Bicheng Electronics Technology Co., Ltd
| Layer count | 2 layers |
| Base material | TFA294 glass-free ceramic PTFE composite substrate |
| Solder mask | No |
| Copper weight | 1oz |
| Surface finish | Immersion gold |
| Silkscreen | No |
| PCB thickness | 1.1mm |
| PCB size | 97.53mm × 100.28mm (1 piece), tolerance: ±0.15mm |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng |
| Model Number | BIC-273.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Layer count | 2 layers | Base material | TFA294 glass-free ceramic PTFE composite substrate |
| Solder mask | No | Copper weight | 1oz |
| Surface finish | Immersion gold | Silkscreen | No |
| PCB thickness | 1.1mm | PCB size | 97.53mm × 100.28mm (1 piece), tolerance: ±0.15mm |
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng | Model Number | BIC-273.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Black Coverlay Flexible PCB Board ，1oz Copper Flexible PCB Board ，Flexible 1 oz Copper PCB | ||
This custom 2-layer rigid high-frequency PCB utilizes aerospace-grade TFA294 glass-free ceramic PTFE composite dielectric substrate. Engineered for ultra-stable, low-loss microwave and millimeter-wave applications, the board features immersion gold surface finishing with a fully solder mask-free and silkscreen-free double-sided structure. Every unit undergoes 100% electrical testing prior to shipment, ensuring superior consistency and long-term reliability for high-end RF and aerospace electronic systems.
PCB Specifications
| Parameter Item | Specification |
| Base Material | TFA294 glass-free ceramic PTFE composite substrate |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 97.53mm × 100.28mm (1 piece), tolerance: ±0.15mm |
| Minimum Trace / Space | 4 mils / 6 mils |
| Minimum Mechanical Hole Size | 0.35mm |
| Via Type | Only through-hole vias, no blind vias |
| Finished Board Thickness | 1.1mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Silkscreen Layer | Silkscreen-free on both top and bottom sides |
| Solder Mask Layer | Fully solder mask-free on both sides |
| Quality Test | 100% electrical testing implemented prior to shipment |
PCB Layer Stack-up Structure
| Layer Name | Specification |
| Copper Layer 1 (Top) | 35μm finished copper thickness |
| Dielectric Core | TFA294 ceramic PTFE substrate, 1.016mm (40mil) thickness |
| Copper Layer 2 (Bottom) | 35μm finished copper thickness |
Artwork & Quality Standards
Artwork Format: Fabricated with standard Gerber RS-274-X files to ensure precise circuit patterning and full manufacturing compatibility.
Quality Standard: All fabrication and inspection processes comply rigorously with IPC-Class-2 reliability specifications for stable performance and long-term structural durability.
Service Coverage: support global delivery and reliable product supply for international high-frequency PCB projects.
TFA Series Material Overview
The TFA series represents advanced glass-free PTFE ceramic composite dielectric substrates, adopting innovative nano-ceramic mixing and specialized lamination processes instead of traditional glass fiber impregnation manufacturing. Eliminating the fiberglass effect during electromagnetic wave propagation, this material minimizes X/Y/Z-axis anisotropy and delivers ultra-uniform electrical, thermal and mechanical properties. It features excellent frequency stability, ultra-low dielectric loss and copper-matched thermal expansion performance. Available with four customizable dielectric constants (2.94, 3.0, 6.15, 10.2), the TFA series serves as high-reliability, aerospace-grade alternatives to imported high-frequency substrates.
TFA294 Core Features & Benefits
Stable Dielectric Performance: Delivers a stable DK of 2.94 at 10GHz and ultra-low DF of 0.0010 (10/20GHz) / 0.0012 (40GHz), enabling low-loss broadband and millimeter-wave signal transmission.
Ultra-Low TCDK: Maintains a minimal TCDK of -5 ppm/°C across -55°C to 150°C, guaranteeing steady dielectric properties under extreme temperature variations.
Balanced Low CTE: Features matched CTE values (18 ppm/°C X/Y, 32 ppm/°C Z-axis) in the range of -55°C to 288°C, mitigating thermal stress and enhancing PTH structural reliability.
Efficient Thermal Dissipation: With 0.59 W/mk thermal conductivity, it rapidly dissipates operational heat and prevents performance degradation under continuous high-power working conditions.
Low Moisture Sensitivity: Ultra-low 0.03% moisture absorption prevents electrical parameter drift in humid environments, ensuring long-term stable circuit operation.
Typical Application Scenarios
Leveraging glass-free structure, ultra-low loss, extreme temperature stability and minimal anisotropy, TFA294 PCBs are ideal for high-precision and phase-sensitive high-frequency systems in aerospace, military and satellite communication fields:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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