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Bicheng Electronics Technology Co., Ltd

  • China,Shenzhen ,Guangdong
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China 2-layer RO4350B PCB Rogers 20mil RF Circuit Board Immersion Silver
China 2-layer RO4350B PCB Rogers 20mil RF Circuit Board Immersion Silver

  1. China 2-layer RO4350B PCB Rogers 20mil RF Circuit Board Immersion Silver
  2. China 2-layer RO4350B PCB Rogers 20mil RF Circuit Board Immersion Silver
  3. China 2-layer RO4350B PCB Rogers 20mil RF Circuit Board Immersion Silver

2-layer RO4350B PCB Rogers 20mil RF Circuit Board Immersion Silver

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99/PCS
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material RO4350B
PCB size 106.84mm x 60.8 mm=1PCS, +/- 0.15mm
Copper weight 1OZ
Surface finish Immersion silver
Layer count 2 layers
PCB Thickness 0.6mm
Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
Material RO4350B PCB size 106.84mm x 60.8 mm=1PCS, +/- 0.15mm
Copper weight 1OZ Surface finish Immersion silver
Layer count 2 layers PCB Thickness 0.6mm
Brand Name Bicheng Certification UL, ISO9001, IATF16949
Place of Origin CHINA
High Light Immersion Silver RF Circuit Board20mil RF Circuit Board2-layer RO4350B PCB

Introducing one newly shipped PCB built on RO4350B laminate. It's a high-performance laminate that combines the electrical properties of PTFE/woven glass with the manufacturability of epoxy/glass. With its proprietary woven glass reinforced hydrocarbon/ceramic materials, the RO4350B offers exceptional electrical performance while being cost-effective to produce.

 

The RO4350B laminates provide precise control over the dielectric constant (Dk) and maintain low loss, using the same processing methods as standard epoxy/glass laminates. Unlike conventional microwave laminates, RO4350B laminates do not require special through-hole treatments or handling procedures, simplifying the manufacturing process. Additionally, these materials are UL 94 V-0 rated, ensuring their suitability for active devices and high-power RF designs.

 

With a dielectric constant of DK 3.48 +/-0.05 at 10GHz/23°C and a dissipation factor of 0.0037 at 10GHz/23°C, the RO4350B PCB ensures accurate and reliable signal transmission. It exhibits a thermal conductivity of 0.69 W/m/°K, contributing to efficient heat dissipation. The PCB demonstrates a low coefficient of thermal expansion (CTE) with 10 ppm/°C for the X axis, 12 ppm/°C for the Y axis, and 32 ppm/°C for the Z axis. It also possesses a high Tg value of >280 °C, ensuring stability under elevated temperatures. With a low water absorption rate of 0.06%, the PCB maintains excellent dimensional stability.

 

The RO4350B PCB offers numerous benefits for your applications. It is ideal for multi-layer board (MLB) constructions and can be processed like FR-4 at a lower fabrication cost, providing a cost-effective solution for high-performance designs. Additionally, it offers excellent dimensional stability, ensuring reliable performance in demanding environments. The RO4350B PCB is competitively priced, offering exceptional value for its performance capabilities.

 

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.69   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0       UL 94
Lead-free Process Compatible Yes        

 

This particular PCB features a 2-layer rigid board stackup with copper_layer_1 (70 μm), a 0.508 mm (20mil) Rogers RO4350B core, and copper_layer_2 (70 μm). This configuration provides structural integrity and optimal electrical performance for your designs.

This PCB measures 106.84mm x 60.8mm with a tolerance of +/- 0.15mm. It features a minimum trace/space of 4/5 mils and a minimum hole size of 0.3mm. There are no blind vias. The finished board thickness is 0.6mm with a 1oz (1.4 mils) outer layer copper weight. The via plating thickness is 20 μm. The surface finish is immersion silver, providing excellent solderability and corrosion resistance. The PCB does not have top or bottom silkscreen or solder mask. Each board undergoes a comprehensive 100% electrical test to ensure its performance and reliability.

Each PCB adheres to IPC-Class-2 quality standards, ensuring high-quality manufacturing processes and reliable performance. It is available worldwide, catering to customers globally.

 

 

The RO4350B PCB finds applications in various industries. It is well-suited for cellular base station antennas and power amplifiers, offering excellent signal transmission and power handling capabilities. It is also suitable for RF identification tags, automotive radar, sensors, and LNB's (Low-Noise Block Downconverters) for direct broadcast satellites. Choose the RO4350B PCB for outstanding electrical performance, cost-effective fabrication, and reliable functionality in demanding applications.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...

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  • Reach Us
  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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