Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | FR-4 |
| Layer count | 2 layers |
| PCB thickness | 1.0mm ±0.1 |
| PCB size | 120 x 79mm=4PCS |
| Solder mask | Green |
| Silkscreen | White |
| Copper weight | 1oz |
| Surface finish | Immersion Silver |
| Brand Name | Bicheng |
| Model Number | BIC-470.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | FR-4 | Layer count | 2 layers |
| PCB thickness | 1.0mm ±0.1 | PCB size | 120 x 79mm=4PCS |
| Solder mask | Green | Silkscreen | White |
| Copper weight | 1oz | Surface finish | Immersion Silver |
| Brand Name | Bicheng | Model Number | BIC-470.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 1.0mm 2 Layer Circuit Board ，ITEQ FR4 2 Layer Circuit Board ，ITEQ FR4 Immersion Silver PCB | ||
| PCB SIZE | 120 x 79mm=4PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layes |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17.8um(0.5oz)+PLATE |
| FR-4 0.8mm | |
| copper ------- 17.8um(0.5oz)+PLATE | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.5/3.8mm |
| Number of Different Holes: | 4 |
| Number of Drill Holes: | 135 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180A TG>170 |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.0mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Silver, Ag>0.15µm |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| Property | Thickness<0.50 mm | Thickness≧0.50 mm | Units | Test Method | ||
| [0.0197 in] | [0.0197 in] | |||||
| Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
| (English) | (or as noted) | |||||
| Peel Strength, minimum | N/mm | 2.4.8 | ||||
| A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
| B. Standard profile copper foil | 0.88 (5.0) | 0.70 (4.00) | 0.88 (5.0) | 0.70 (4.00) | 2.4.8.3 | |
| 1. After Thermal Stress | ||||||
| 2. At 125°C [257 F] | ||||||
| 3. After Process Solutions | 1.23 (7.0) | 0.80 (4.57) | 1.40 (8.0) | 1.05 (6.00) | ||
| 1.05 (6.0) | 0.70 (4.00) | 1.23 (7.0) | 0.70 (4.00) | |||
| 1.05 (6.0) | 0.55 (3.14) | 1.23 (7.0) | 0.80 (4.57) | |||
| Volume Resistivity, minimum | MW-cm | 2.5.17.1 | ||||
| A. C-96/35/90 | 3.0x1010 | 106 | -- | -- | ||
| B. After moisture resistance | -- | -- | 3.0x1010 | 104 | ||
| C. At elevated temperature E-24/125 | 5.0x1010 | 103 | 1.0x1010 | 103 | ||
| Surface Resistivity, minimum | MW | 2.5.17.1 | ||||
| A. C-96/35/90 | 3.0x1010 | 104 | -- | -- | ||
| B. After moisture resistance | -- | -- | 3.0x1010 | 104 | ||
| C. At elevated temperature E-24/125 | 4.0x1010 | 103 | 4.0x1010 | 103 | ||
| Moisture Absorption, maximum | -- | -- | 0.12 | 0.8 | % | 2.6.2.1 |
| Dielectric Breakdown, minimum | -- | -- | 60 | 40 | kV | 2.5.6 |
| Permittivity (Dk, 50% resin content) | 5.4 | 5.4 | -- | |||
| (Laminate & Laminated Prepreg) | ||||||
| A. 1MHz | 4.4 | 4.4 | 2.5.5.9 | |||
| B. 1GHz | 4.4 | 4.4 | ||||
| C. 2GHz | 4.2 | 4.3 | 2.5.5.13 | |||
| D. 5GHz | 4.1 | 4.1 | ||||
| E. 10GHz | 4 | 4.1 | ||||
| Loss Tangent (Df, 50% resin content) | 0.035 | 0.035 | -- | |||
| (Laminate & Laminated Prepreg) | ||||||
| A. 1MHz | 0.015 | 0.014 | 2.5.5.9 | |||
| B. 1GHz | 0.015 | 0.015 | ||||
| C. 2GHz | 0.015 | 0.015 | 2.5.5.13 | |||
| D. 5GHz | 0.016 | 0.016 | ||||
| E. 10GHz | 0.017 | 0.016 | ||||
| Flexural Strength, minimum | N/mm2 | 2.4.4 | ||||
| A. Length direction | -- | -- | 500-530 | 415 | (lb/in2) | |
| -- | -- | (72,500-76,850) | -60,190 | |||
| B. Cross direction | -- | -- | 410-440 | 345 | ||
| -- | -- | (59,450-63,800) | -50,140 | |||
| Arc Resistance, minimum | 125 | 60 | 125 | 60 | s | 2.5.1 |
| Thermal Stress 10 s at 288°C [550.4F],minimum | Rating | 2.4.13.1 | ||||
| A. Unetched | Pass | Pass Visual | Pass | Pass Visual | ||
| B. Etched | Pass | Pass Visual | Pass | Pass Visual | ||
| Electric Strength, minimum | 45 | 30 | -- | -- | kV/mm | 2.5.6.2 |
| (Laminate & Laminated Prepreg) | ||||||
| Flammability, | V-0 | V-0 | V-0 | V-0 | Rating | UL94 |
| (Laminate & Laminated Prepreg) | ||||||
| Glass Transition Temperature(DSC) | 175 | 170 minimum | 175 | 170 minimum | ˚C | 2.4.25 |
| Decomposition Temperature | -- | -- | 345 | 340 minimum | ˚C | 2.4.24.6 |
| (5% wt loss) | ||||||
| X/Y Axis CTE (40℃ to 125℃) | -- | -- | 10--13 | -- | PPM/˚C | 2.4.24 |
| Z-Axis CTE | 2.4.24 | |||||
| A. Alpha 1 | -- | -- | 45 | 60 maximum | PPM/˚C | |
| B. Alpha 2 | -- | -- | 210 | 300 maximum | PPM/˚C | |
| C. 50 to 260 Degrees C | -- | -- | 2.7 | 3.0 maximum | % | |
| Thermal Resistance | 2.4.24.1 | |||||
| A. T260 | -- | -- | >60 | 30 minimum | Minutes | |
| B. T288 | -- | -- | >30 | 15 minimum | Minutes | |
| CAF Resistance | -- | -- | Pass | AABUS | Pass/Fail | 2.6.25 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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