2oz Copper F4BM255 PCB Green Solder Mask Immersion Gold Finish

Product Specification

The F4BM255 microwave substrate PCB is a high-performance 3mm thick high-frequency circuit board built for professional microwave and RF signal transmission systems. Featuring 2oz copper thickness, double-sided immersion gold finishing, green solder mask and white silkscreen, this upgraded PCB delivers outstanding electrical stability and consistent high-frequency performance compared with conventional F4B boards. It supports large-scale commercial batch production with excellent cost efficiency, serving as a premium drop-in replacement for imported microwave substrates for communication, radar and satellite applications.

PCB Specifications

F4BM255 Material Introduction

This microwave substrate adopts a premium composite structure composed of high-quality fiberglass cloth, PTFE resin and PTFE film, manufactured through scientific proportioning and strict high-precision pressing processes. Compared with traditional F4B materials, F4BM255 features a wider adjustable dielectric constant range, lower dielectric loss, higher insulation resistance and more stable overall electrical performance. The material formula realizes flexible parameter adjustment by changing the proportion of PTFE resin and fiberglass cloth: higher fiberglass content effectively improves dimensional stability, reduces thermal expansion coefficient and temperature drift, while slightly increasing dielectric loss to achieve balanced comprehensive performance.

F4BM and F4BME share the identical dielectric layer formula, and their performance differences mainly come from matching copper foil types to adapt to different application scenarios. F4BM is paired with ED copper foil, suitable for applications without strict PIM indicators. F4BME adopts reversed RTF copper foil, featuring excellent PIM performance, more precise circuit control and lower conductor loss for high-precision high-frequency scenarios.

F4BM & F4BME Material Difference

F4BM and F4BME feature the same dielectric core structure, with performance differences mainly derived from matched copper foil materials for differentiated application demands:

F4BM Series: Equipped with standard ED copper foil, suitable for general microwave and RF projects without PIM specification restrictions, offering high cost performance for mass commercial deployment.

F4BME Series: Adopts reversed RTF copper foil, delivering excellent PIM performance, finer circuit control accuracy and lower conductor loss, tailored for high-precision RF and low-interference communication systems.

Key Performance Features

Customizable Dielectric Constant: Supports adjustable DK values from 2.17 to 3.0 with full customization, allowing precise parameter matching to fit various RF and microwave circuit operating conditions.

Ultra-Low High-Frequency Loss: Adopts optimized blending formula of PTFE resin and fiberglass cloth to minimize signal attenuation, ensuring clean, stable and high-quality microwave signal transmission.

Excellent PIM Performance (F4BME Version): The upgraded F4BME variant uses reversed RTF copper foil to deliver outstanding PIM indicators, lower conductor loss and more accurate circuit control for high-precision low-interference RF systems.

Superior Dimensional & Thermal Stability: Adjustable fiberglass proportion effectively reduces thermal expansion coefficient and temperature drift, maintaining stable structural accuracy even under fluctuating temperature environments.

Strong Environmental Adaptability: Features reliable radiation resistance and ultra-low outgassing characteristics, suitable for extreme and complex industrial and aerospace working scenarios.

High Cost Performance & Mass Producibility: Available in diversified sizes and supported by mature batch manufacturing processes, delivering stable commercial supply and effectively lowering overall project costs for large-scale high-frequency equipment deployment.

Typical Applications

With low-loss high-frequency performance, stable dielectric parameters and excellent environmental adaptability, F4BM255 microwave PCBs are widely applied in commercial communication, radar detection and satellite microwave systems:

• Microwave devices, RF modules and radar detection systems
• Phase shifters and various passive electronic components
• Power splitters, couplers and combiners
• Feeding networks and phased array antenna systems
• Satellite communication equipment and base station antenna hardware

Conclusion

The F4BM255 microwave substrate PCB stands out as a versatile, high-reliability high-frequency circuit solution for modern RF, microwave, and communication systems. Balancing customizable dielectric parameters, ultra-low signal loss, and exceptional dimensional stability, this 3mm thick, 2oz copper-clad board with immersion gold finishing delivers consistent electrical performance far exceeding standard F4B materials. With optional F4BME upgraded copper foil for superior PIM performance, it accommodates both general commercial projects and high-precision low-interference applications.