Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Aluminum |
| Layer count | Single side |
| PCB thickness | 1.2mm - 9.0mm |
| PCB size | ≤400mm X 500mm |
| Solder mask | Green, Red, Black, White, Blue etc. |
| Copper weight | 0.5oz, 1oz |
| Surface finish | Bare copper, HASL, ENIG, Immersion tin etc. |
| Brand Name | Bicheng |
| Model Number | BIC-107.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Aluminum | Layer count | Single side |
| PCB thickness | 1.2mm - 9.0mm | PCB size | ≤400mm X 500mm |
| Solder mask | Green, Red, Black, White, Blue etc. | Copper weight | 0.5oz, 1oz |
| Surface finish | Bare copper, HASL, ENIG, Immersion tin etc. | Brand Name | Bicheng |
| Model Number | BIC-107.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 3.0mm Teflon PCB Board ，Radio Device Teflon PCB Board ，3.0mm PCB Circuit Board | ||
Metal Based High Frequency PCB Built on 3.0mm PTFE 1.0oz with Immersion Gold for Radio Device
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials (such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.
Parameters
DK @ 10GHz & Tolerance: 2.20+/- 0.03
Thermal Change of DK (ppm/℃) : -48
Loss Tangent, Df@10GHz: 0.001
Thermal Conductivity(W/mk): 0.35
Td (℃): 476
Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98
Density (g/cm3): 1.80
Volume Resisivity (Mohm.cm) 1x 10^8
Surface Resistivity (Mohm): 1 x 10^8
Moisture Absorption: 0.02
Peel Strength (N/cm) (1oz): 20
Flammability Rating: UL94 V0
Type of Metal Base: Aluminum, Copper
Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm
Base copper: 0.5oz, 1oz
Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler
| Designator of Substrate | Material Composition / Dielectric Layer | Types | DK @ 10GHz & Tolerance | Thermal Change of Dk(ppm/℃) | Loss Tangent, Df@10GHz | Thermal Conductivity(W/mk) | Td (℃) | Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃) | Density (g/cm3): | Volume Resisivity (Mohm.cm) | Surface Resistivity (Mohm) | Moisture Absorption (%) | Peel Strength (N/cm) (1oz) | Flammability Rating | ||
| X | Y | Z | ||||||||||||||
| F4BTMS | PTFE/Ceramic/Superfine woven glass | F4BTMS220 | 2.20±0.03 | -48 | 0.0010 | 0.35 | 476 | 40 | 45 | 98 | 1.80 | 1X108 | 1X108 | 0.02 | 20 | V-0 |
| F4BTMS294 | 2.94±0.04 | -20 | 0.0012 | 0.58 | 490 | 10 | 12 | 22 | 2.25 | 1X108 | 1X108 | 0.03 | 12 | V-0 | ||
| F4BTMS300 | 3.00±0.04 | -20 | 0.0013 | 0.58 | 490 | 10 | 11 | 22 | 2.28 | 1X108 | 1X108 | 0.04 | 12 | V-0 | ||
Thickness and size F4BTMS
| Designator of Substrate | Standard Dielectric Thickness(Without the cladding) and Tolerance | Available Copper Foil | Standard Size | |
| F4BTMS | 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) | Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. | 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper | 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48") |
| PCB Capability | |
| PCB Material: | Modified PTFE Copper Clad with Ceramic Filler |
| Designator: | F4BTMS220 |
| Dielectric constant @ 10GHz: | 2.2 |
| Layer count: | Single Layer |
| Copper weight: | 0.5oz, 1oz |
| PCB thickness: | 1.2mm - 9.0mm |
| 0.047” - 0.354” | |
| Solder mask: | Green, Red, Black, White, Blue etc. |
| PCB size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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