Bicheng Electronics Technology Co., Ltd
| Layer count | 2 Layers |
| Base material | WL-CT300 high-frequency thermosetting dielectric material |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Solder mask | No |
| Copper weight | 1oz |
| Surface finish | Pure Gold Plating |
| Silkscreen | Black |
| PCB thickness | 0.25mm |
| PCB size | 66.04mm × 43.18mm (1 piece), dimensional tolerance: ±0.15mm |
| Brand Name | Bicheng |
| Model Number | BIC-279.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Layer count | 2 Layers | Base material | WL-CT300 high-frequency thermosetting dielectric material |
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Solder mask | No | Copper weight | 1oz |
| Surface finish | Pure Gold Plating | Silkscreen | Black |
| PCB thickness | 0.25mm | PCB size | 66.04mm × 43.18mm (1 piece), dimensional tolerance: ±0.15mm |
| Brand Name | Bicheng | Model Number | BIC-279.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | PI Material Flexible PCB Board ，No Peelable Flexible PCB Board | ||
This custom 2-layer rigid high-frequency PCB is fabricated with Wangling WL-CT300 thermosetting dielectric substrate, engineered for high-reliability RF, microwave and antenna system applications. The board adopts pure gold plating surface finishing, with black silkscreen printed on the top layer, no silkscreen on the bottom layer, and is constructed without double-sided solder mask.
PCB Specification
| Parameter Item | Specification |
| Base Material | WL-CT300 high-frequency thermosetting dielectric material |
| Layer Count | 2 layers rigid PCB |
| Board Dimensions | 66.04mm × 43.18mm (1 piece), dimensional tolerance: ±0.15mm |
| Minimum Trace / Space | 4 mils / 5 mils |
| Minimum Mechanical Hole Size | 0.25mm |
| Via Type | No blind vias adopted; only through-hole vias are used |
| Finished Board Thickness | 0.25mm |
| Outer Layer Finished Copper Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20μm |
| Surface Finish | Pure Gold Plating |
| Silkscreen Layer | Black silkscreen on top surface; no silkscreen on bottom surface |
| Solder Mask Layer | No top and bottom solder mask |
| Quality Test | 100% full electrical continuity and insulation test implemented before shipment |
PCB Layer Stack-up Structure
| Layer Name | Specification |
| Copper Layer 1 (Top Layer) | 35μm finished copper thickness |
| Dielectric Core | Wangling WL-CT300 high-frequency material, 0.127mm (5mil) thickness |
| Copper Layer 2 (Bottom Layer) | 35μm finished copper thickness |
Artwork & Quality Standards
Artwork Format: Production-ready Gerber RS-274-X data is provided, which is the universal industry standard to ensure precise circuit patterning and full manufacturing compatibility.
Quality Standard: Manufactured and inspected in accordance with IPC-Class-2 reliability criteria, satisfying standard commercial and industrial electronic application requirements.
Supply Coverage: Facilitates global shipping to meet project requirements.
Wangling WL-CT300 Material Overview
Wangling WL-CT300 is a high-performance thermosetting copper-clad laminate tailored for high-frequency applications. It consists of hydrocarbon resin, composite ceramic filler and fiberglass reinforcement, delivering excellent low-loss dielectric properties to meet rigorous high-frequency circuit design demands.
Distinct from conventional PTFE substrates, WL-CT300 supports standard FR4 fabrication processes, offering simpler processing, higher production consistency and better cost efficiency. It serves as a high-performance alternative to imported equivalent high-frequency materials.
The synergistic combination of hydrocarbon resin and composite ceramic enables stable dielectric constant and loss tangent, low thermal expansion coefficient and outstanding high-temperature resistance. With a glass transition temperature (Tg) exceeding 280°C, this material maintains superior structural and electrical stability for high-reliability high-frequency scenarios.
Core Material Performance Features
Stable Low-Loss Dielectric Properties: Features consistent ultra-low high-frequency loss (DK=3.00, DF=0.0025 @10GHz/23°C) to ensure stable and accurate high-frequency signal transmission.
Outstanding Thermal Stability: Low TCDK, high thermal conductivity and ultra-high Tg provide excellent thermal stability and heat dissipation capacity under variable temperatures.
High Mechanical & Structural Stability: Well-matched CTE with copper reduces thermal stress, enhancing structural stability and reliability for high-density and high-temperature usage.
Superior Environmental Adaptability: Low moisture absorption guarantees steady electrical and mechanical performance, adapting to long-term outdoor and industrial complex environments.
WL-CT300 Material Properties
| Dielectric Constant (DK) | 3.00 @10 GHz/23°C |
| Dissipation Factor (DF) | 0.0025 @10GHz |
| Thermal Coefficient of Dielectric Constant (TCDK) | 27 ppm/°C |
| Thermal Conductivity | 0.41 W/m·K |
| Coefficient of Thermal Expansion (CTE) | X-axis: 15 ppm/°C; Y-axis: 14 ppm/°C; Z-axis: 31 ppm/°C |
| Moisture Absorption | 0.15% |
| Glass Transition Temperature (Tg) | >280°C |
| Applicable Copper Foil | Standard electrolytic copper foil: 0.5oz, 1oz |
Typical Application Scenarios
Benefiting from ultra-low high-frequency loss, exceptional thermal stability, reliable mechanical performance and FR4-compatible manufacturability, WL-CT300 PCBs are widely applied in high-precision RF, microwave and antenna systems, covering the following fields:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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