead-free process compatible, making it a more environmentally friendly option.
Advantages of RT/duroid 6035HTC Material in High-Performance Applications:
RT/duroid 6035HTC material offers several advantages for high-performance PCB designs, including improved signal integrity, reduced loss, and enhanced performance. This material also provides greater design flexibility, allowing for a wide range of applications, such as aerospace, telecommunications, and medical devices. Additionally, RT/duroid 6035HTC material is highly resistant to moisture absorption, ensuring long-lasting performance.
Applications of RT/duroid 6035HTC PCB Material:
RT/duroid 6035HTC material is widely used in high-performance applications, including power amplifiers, satellite communication systems, and medical devices. Its excellent thermal stability and resistance to moisture absorption make it an ideal choice for high-temperature and harsh environments.
Understanding the Dielectric Constant and Dissipation Factor of RT/duroid 6035HTC:
The dielectric constant and dissipation factor are essential properties of RT/duroid 6035HTC material that affect its performance in high-frequency applications. A low dielectric constant and dissipation factor ensure optimal signal transmission and reduced signal loss, making RT/duroid 6035HTC material an ideal choice for high-frequency applications.
Thermal Stability and Coefficient of Thermal Expansion of RT/duroid 6035HTC:
RT/duroid 6035HTC material exhibits excellent thermal stability, with a thermal coefficient of ε of -66 ppm/℃. Its low coefficient of thermal expansion of 19 ppm/℃ ensures minimal dimensional changes due to temperature variations. This makes it an ideal choice for high-temperature applications.
Copper Peel Strength and Flammability of RT/duroid 6035HTC PCBs:
RT/duroid 6035HTC material exhibits excellent copper peel strength, with a value of 7.9 pli. This ensures reliable and long-lasting performance. Additionally, it has a flammability rating of V-0, making it a safe choice for high-performance applications.
Choosing the Right Supplier for Your RT/duroid 6035HTC PCBs:
Selecting the right provider is crucial for designing high-quality PCBs with RT/duroid 6035HTC material. A reliable supplier can provide technical support, offer guidance throughout the design process, and ensure the highest quality and performance of the final product.
In conclusion, RT/duroid 6035HTC PTFE Ceramic PCB material offers outstanding properties and characteristics, making it an ideal choice for high-performance applications. Its excellent thermal stability, low moisture absorption, and lead-free process compatibility make it a more environmentally friendly option. By selecting the right supplier and carefully considering design factors, you can unlock the full potential of RT/duroid 6035HTC material and achieve optimal performance in your PCB project.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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