| Layer count | 2 layers (double-sided rigid PCB structure) |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Copper weight | 35um |
| Silkscreen | Black |
| Surface finish | Immersion Gold |
| Solder mask | No |
| PCB size | 56.8mm × 78.09mm, dimensional tolerance: ±0.15mm (1 piece) |
| PCB thickness | 0.2mm ultra-thin profile |
| Base material | WL-CT350 |
| Brand Name | Bicheng |
| Model Number | BIC-258.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Layer count | 2 layers (double-sided rigid PCB structure) | Payment Terms | T/T |
| Supply Ability | 5000PCS per month | Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons | Copper weight | 35um |
| Silkscreen | Black | Surface finish | Immersion Gold |
| Solder mask | No | PCB size | 56.8mm × 78.09mm, dimensional tolerance: ±0.15mm (1 piece) |
| PCB thickness | 0.2mm ultra-thin profile | Base material | WL-CT350 |
| Brand Name | Bicheng | Model Number | BIC-258.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | NO Silkscreen Double Sided Flexible PCB ,0.3mm Double Sided Flexible PCB ,0.3mm Double Sided Flex PCB | ||
The 2-layer WL-CT350 PCB is a high-stability, cost-efficient high-frequency circuit board engineered for modern microwave and RF signal transmission applications. Utilizing premium WL-CT350 organic polymer ceramic copper-clad laminate and 1oz outer copper cladding, this ultra-thin 0.2mm rigid PCB features high-reliability Immersion Gold surface finishing, top-only black silkscreen, and a solder-mask-free dual-sided design that optimizes high-frequency electrical performance and thermal dissipation.
What Is WL-CT350? Material Introduction
WL-CT350 is a high-performance thermoset resin-based high-frequency copper-clad laminate reinforced with organic polymer ceramic fillers and fiberglass fabric. Its dielectric layer is formulated with hydrocarbon resin, composite ceramic particles, and fiberglass substrate, delivering exceptional low-loss electrical characteristics optimized for high-frequency circuit designs. Unlike complex and hard-to-process PTFE materials, WL-CT350 adopts FR4-compatible manufacturing workflows, which greatly simplifies PCB fabrication, improves production consistency, and ensures stable batch-to-batch quality, making it an ideal domestic alternative to imported high-frequency laminates.
The proprietary composite combination of hydrocarbon resin and ceramic fillers grants WL-CT350 outstanding high-temperature endurance and robust thermal dielectric stability. This material series maintains steady dielectric constant and loss factor across varying temperatures, features low thermal expansion, and achieves a high glass transition temperature (Tg) above 280°C. These properties guarantee consistent electrical performance and structural integrity under prolonged high-frequency operation and fluctuating thermal conditions.
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Core Features of WL-CT350 PCB Material
Engineered to balance low-loss high-frequency performance, reliable thermal stability, and excellent processability, WL-CT350 high-frequency laminates fully satisfy the precision and mass-production requirements of commercial RF and microwave circuits:
| Core Feature | Technical Parameter |
| Stable Dielectric Constant | Dk = 3.48 @ 10GHz / 23°C |
| Low Dissipation Factor | Df = 0.0039 @ 10GHz |
| Excellent Thermal Dk Stability | TCDK = 52 ppm/°C |
| Efficient Thermal Conductivity | Thermal conductivity = 0.7 W/MK |
| Ultra-Low Moisture Absorption | Moisture absorption = 0.05% |
| Copper-Matched CTE | 11ppm/°C (X-axis), 14ppm/°C (Y-axis), 34ppm/°C (Z-axis) |
| High Glass Transition Temperature | Tg ≥ 280°C |
Key Performance Benefits of WL-CT350 PCB
WL-CT350 organic polymer ceramic high-frequency material integrates premium RF performance, simplified manufacturability, and long-term reliability, offering outstanding comprehensive advantages for commercial high-frequency PCB mass production:
FR4-Compatible Processing: Fully compatible with conventional FR4 fabrication procedures, featuring simpler processing workflows compared to PTFE-based materials and effectively reducing manufacturing complexity and operational costs
Superior Batch Consistency: Adopts a stabilized composite formulation that delivers uniform dielectric parameters and mechanical performance across mass production batches
Excellent Environmental Stability: Ultra-low moisture absorption paired with robust thermal resistance maintains stable circuit performance in complex and harsh working environments
Cost-Effective Import Substitution: Matches the high-frequency performance of premium imported laminates at a lower cost, serving as an optimal cost-effective solution for large-scale commercial RF applications
Key PCB Construction Specifications
| Parameter Item | Specific Specification |
| Base Material | WL-CT350 organic polymer ceramic fiberglass copper clad laminate |
| Layer Count | 2 layers (double-sided rigid PCB structure) |
| Board Dimensions | 56.8mm × 78.09mm, dimensional tolerance: ±0.15mm (1 piece) |
| Minimum Trace/Space | 6/7 mils, supporting compact and precise high-frequency circuit routing |
| Minimum Hole Size | 0.3mm, enabling dense and compact component layout design |
| Via Design | Through-hole structure only, no blind vias, |
| Finished Board Thickness | 0.2mm ultra-thin profile |
| Finished Copper Weight | 1oz (1.4 mils) outer copper layers |
| Via Plating Thickness | 20μm copper plating thickness |
| Surface Finish | Immersion Gold |
| Silkscreen | Top layer: black silkscreen; Bottom layer: no silkscreen |
| Solder Mask | No solder mask on both top and bottom layers |
| Quality Test Standard | 100% full electrical testing implemented before shipment |
2-Layer WL-CT350 PCB Stack-up Structure
| Layer Sequence | Material Specification | Thickness |
| Outer Layer 1 (Top) | Conductive copper foil | 35μm |
| Core Dielectric Layer | WL-CT350 organic polymer ceramic composite substrate | 0.102mm (4mil) |
| Outer Layer 2 (Bottom) | Conductive copper foil | 35μm |
PCB Circuit & Component Statistics
| Parameter Item | Specific Value |
| Components | 19 |
| Total Pads | 32 |
| Thru Hole Pads | 18 |
| Top SMT Pads | 14 |
| Bottom SMT Pads | 0 |
| Vias | 11 |
| Nets | 2 |
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Accepted Artwork Format: Customers from the global can standard Gerber RS-274-X design files for quotation and manufacturing.
Quality Standard: All custom PCBs are manufactured and inspected in strict accordance with IPC-Class-2 industry standards to ensure stable batch quality and long-term operational reliability.
Global Service: We provide worldwide quotation support, professional technical consultation, and global shipping services for all PCB orders.
Typical Application Scenarios
In summary, the ultra-thin 2-layer WL-CT350 rigid PCB leverages advanced organic polymer ceramic composite technology to deliver low dielectric loss, stable thermal dielectric coefficients, ultra-low moisture absorption, and high Tg performance. Featuring FR4-friendly processing, copper-matched thermal expansion, and outstanding cost performance, this high-frequency PCB serves as a premium alternative to imported materials, ideal for base station communications, satellite equipment, automotive radar, and a wide range of RF and microwave devices.
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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