Bicheng Electronics Technology Co., Ltd
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Product Specification
| High Light | Low DK RF PCB ，Via Filled PCB ，RO4003C RF PCB Board | ||
Today's PCB sharing is a via filled by resin and capped PCB. Made from RO4003C hydrocarbon ceramic laminates, this PCB is ideal for use in a variety of applications. With a lead-free process and -40℃ to +85℃ temperature range, this PCB is environmentally friendly and can operate in extreme temperatures.
The PCB measures 136mm x 96mm, with a finished board thickness of 0.6mm and finished copper weight of 1.5 oz (2.1 mils) all layers. It features 96 components and 128 total pads, including 54 thru-hole pads, 72 top SMT pads, and 0 bottom SMT pads. With a minimum trace/space
of 4/4 mils and minimum hole size of 0.2mm, this PCB provides high-density interconnectivity.
The PCB is constructed using electroless nickle immersion gold (ENIG) surface finish for improved solderability and corrosion resistance. It also features a green top and bottom solder mask, with no silkscreen on the solder pads. The slotted holes defined as per Gerber are plated through, with side-by-side holes defining the dimensions of the slots.
The PCB meets IPC-Class-2 standards and has been 100% electrically tested to ensure reliability. It also features 0.2mm and 0.5mm via filled by resin and capped as per IPC-4761 Type VII. With worldwide service area, this PCB is perfect for a wide range of applications.
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes |
Why sugguest RO4003C?
RO4003C boasts a dielectric constant of 3.38±0.05 and a design dielectric constant of 3.55, making it the ideal material for high-frequency applications. It also has a low dissipation factor of 0.0027 and 0.0021 at 10 GHz/23℃ and 2.5 GHz/23℃, respectively, ensuring excellent signal integrity. Plus, with a thermal coefficient of ε of +40 ppm/℃ from -50℃ to 150℃, RO4003C can withstand even the most extreme temperatures!
But that's not all – RO4003C provides several advantages over other PCB materials. It ensures superior signal integrity due to its low dielectric constant and dissipation factor, making it an ideal choice for high-frequency and high-speed digital applications. Its low thermal coefficient of ε also makes it suitable for use in high-temperature environments, and it is lead-free process compatible, making it an environmentally friendly option.
RO4003C is suitable for a wide range of demanding applications, including RF/microwave applications, high-speed digital applications, and aerospace and defense. It can even operate in temperatures ranging from -40℃ to +85℃, making it ideal for harsh environments and extreme conditions.
Compared to other PCB materials, RO4003C provides superior high-frequency performance and signal integrity. Its low thermal coefficient of ε also ensures better performance in high-temperature environments. And, with its cost-effectiveness, RO4003C is a popular choice for PCB manufacturing.
Don't miss out on the future of PCB event – choose RO4003C for your next project! With its excellent properties and versatility, RO4003C is sure to impress and provide the high-performance results you need. Contact us today to learn more about how RO4003C can take your PCB to the next level!
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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