2-layer WL-CT338 PCB 1.47mm Thick High-Frequency Circuit

Product Specification

This custom 4-layer hybrid high-frequency PCB adopts WL-CT338 thermoset hydrocarbon ceramic glass-reinforced substrate combined with high-Tg FR4 dielectric materials. Featuring dual-side green solder mask with white legend and ENIG surface finish, the PCB applies differentiated inner/outer copper weight, standard FR4 fabrication process and stable lamination structure. With finished lamination thickness of 1.47mm and board dimension 175mm×121mm (10pcs), it delivers outstanding thermal stability, low high-frequency loss, matched CTE performance and superior machinability for aerospace, radar and high-power RF electronic applications.

PCB Specifications

WL-CT338 Material Overview

WL-CT338 is a single-type thermoset hydrocarbon ceramic glass-reinforced copper clad laminate dedicated to high-frequency multilayer PCB fabrication. Formulated with modified hydrocarbon resin, functional ceramic filler and reinforced glass fabric, it adopts mature thermoset structure instead of thermoplastic PTFE material. It supports standard FR4 fabrication workflow, delivers easier machining, higher circuit uniformity and better production stability, which can fully substitute imported equivalent high-frequency laminates.

Featuring optimized ceramic-hydrocarbon compound formula, WL-CT338 owns low high-frequency dielectric loss, superior thermal resistance and steady dielectric temperature stability. It has low thermal expansion coefficient and ultra-high Tg over 280℃, with fixed Dk=3.38 for stable high-frequency circuit design.

WL-CT338 can be bonded with ED copper foil or reversed RTF copper foil. Reversed RTF copper foil achieves premium PIM performance, reduced conductor loss and insertion loss; its glue-backed structure adds 0.018mm (0.7mil) thickness to strengthen copper bonding force. This substrate matches aluminum base for customized aluminum high-frequency PCBs. Compatible with standard FR4 process, it allows repeated lamination for multi-layer stack-up, and boasts outstanding workability for dense via and fine trace fabrication.

Core Material Features

Tight Dk Tolerance & Low Loss: Stable dielectric constant with low dissipation factor for high-frequency signal transmission

Premium Thermoset System: Hydrocarbon ceramic thermoset resin ensures superior PCB machinability and thermal resistance

Excellent Temperature Stability: Minor dielectric parameter variation under fluctuating ambient temperature

Copper-Matched CTE: X/Y-axis CTE matches copper foil, low Z-axis CTE guarantees dimensional stability and hole copper reliability

Ultra-High Tg Performance: Tg ≥280℃, maintains stable dimension and intact hole copper structure under high-temperature conditions

Superior Thermal Conductivity: Higher heat dissipation efficiency than peer thermoplastic substrates, ideal for high-power operating scenarios

Commercial Cost Efficiency: Mass production available with favorable cost-performance ratio

Radiation Resistance: Retains stable dielectric and physical properties after specified radiation dosage exposure

Low Outgassing Property: Complies with aerospace vacuum outgassing requirements per industry vacuum volatility test standards

Typical Application Fields

• Aerospace equipment, space cabin devices and airborne electronic systems
• Microwave devices, antennas and phase-sensitive antenna systems
• Early warning radar, airborne radar and other military radar facilities
• Phased array antennas and beam-forming network modules
• Satellite communication and precision navigation systems
• High-power RF amplifier components