| Solder mask | No |
| PCB size | 45mm × 87mm (±0.15mm tolerance, 1 piece) |
| Layer count | 2 layers |
| Surface finish | EPIG |
| PCB thickness | 0.3mm |
| Copper weight | 1oz (1.4 mils) outer layers |
| Silkscreen | No |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | TLY-5 |
| Brand Name | Bicheng |
| Model Number | BIC-266.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Solder mask | No | PCB size | 45mm × 87mm (±0.15mm tolerance, 1 piece) |
| Layer count | 2 layers | Surface finish | EPIG |
| PCB thickness | 0.3mm | Copper weight | 1oz (1.4 mils) outer layers |
| Silkscreen | No | Payment Terms | T/T |
| Supply Ability | 5000PCS per month | Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons | Base material | TLY-5 |
| Brand Name | Bicheng | Model Number | BIC-266.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 0.5oz Copper Thin Flex PCB ,IPC 6012 Class 2 Thin Flex PCB ,IPC 6012 Class 2 WiFi Antenna PCB | ||
This 2-layer TLY-5 rigid PCB is a premium ultra-low-loss high-frequency circuit board tailored for millimeter-wave and high-precision RF applications. Built with high-stability TLY-5 woven fiberglass-reinforced PTFE laminate, this rigid PCB features a 0.3mm finished board thickness and reliable EPIG surface finish, paired with 1oz outer-layer copper. Produced under strict IPC-Class-2 guidelines and 100% electrically tested prior to delivery, it delivers minimal dielectric loss, outstanding dimensional stability, and steady electrical performance for 77GHz automotive radar, satellite communication, Ka/E/W-band millimeter-wave equipment, and aerospace high-reliability systems. We welcome global Gerber file inquiries and offer worldwide shipping.
What Is TLY-5 Laminate? High-Stability Low-Loss Substrate Introduction
TLY-5 represents a premium grade of high-frequency PTFE composite substrate, utilizing ultra-light woven fiberglass reinforcement to achieve far better dimensional stability than conventional chopped-fiber PTFE materials. Its refined woven structural matrix enhances overall mechanical uniformity and structural consistency, making TLY-5 an ideal choice for large-scale mass production.
Thanks to its ultra-low dissipation factor and tightly controlled dielectric constant tolerance, TLY-5 substrates sustain stable signal transmission across diverse millimeter-wave frequency bands. It effectively mitigates high-frequency signal attenuation, frequency drift, and structural deformation issues commonly found in ordinary high-frequency PCBs, ensuring long-term dependable operation for precision radar, wireless communication, and RF amplifier systems.
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Core Performance Features of TLY-5 High-Frequency PCB
The TLY-5 substrate delivers superior electrical, physical, and thermal characteristics, fully satisfying rigorous industrial and aerospace-grade standards for high-frequency circuit operation:
Precise Dielectric Constant (Dk): Stable Dk of 2.2 with a tight tolerance of ±0.02 at 10 GHz/23°C, ensuring consistent high-frequency signal transmission accuracy
Ultra-Low Dissipation Factor (Df): Extremely low loss tangent of 0.0009 at 10GHz, minimizing high-frequency signal attenuation and transmission loss
Stable Physical Density: Standard specific gravity of 2.19 g/cm3, realizing lightweight PCB design while maintaining structural rigidity
Superior Moisture Resistance: Ultra-low moisture absorption rate of 0.02%, preventing electrical performance degradation in humid working environments
Controllable Thermal Expansion Coefficient (CTE): X-axis 26 ppm/°C, Y-axis 15 ppm/°C, Z-axis 217 ppm/°C, matching copper foil expansion and contraction to avoid board cracking and circuit failure
Key Benefits of TLY-5 PCB
Featuring balanced and comprehensive performance strengths, TLY-5 woven fiberglass PTFE substrates outperform many mainstream high-frequency materials, providing stable, cost-effective, and high-reliability solutions for advanced RF and millimeter-wave applications:
Excellent Dimensional Stability: Woven fiberglass structure avoids deformation and size deviation during processing and long-term use
Industry-Leading Low DF Performance: Ultra-low loss tangent ensures ultra-low attenuation transmission for millimeter wave signals
