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Bicheng Electronics Technology Co., Ltd

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China 25mil TMM10 1oz 0.7mm Bare Copper PCB With No Solder Mask
China 25mil TMM10 1oz 0.7mm Bare Copper PCB With No Solder Mask

  1. China 25mil TMM10 1oz 0.7mm Bare Copper PCB With No Solder Mask
  2. China 25mil TMM10 1oz 0.7mm Bare Copper PCB With No Solder Mask

25mil TMM10 1oz 0.7mm Bare Copper PCB With No Solder Mask

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
Brand Name Bicheng Certification UL, ISO9001, IATF16949
Place of Origin CHINA
High Light No Solder Mask Bare Copper PCB ,0.7mm Bare Copper PCB

Introducing the TMM10 PCB, a high-performance solution provided to meet the demanding requirements of RF and microwave applications. Crafted using advanced ceramic, hydrocarbon, and thermoset polymer composites, this PCB material offers exceptional performance, reliability, and durability. The TMM10 PCB is engineered to deliver superior signal integrity, efficient thermal management, and resistance to process chemicals, making it an ideal choice for a wide range of applications.

 

The TMM10 PCB features a process dielectric constant (Dk) of 9.20 +/- .23 at 10 GHz/23°C, ensuring reliable signal transmission and excellent performance in high-frequency environments. With a dissipation factor of 0.0022 at the same frequency, it minimizes signal loss and ensures optimal signal integrity.

 

TMM10 Typical Value
Property   TMM10 Direction Units Condition Test Method
Dielectric Constant,εProcess 9.20±0.23 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.8 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0022 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -38 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 285 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 21 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 21 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 13.62 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.79 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.09 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.74 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

One of the key advantages of the TMM10 PCB is its coefficient of thermal expansion, which is matched to copper. This feature reduces the risk of mechanical stress and improves the overall reliability of the PCB, particularly in applications where temperature fluctuations are common.

 

The TMM10 PCB is available in a thickness range of .0015 to .500 inches, providing flexibility in design and accommodating various space constraints. Its mechanical properties resist creep and cold flow, ensuring the integrity of the PCB over time.

 

Resistance to process chemicals is another noteworthy feature of the TMM10 PCB. This property reduces the risk of damage during fabrication processes, ensuring high manufacturing yield and reliability.

 

The material does not require a sodium napthanate treatment prior to electroless plating, streamlining the manufacturing process and reducing the overall production time.

With its thermoset resin base, the TMM10 PCB allows for reliable wire-bonding, making it suitable for applications that require this bonding technique.

 

The 2-layer rigid PCB construction features copper layers of 35 μm thickness, sandwiching the 0.635 mm (25mil) Rogers Core TMM10. The board dimensions are 210mm x 210mm with a finished board thickness of 0.7mm. The PCB conforms to IPC-Class-2 standards, ensuring high quality and reliability.

 

The TMM10 PCB is compatible with Gerber RS-274-X artwork, making it easy to integrate into various design software and manufacturing processes.

 

This high-performance PCB finds numerous applications in the field of RF and microwave electronics. It is particularly well-suited for RF and microwave circuitry, power amplifiers, combiners, filters, couplers, satellite communication systems, Global Positioning Systems antennas, patch antennas, dielectric polarizers and lenses, and chip testers.

 

For any technical inquiries or further information, please reach out to Ivy at sales10@bichengpcb.com. Our expert team is ready to assist you in

unlocking the full potential of the TMM10 PCB for your next project.

 


Unveiling the Next Generation: TMM10 PCB Redefines RF and Microwave Applications

The world of RF and microwave technology is witnessing a paradigm shift with the introduction of the groundbreaking TMM10 PCB. Crafted using advanced ceramic, hydrocarbon, and thermoset polymer composites, the TMM10 PCB delivers unparalleled performance, reliability, and durability. Provided to meet the demanding requirements of high-frequency environments, this cutting-edge PCB material is set to transform the industry.

 

Unmatched Performance and Reliability

 

Exploring the Advanced Properties of TMM10 PCB

The TMM10 PCB boasts an impressive dielectric constant (εProcess) of 9.20 ± 0.23 at 10 GHz, ensuring reliable signal transmission. Its dielectric constant (εDesign) of 9.8 from 8 GHz to 40 GHz, determined by the Differential Phase Length Method, guarantees consistent performance across a wide frequency range. Additionally, the low dissipation factor (0.0022) minimizes signal loss and preserves signal integrity.

 

Reliability in Extreme Conditions: Thermal Stability and Low Dissipation Factor

The TMM10 PCB's coefficient of thermal expansion, matched to copper, mitigates mechanical stress and ensures its integrity even in temperature-fluctuating environments. With a thermal coefficient of dielectric constant of -38 ppm/°K from -55°C to 125°C, it maintains stable performance in demanding conditions. Moreover, its exceptional thermal conductivity of 0.76 W/m/K at 80°C facilitates efficient heat dissipation.

 

Seamless Integration Made Easy: Compatibility with Gerber RS-274-X Artwork

The TMM10 PCB seamlessly integrates into existing design software and manufacturing processes, thanks to its compatibility with Gerber RS-274-X artwork. This feature simplifies the design-to-production transition, saving time and effort.

 

Popular Applications and Future Prospects

Optimized Signal Transmission: TMM10 PCB's Role in Power Amplifiers and Filters

The TMM10 PCB is a game-changer in power amplifiers, filters, and couplers, ensuring optimized signal transmission and amplification. Its exceptional performance empowers RF and microwave circuitry to deliver superior results.

 

Beyond the Sky: TMM10 PCB's Impact on Satellite Communication Systems

The TMM10 PCB plays a pivotal role in satellite communication systems, enabling seamless data transfer and reliable signal reception. Its durability and thermal stability make it an ideal choice for space applications.

 

Conclusion

Shaping the Future: Advancements and Innovations in TMM10 PCB Technology

The TMM10 PCB revolutionizes RF and microwave applications with its exceptional properties and unmatched performance. From its reliable signal transmission to efficient thermal management and chemical resistance, it surpasses industry standards. As we look ahead, the TMM10 PCB's continuous advancements and innovations promise to unlock new frontiers in electronic design and manufacturing. Embrace the future with the TMM10 PCB and unlock the full potential of your RF and microwave projects.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...

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Get in touch with us

  • Reach Us
  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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