Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Material | F4BTMS350 |
PCB size | 76mm x 76mm |
Copper weight | 35um |
Surface finish | Hot Air Soldering Level (HASL) |
Brand Name | Bicheng |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Material | F4BTMS350 | PCB size | 76mm x 76mm |
Copper weight | 35um | Surface finish | Hot Air Soldering Level (HASL) |
Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA | ||
High Light | 1OZ 6.35mm F4BTMS350 RF PCB ,6.35mm F4BTMS350 RF PCB ,HASL RF PCB Board |
The newly shipped PCB which made of F4BTMS350, intended to use for high frequency applications.The F4BTMS350 substrate utilizes a unique blend of ultra-thin glass fiber cloth and specially engineered nano-ceramics mixed with polytetrafluoroethylene resin. This combination mitigates the negative effects of glass fiber on electromagnetic wave propagation, resulting in reduced dielectric loss, enhanced dimensional stability, and minimized X/Y/Z anisotropy. The advanced material composition enables a wider usable frequency range, improved electrical strength, and enhanced thermal conductivity. Moreover, the F4BTMS350 exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics, ensuring optimal performance across various environmental conditions.
Key Features of the F4BTMS350 PCB:
Unlock the potential of your electronic designs with the remarkable features of the F4BTMS350 PCB:
Dielectric Constant (Dk): Experience exceptional signal integrity and precise transmission capabilities with a Dk of 3.5 at 10GHz.
Dissipation Factor: Minimize signal loss and maximize performance with a low dissipation factor of .0016 at 10GHz, 0.0019 at 20GHz, and 0.0024 at 20GHz.
Thermal Stability: The F4BTMS350 PCB offers remarkable thermal stability with a CTE of 10 ppm/°C (x-axis), 12 ppm/°C (y-axis), and 20 ppm/°C (z-axis) over a wide temperature range of -55°C to 288°C.
Low Thermal Coefficient: Benefit from excellent thermal stability with a low thermal coefficient of Dk at -39 ppm/°C between -55°C and 150°C.
High Thermal Conductivity: Facilitate efficient heat dissipation and maintain optimal temperature conditions with a high thermal conductivity of 0.6 W/mk.
Moisture Absorption: Ensure long-term reliability and performance with a moisture absorption rate of only 0.03%.
PCB Stackup and Construction Details:
Designed with precision and durability in mind, the F4BTMS350 PCB offers the following stackup and construction details:
Board Dimensions: The F4BTMS350 PCB measures 76mm x 76mm, providing ample space for component placement and circuit design, with a tolerance of +/- 0.15mm.
Minimum Trace/Space: Enable intricate designs and precise routing with a minimum trace/space requirement of 6/7 mils.
Minimum Hole Size: Accommodate miniaturized components and streamline assembly with a minimum hole size of 1.5mm.
Finished Board Thickness: The F4BTMS350 PCB boasts a finished board thickness of 6.42mm, ensuring robustness and reliability.
Surface Finish: The PCB features a reliable and widely used Hot Air Soldering Level (HASL) surface finish, guaranteeing excellent solderability and ease of assembly.
Silkscreen and Solder Mask: The F4BTMS350 PCB does not include top or bottom silkscreen or solder mask, offering a clean and minimalist appearance.
Electrical Testing: Each PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring optimal functionality and performance.
Typical Applications:
The F4BTMS350 PCB excels in a wide range of demanding applications, including:
Aerospace Equipment: Meet the rigorous demands of aerospace equipment, including space and cabin applications, with the high-reliability performance of the F4BTMS350.
Microwave and RF Applications: Experience enhanced signal transmission and efficiency in microwave and RF systems, enabling superior performance.
Radar Systems: The F4BTMS350 PCB is an excellent choice for military radar applications, providing low interference and reliable signal propagation.
Antenna Systems: From feed networks to phase-sensitive antennas and phased array antennas, the F4BTMS350 delivers optimal performance and signal integrity.
Satellite Communications: Ensure stable and reliable communication in satellite systems, where the F4BTMS350 PCB excels in demanding environments.
Discover Unmatched Performance:
With its cutting-edge features, robust construction, and global availability, the F4BTMS350 PCB represents the pinnacle of electronic advancements. Whether you're working on aerospace equipment, radar systems, or high-frequency applications, you can rely on the F4BTMS350 to deliver unparalleled performance and reliability. Embrace the future of PCB technology and unleash the true potential of your electronic designs with the F4BTMS350.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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