Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Base material | Composites of Ceramic Filled PTFE and Woven Fiberglass |
Layer count | Double Sided PCB, Multilayer PCB, Hybrid PCB |
PCB thickness | 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) |
PCB size | ≤400mm X 500mm |
Solder mask | Green, Black, Blue, Yellow, Red etc. |
Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Surface finish | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Brand Name | Bicheng |
Model Number | BIC-181.V1.0 |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Base material | Composites of Ceramic Filled PTFE and Woven Fiberglass | Layer count | Double Sided PCB, Multilayer PCB, Hybrid PCB |
PCB thickness | 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) | PCB size | ≤400mm X 500mm |
Solder mask | Green, Black, Blue, Yellow, Red etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Surface finish | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. | Brand Name | Bicheng |
Model Number | BIC-181.V1.0 | Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA | ||
High Light | 60mil High Frequency PCB ,Taconic High Frequency PCB ,400mmX500mm High Frequency PCB |
RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Taconic's RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass, which have the advantage of high dielectric constant (10.2 10GHz) and low dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.
RF-10 high frequency materials are engineered to provide a cost effective substrates, responding to a need in RF applications for size reduction. It bonds well to smooth low profile copper too. The low dissipation combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.
The benefits of RF-10 laminates. It has excellent adhesion to smooth coppers, high thermal conductivity for enhanced thermal management, high DK for RF circuit size reduction and low 0.0025 loss tangent @ 10 GHz etc.
The RF-10 has a wide range of applications. Includiing aircraft collision avoidance systems, GPS antennas, microstrip patch antennas, passive components (filters, couplers, power dividers) etc.
Our PCB Capability (RF-10)
PCB Material: | Composites of Ceramic Filled PTFE and Woven Fiberglass |
Designation: | RF-10 |
Dielectric constant: | 10.2 |
Dissipation Factor | 0.0025 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
RF-10 Typical Values
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 10.2 ± 0.3 | 10.2 ± 0.3 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0025 | 0.0025 | ||
TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
Flammability Rating | Internal | V-0 | V-0 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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