Bicheng Electronics Technology Co., Ltd
| Layer count | 2 Layers |
| Base material | F4BTMS265 |
| Solder mask | Black |
| Copper weight | 1oz (1.4 mils) outer copper layer |
| Surface finish | ENIG (Electroless Nickel Immersion Gold) |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Silkscreen | White |
| PCB thickness | 0.85mm |
| PCB size | 97mm × 76mm (1 piece), dimensional tolerance: ±0.15mm |
| Brand Name | Bicheng |
| Model Number | BIC-268.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Layer count | 2 Layers | Base material | F4BTMS265 |
| Solder mask | Black | Copper weight | 1oz (1.4 mils) outer copper layer |
| Surface finish | ENIG (Electroless Nickel Immersion Gold) | Payment Terms | T/T |
| Supply Ability | 5000PCS per month | Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons | Silkscreen | White |
| PCB thickness | 0.85mm | PCB size | 97mm × 76mm (1 piece), dimensional tolerance: ±0.15mm |
| Brand Name | Bicheng | Model Number | BIC-268.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Polyimide Stiffener 4 Layer Flex PCB ，2 Oz Copper 4 Layer Flex PCB ，Polyimide Stiffener 2 Oz Copper PCB | ||
This 2-layer rigid high-frequency PCB features aerospace-grade F4BTMS265 ceramic-filled dielectric substrate with low electromagnetic loss and minimal anisotropy. It adopts ENIG surface treatment, black top solder mask and white top silkscreen, with a fully mask-free and silkscreen-free bottom side. All units pass 100% electrical testing before delivery, ensuring stable dielectric performance, low signal attenuation and reliable structure for aerospace, military and RF/microwave applications.
PCB Specifications
| Parameter Item | Specification |
| Base Material | F4BTMS265 upgraded ceramic-filled high-frequency substrate |
| Layer Configuration | 2-layer rigid PCB structure |
| Board Dimension | 97mm × 76mm (1 piece), dimensional tolerance: ±0.15mm |
| Minimum Trace / Space | 14 mils / 14 mils |
| Minimum Mechanical Hole Diameter | 0.25mm |
| Via Type | Pure through-hole vias, no blind vias |
| Finished Board Thickness | 0.85mm |
| Outer Copper Weight | 1oz (1.4 mils) outer copper layer |
| Via Plating Thickness | 20μm |
| Surface Finishing | ENIG (Electroless Nickel Immersion Gold) |
| Top Silkscreen | White silkscreen |
| Bottom Silkscreen | Silkscreen-free |
| Top Solder Mask | Black solder mask |
| Bottom Solder Mask | Solder mask-free |
| Quality Inspection | 100% full electrical testing performed prior to delivery |
PCB Layer Stack-up Structure
| Layer Definition | Technical Specification |
| Top Copper Layer | 35μm finished copper thickness |
| Dielectric Core Substrate | F4BTMS265 core, 0.762mm (30mil) thickness |
| Bottom Copper Layer | 35μm finished copper thickness |
Artwork & Quality Compliance
Production File Standard: Fabricated based on industry-standard Gerber RS-274-X files, supporting high-precision circuit patterning and full compatibility with mainstream industrial manufacturing processes.
Quality Standard: All fabrication and inspection procedures comply strictly with IPC-Class-2 specifications, ensuring stable electrical performance and long-term structural reliability.
Global Availability: Worldwide supply and logistics services are available to support global aerospace and high-frequency electronic projects.
F4BTMS265 Material Profile
F4BTMS265 is an upgraded high-reliability ceramic-reinforced PTFE dielectric substrate optimized from the standard F4BTM series. Filled with uniformly distributed nano-ceramic particles and ultra-fine glass fiber, it reduces glass fiber-caused electromagnetic interference, dielectric loss and structural anisotropy. Adopting low-roughness RTF copper foil as standard, it delivers low conductor loss and stable peel strength, and supports copper/aluminum base lamination. With excellent dimensional, thermal and dielectric stability, this aerospace-grade material serves as a high-performance substitute for imported high-frequency substrates in military and aerospace applications.
Typical Application Fields
Featuring ultra-low dielectric loss, minimal structural anisotropy, superior thermal stability and aerospace-grade reliability, F4BTMS265-based PCBs are well-suited for deployment in high-precision, phase-sensitive high-frequency electronic systems:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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