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Product Specification
High Light | Ceramic Filled PTFE PCB Material ,Immersion Gold PCB ,25mil PCB |
We are delighted to introduce our newly shipped PCB. Here are the key details of this exceptional product:
1. PCB Material:
- Crafted with RO3006 ceramic-filled PTFE composites for superior reliability.
- Manufactured using a lead-free process, aligning with environmentally conscious practices.
- Supplied for optimal operation within a wide temperature range, from -40℃ to +85℃.
2. Stackup: 2-Layer Rigid PCB
- Features a robust stackup configuration to ensure stability and performance.
- Consists of finished copper layers with a thickness of 35um.
- Incorporates a 25 mil (0.635mm) RO3006 dielectric layer.
- Concludes with an additional finished copper layer of 35um.
3. Construction Details:
- Board dimensions measure 217mm x 102mm, providing ample space for your applications.
- Minimum trace/space of 9/8 mils, allowing for precise circuitry design.
- Supports a minimum hole size of 0.3mm, facilitating efficient connectivity.
- Does not include blind or buried vias, ensuring simplicity and reliability.
- Boasts a finished board thickness of 0.76mm, striking the perfect balance between durability and compactness.
- All layers feature a 1 oz (1.4 mils) finished copper weight, guaranteeing excellent conductivity.
- Via plating thickness of 1 mil, enhancing signal integrity across the board.
- Surface finish is achieved through immersion gold, providing superior corrosion resistance and a smooth contact surface.
- Top silkscreen is elegantly presented in white, aiding component identification.
- Bottom silkscreen is intentionally omitted for a clean aesthetic.
- Top solder mask is applied in a vibrant blue color, protecting the board and enhancing soldering efficiency.
- Bottom solder mask is not included, streamlining the manufacturing process.
- Solder pads are free from silkscreen, ensuring precise and reliable soldering.
- Each board undergoes a rigorous 100% electrical test to guarantee optimal performance.
4. PCB Statistics:
- Accommodates a total of 51 components, enabling versatile applications.
- Boasts 80 pads, ensuring ample connectivity options.
- Includes 59 through-hole pads for secure and robust connections.
- Features 21 top SMT (Surface Mount Technology) pads for surface-mounted components.
- Bottom SMT pads are not present, catering to specific design requirements.
- Contains 75 vias, facilitating efficient signal routing throughout the board.
- Supports 7 nets, allowing for organized and efficient circuitry design.
5. Artwork Format: Gerber RS-274-X
- Supplied in industry-standard Gerber format, ensuring compatibility with various design tools.
6. Accepted Standard: IPC-Class-2
- Manufactured to comply with IPC-Class-2 standards, guaranteeing quality and reliability.
7. Service Area: Worldwide
- Our services are available globally, ensuring accessibility regardless of your location.
8. Contact Info:
- For any technical inquiries or questions, please reach out to Ivy at sales10@bichengpcb.com. Our dedicated team is ready to assist you.
Property | RO3006 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.27 0.15 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 1498 1293 | X Y | MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.86 | j/g/k | Calculated | ||
Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) | 17 17 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Introducing RO3006: Pioneering a Ceramic-Filled PTFE Composite
RO3006 stands as the epitome of PCB innovation, seamlessly blending ceramic-filled PTFE composites to create a material that surpasses traditional options. Its unique composition ensures exceptional electrical performance and stability, setting it apart from the competition.
Ensuring Quality: Compliant with IPC-Class-2 Standards
Quality reigns supreme, and that's why RO3006 adheres to IPC-Class-2 standards. This unwavering commitment ensures that every PCB meets stringent quality requirements, guaranteeing reliability and consistency across the board.
Global Reach: Seamlessly Serving Customers Worldwide
Wherever you may be, our RO3006 PCBs are readily available to cater to your needs. With a global service area, we remain dedicated to providing exceptional support and delivering the highest quality products to our customers across the globe.
Exploring Key Features: Dielectric Constant, Dissipation Factor, and Thermal Coefficient
RO3006 shines through its exceptional features. Boasting a dielectric constant of 6.15±0.05, it offers unparalleled signal performance. The low dissipation factor of 0.002 ensures minimal signal loss and excellent signal integrity. Additionally, the thermal coefficient of ε, measuring at -262 ppm/℃, guarantees stability and consistent performance across a wide temperature range.
In summary, RO3006 PCBs epitomize a groundbreaking development in the world of electronics. With their extraordinary stability, reliability, and high-performance characteristics, they empower engineers and designers to create cutting-edge solutions. Whether in aerospace, telecommunications, or other industries, RO3006 ensures optimal performance even in extreme conditions. With global availability and compliance with IPC-Class-2 standards, RO3006 is poised to revolutionize your designs and spearhead future innovations. Embrace the power of RO3006 and unlock a new realm of possibilities in PCB technology.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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