60mil F4BME275 PCB 2-layer Black Solder Mask Pure Gold Plating

Product Specification

This 2-layer F4BME275 RF PCB is a high-performance microwave circuit board purpose-built for demanding RF and high-frequency microwave scenarios. Adopting Wangling’s upgraded F4BME275 high-stability PTFE composite laminate and premium reverse-treated (RTF) copper foil, this rigid PCB features a thickened 1.6mm finished board thickness and high-precision 5μm pure gold surface plating.

What Is F4BME275? Advanced Substrate Introduction

F4BME275 is a next-generation high-performance PTFE composite laminate developed by Wangling, specially optimized for high-standard RF and microwave circuit applications. Manufactured with precision-blended woven fiberglass cloth, high-purity PTFE resin, and specialized composite film, this substrate delivers highly consistent and reliable electrical performance across high-frequency operating environments.

As an upgraded iteration of the classic F4BM275 material, F4BME275 achieves comprehensive performance upgrades with lower dielectric loss, higher insulation resistance, and superior long-term parameter stability. It serves as a cost-effective, high-reliability domestic alternative to mainstream imported high-frequency laminates. Standardly clad with reverse-treated (RTF) copper foil, the material ensures excellent low-PIM performance, supports precise fine-line circuit etching, and effectively reduces high-frequency conductor loss, fully meeting the requirements of high-precision RF circuit designs.

Core Features & Advantages of F4BME275

F4BME275 features customizable electrical and mechanical properties through precisely calibrated PTFE and fiberglass ratio blending, achieving an optimal balance between low-loss performance, structural stability, and manufacturability for diverse high-frequency circuit designs:

Tunable Dielectric Performance: Features a precisely adjustable fiberglass-to-PTFE ratio, delivering a stable dielectric constant (Dk) of 2.75 at 10GHz with ultra-low dielectric loss. This customizable dielectric property enables flexible impedance matching and precise material adaptation for various civilian and military high-frequency band designs

Enhanced Dimensional Stability: Optimized fiberglass composition effectively lowers thermal expansion and suppresses dielectric temperature drift. The material maintains stable physical and electrical performance across -55°C to 125°C, minimizing board warpage and parameter deviation under alternating thermal operating conditions

Balanced Comprehensive Performance: Adopts a scientific performance trade-off formula with moderate fiberglass proportioning. It significantly improves mechanical rigidity and structural flatness while retaining ultra-low dissipation factor (Df) characteristics, ensuring stable low-loss high-frequency signal transmission up to 20GHz

High Design Flexibility: Supports customizable dielectric constant configurations and structural optimization. RF engineers can tailor material parameters to perfectly balance high-frequency electrical performance, mechanical load-bearing robustness, and SMT/through-hole production process adaptability for diverse RF product development

Superior Low-PIM & Low-Loss Performance: Paired with premium RTF reverse-treated copper foil, it greatly reduces high-frequency conductor loss.

Reliable Insulation Performance: Upgraded composite formula delivers excellent volume insulation resistance, effectively isolating high-frequency circuit signals

Key PCB Construction Specifications

2-Layer F4BME275 PCB Stack-up Structure

This professional 2-layer rigid stackup adopts high-performance F4BME275 PTFE composite core, paired with low-loss RTF copper foil. The balanced layered structure minimizes high-frequency signal loss and ensures uniform mechanical and electrical performance, ideal for precision microwave and RF applications:

PCB Statistics

Accepted Artwork Format: We support standard Gerber RS-274-X design file submissions from global customers. This universal industry-standard format enables accurate technical assessment, customized quotation, and precise mass production, ensuring efficient and error-free collaboration for all international PCB customization projects.

Production Quality Standard: All F4BME275 high-frequency RF PCBs are manufactured and inspected in strict accordance with IPC-Class-2 industrial reliability criteria. Standardized production processes and rigorous quality inspections guarantee excellent dimensional consistency and stable electrical performance for every batch.

Global Supply Service: We provide worldwide custom PCB quotation and international shipping services. Global clients can submit Gerber files for exclusive customized quotes, with full one-stop services including technical confirmation, precision manufacturing, comprehensive quality testing, and global logistics delivery.

Typical Application Scenarios

Microwave, RF & Radar Systems: High-frequency microwave modules, general RF signal circuits, and precision radar detection equipment

RF Passive Components: High-performance phase shifters and various precision passive RF functional components

Power Distribution Components: Custom power dividers, RF couplers, and signal combiners for communication systems

Antenna Feed Systems: Antenna feed network modules and high-precision phased array antenna systems

Wireless Communication Equipment: Satellite communication terminals and high-stability base station antenna systems