Superior Moisture Resistance: Low moisture absorption adapts to complex environmental working conditions
High Copper Peel Strength: Reliable bonding performance between copper foil and substrate, avoiding circuit peeling and failure
Uniform and Consistent DK: Tight dielectric constant tolerance ensures batch product performance consistency
Key PCB Construction Specifications
| Parameter Item | Specific Specification |
| Base Material | TLY-5 woven fiberglass reinforced PTFE laminate |
| Layer Count | 2 layers (rigid structure) |
| Board Dimensions | 45mm × 87mm (±0.15mm tolerance, 1 piece) |
| Minimum Trace/Space | 6/10 mils, adapting to high-precision RF circuit design |
| Minimum Hole Size | 0.4mm |
| Via Design | No blind vias, only through-hole vias for stable structure |
| Finished Board Thickness | 0.3mm, ultra-thin for compact millimeter wave device integration |
| Finished Copper Weight | 1oz (1.4 mils) outer copper layers, stable current carrying and signal transmission |
| Via Plating Thickness | 20μm, ensuring reliable via conductivity and oxidation resistance |
| Surface Finish | EPIG, optimizing soldering reliability and component adhesion |
| Silkscreen | No top & bottom silkscreen, ensuring pure high-frequency signal transmission |
| Solder Mask | No top & bottom solder mask |
| Quality Test Standard | 100% full electrical testing before shipment to eliminate open/short circuit defects |
2-Layer TLY-5 PCB Stack-up Structure
This standardized 2-layer rigid stack-up adopts high-stability TLY-5 dielectric material, featuring balanced layered stress distribution and exceptional high-frequency signal stability, perfectly suited for professional millimeter-wave operating environments:
| Layer Sequence | Material Specification | Thickness | Core Function |
| Outer Layer 1 (Top) | Conductive Copper Foil | 35μm | Millimeter wave signal transmission and component soldering carrier |
| Core Dielectric Layer | TLY-5 high-frequency PTFE laminate | 0.191mm (7.5mil) | Low-loss dielectric isolation, stable high-frequency signal transmission foundation |
| Outer Layer 2 (Bottom) | Conductive Copper Foil | 35μm | Auxiliary circuit transmission and structural balance support |
PCB Statistics
| Parameter Item | Specific Value |
| Components | 37 |
| Total Pads | 149 |
| Thru Hole Pads | 85 |
| Top SMT Pads | 64 |
| Bottom SMT Pads | 0 |
| Vias | 139 |
| Nets | 2 |
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Accepted Artwork Format: We accept standard Gerber files RS-274-X format from global clients. This industry-standard file format enables precise technical evaluation, accurate custom quoting, and streamlined formal production, ensuring smooth, error-free technical collaboration for all international PCB customization projects.
Production Quality Standard: All TLY-5 high-frequency PCBs are manufactured and inspected in strict accordance with IPC-Class-2 industrial reliability specifications. Rigorous standardized production and quality control procedures guarantee consistent dimensional precision and stable electrical performance for every production batch.
Global Supply Service: We provide worldwide customized PCB quotation and international shipping services. Clients globally can submit Gerber files for exclusive custom quotes, and we deliver full one-stop solutions covering PCB quotation, precision manufacturing, comprehensive quality inspection, and global logistics delivery.
Typical Application Scenarios
Combining ultra-low signal loss, outstanding structural stability, and superior millimeter-wave frequency performance, TLY-5 2-layer PCBs are widely adopted in high-end RF systems, millimeter-wave devices, and aerospace precision electronic equipment:
Automotive Radar: 77GHz vehicle-mounted millimeter wave radar detection systems
Satellite & Cellular Communications: Satellite communication terminals and cellular base station RF modules
Power Amplifiers: High-frequency RF power amplifier circuit boards
LNB, LNA & LNC Devices: Low-noise amplifiers and low-noise block downconverters
Aerospace Equipment: Aerospace precision communication and detection modules
Millimeter Wave Band Applications: Professional Ka-band, E-band, and W-band high-frequency devices
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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