2-Layer TFA300 PCB on 5mil High-Frequency Substrate

Product Specification

This TFA300 2-layer rigid PCB is a premium high-frequency printed circuit board tailored for aerospace, microwave communication, and radar system applications. This high-reliability PCB features a 0.2mm finished board thickness, premium immersion gold surface finish, and 1oz outer layer copper weight, paired with a precise 2-layer rigid stackup built on high-performance TFA300 PTFE ceramic composite substrate. Manufactured to strict IPC-Class-2 quality standards and fully verified with 100% electrical testing before shipment, it delivers outstanding frequency stability, ultra-low dielectric loss, and reliable thermal mechanical performance. Adopting a unique glass-fiber-free formula that eliminates traditional fiberglass electromagnetic interference, this PCB acts as a cost-effective, high-quality alternative to imported high-frequency PCB substrates and supports worldwide supply and professional technical services.

What Is TFA300 Substrate?

The TFA series is a cutting-edge Polytetrafluoroethylene (PTFE) ceramic composite dielectric substrate, featuring a unique production process that differs fundamentally from traditional glass fiber cloth prepreg manufacturing. Instead of resin-impregnated fiberglass fabric, it adopts uniform nano-ceramic and resin composite mixing technology, paired with professional customized lamination pressing procedures to produce high-performance PCB core materials.

Eliminating the fiberglass effect during electromagnetic wave transmission, the TFA series effectively avoids signal distortion and frequency deviation, achieving outstanding electromagnetic stability. It features minimized X/Y/Z axis anisotropy, ultra-low thermal expansion coefficient matching copper foil, and stable dielectric temperature characteristics, ensuring consistent performance in extreme temperature environments. The TFA substrate family offers four customizable dielectric constant options: 2.94 (TFA294), 3.0 (TFA300), 6.15 (TFA615), and 10.2 (TFA1020), covering diverse high-frequency circuit design requirements.

Why Choose TFA300 PCB? Core High-Frequency Performance Features

The TFA300 substrate is the mainstream high-frequency grade of the TFA series, with stable and superior electrical, thermal, and physical properties, fully meeting aerospace-grade high-reliability application standards:

Stable Dielectric Constant (Dk): 3.0±0.04 at 10GHz, ensuring consistent high-frequency signal transmission

Ultra-Low Dissipation Factor (Df): 0.001 at 10GHz and 20GHz, 0.0012 at 40GHz, effectively reducing high-frequency signal attenuation

Excellent Temperature Stability: Low TCDK of -8 ppm/°C within -55°C to 150°C, maintaining stable dielectric performance under temperature fluctuations

Balanced Thermal Expansion Coefficient (CTE): 18 ppm/°C (X-axis), 18 ppm/°C (Y-axis), 30 ppm/°C (Z-axis) in -55°C to 288°C, perfectly matching copper foil expansion and contraction to prevent board cracking and circuit failure

Superior Thermal Conductivity: 0.6 W/mk, accelerating heat dissipation and improving circuit operating stability

Low Moisture Absorption: 0.04% moisture absorption rate, avoiding performance degradation caused by humid environments

Flame Retardant Rating: UL 94-V0 grade, meeting global safety and fire resistance standards for electronic equipment

Key PCB Specification

2-Layer High-Frequency Optimized Stack-up Structure

The standardized layered structure ensures uniform stress distribution and stable high-frequency performance:

PCB Statistics

Accepted Artwork Format: We accept standard Gerber RS-274-X files submitted by global customers. This industry-standard file format is used for accurate technical evaluation, formal quotation confirmation, and official mass production, enabling efficient and error-free project communication and manufacturing docking worldwide.

Production Quality Standard: All PCBs are strictly manufactured and inspected in compliance with IPC-Class-2 industrial reliability standards. This standardized quality control ensures stable, consistent, and reliable circuit performance, fully meeting the requirements of commercial, industrial, and aerospace high-frequency application scenarios.

Global Supply Service: We provide global customized PCB quotation services and worldwide shipping support. Customers from all regions of the world can submit Gerber files for personalized PCB quotation, and we offer a complete one-stop solution including engineering technology confirmation, precision production, full inspection, and international delivery.

Typical Usage Scenarios

Benefiting from its aerospace-grade high-frequency performance, low signal loss, and extreme environmental adaptability, this TFA300 PCB is widely applied in high-precision wireless communication and radar detection fields:

Aerospace & Aviation: Aerospace equipment, space devices, aircraft cabin electronic systems, airborne precision modules

Microwave & Antenna Systems: Microwave signal transmission modules, high-precision antennas, phase-sensitive antenna equipment

Radar Detection: Early warning radar systems, airborne radar modules, high-frequency radar detection equipment

Phased Array Systems: Phased array antennas, beamforming network circuit boards

Satellite Communication & Navigation: Satellite communication terminals, navigation positioning system modules

Radio Frequency Devices: High-frequency power amplifiers and RF signal processing circuits