Bicheng Electronics Technology Co., Ltd
| Layer count | 2 Layers |
| Base material | Rogers TMM6 ceramic thermoset polymer composite laminate |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Solder mask | No |
| Copper weight | 1oz |
| Surface finish | EPIG (Nickel-free) |
| Silkscreen | No |
| PCB thickness | 1.35mm |
| PCB size | 85.6mm × 99.75mm (1 piece), dimensional tolerance: ±0.15mm |
| Brand Name | Bicheng |
| Model Number | BIC-276.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Layer count | 2 Layers | Base material | Rogers TMM6 ceramic thermoset polymer composite laminate |
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Solder mask | No | Copper weight | 1oz |
| Surface finish | EPIG (Nickel-free) | Silkscreen | No |
| PCB thickness | 1.35mm | PCB size | 85.6mm × 99.75mm (1 piece), dimensional tolerance: ±0.15mm |
| Brand Name | Bicheng | Model Number | BIC-276.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | White Silkscreen Flexible PCB Board ，FR4 Stiffner Flexible PCB Board ，FR4 Stiffner Flex Circuit Board | ||
PCB Specifications
| Parameter Item | Specification |
| Base Material | Rogers TMM6 ceramic thermoset polymer composite laminate |
| Layer Configuration | 2-layer rigid PCB structure |
| Board Dimension | 85.6mm × 99.75mm (1 piece), dimensional tolerance: ±0.15mm |
| Minimum Trace / Space | 4 mils / 6 mils |
| Minimum Mechanical Hole Diameter | 0.35mm |
| Via Type | Pure through-hole via design, no blind vias implemented |
| Finished Board Thickness | 1.35mm |
| Outer Copper Weight | 1oz (1.4 mils) for external copper layers |
| Via Plating Thickness | 20μm |
| Surface Finishing | EPIG (Nickel-free) for high-precision assembly |
| Silkscreen Layer | Silkscreen-free on both top and bottom surfaces |
| Solder Mask Layer | Solder mask-free on double sides |
| Quality Inspection | 100% full electrical testing performed before delivery |
PCB Layer Stack-up Structure
| Layer Definition | Technical Specification |
| Top Copper Layer | 35μm finished copper thickness |
| Dielectric Core Substrate | Rogers TMM6 core, 1.27mm (50mil) thickness |
| Bottom Copper Layer | 35μm finished copper thickness |
Fabrication & Quality Compliance
Fabrication File Format: Manufactured based on standard Gerber RS-274-X datasets, enabling precise circuit patterning and full compatibility with industrial PCB manufacturing workflows.
Quality Compliance: All production and inspection procedures strictly adhere to IPC-Class-2 reliability standards, ensuring consistent electrical performance and long-term structural durability for commercial and industrial RF applications.
Global Supply: Worldwide logistics support is available to deliver stable, standardized products for global high-frequency PCB projects.
Rogers TMM6 Material Profile
Rogers TMM6 is a premium ceramic-reinforced thermoset polymer composite microwave laminate, specifically engineered to deliver superior plated-through-hole reliability for stripline and microstrip circuit architectures. It synergizes the technical merits of ceramic dielectric materials and traditional PTFE microwave substrates while eliminating the complex manufacturing requirements of conventional high-frequency dielectrics. Featuring a distinctive, tightly stabilized dielectric constant within the TMM product family, this thermoset substrate delivers balanced electrical, thermal and mechanical performance, serving as a cost-efficient and highly dependable solution for diverse high-frequency circuit designs.
Material Advantages
Copper-Matched Thermal Expansion: Well-calibrated tri-axis CTE matches copper’s thermal expansion, alleviating thermal stress during temperature cycling and avoiding delamination, cracking and PTH defects for durable structural reliability.
Superior Mechanical Stability: Robust mechanical properties resist creep and cold flow under continuous operating load, retaining accurate circuit geometry and stable electrical performance over long-term service.
Excellent Chemical Resistance: Tolerates conventional PCB processing chemicals and cleaners, reducing substrate damage during production and optimizing fabrication yield and quality stability.
Wire-Bonding Adaptability: The inherent thermoset resin structure enables dependable wire-bonding capability, suitable for high-precision assembly and advanced packaging scenarios.
Full Process Compatibility: Compliant with standard PCB manufacturing workflows without specialized PTFE processing, lowering production costs and shortening lead time.
Typical Application Fields
Benefiting from stable dielectric characteristics, low high-frequency loss, copper-matched thermal stability and outstanding process adaptability, TMM6-based PCBs are widely applied in high-precision industrial and commercial RF and microwave systems:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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