Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | FR-4 IT-180ATC |
| PCB thickness | 1.63-1.68mm |
| Copper weight | 1oz |
| Surface finish | Immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-507.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | FR-4 IT-180ATC | PCB thickness | 1.63-1.68mm |
| Copper weight | 1oz | Surface finish | Immersion gold |
| Brand Name | Bicheng | Model Number | BIC-507.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Double Sided High Temperature PCB ，Immersion Gold High Temperature PCB ，Automotive High Temperature PCB | ||
High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a standard double-sided high-temperature PCB manufactured on ITEQ's IT-180ATC laminate. The boards are arrayed in a 10-up panel configuration, featuring a 1.6mm thickness and 2oz copper weight. Key finishes include immersion gold on pads and green solder mask protection for the substrate. Units are vacuum-packed in quantities of 25 for secure shipment.
Applications
Automotive (Engine room ECU)
Backplanes
Data Storage
Server and Networking
Telecommunications
PCB Parameters
| Item | Description | Requirement | Actual | Result |
| 1. Laminate | Material Type | FR-4 IT-180ATC | FR-4 IT-180ATC | ACC |
| Tg | 170℃ | 170℃ | ACC | |
| Supplier | ITEQ | ITEQ | ACC | |
| Thickness | 1.6±10% mm | 1.63-1.68mm | ACC | |
| 2.Plating thickness | Hole Wall | ≥25µm | 26.51µm | ACC |
| Outer copper | 35µm | 41.09µm | ACC | |
| Inner Copper | ||||
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D | TAIYO/ PSR-2000GT600D | ACC |
| Color | Green | Green | ACC | |
| Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |
| S/M Thickness | ≥10 µm | 20.11µm | ACC | |
| Location | Both Sides | Both Sides | ACC | |
| 4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC |
| Color | White | White | ACC | |
| Location | C/S | C/S | ACC | |
| 5. Peelable Solder Mask | Material Type | |||
| Thickness | ||||
| Location | ||||
| 6. Identification | UL Mark | YES | YES | ACC |
| Date Code | WWYY | 2121 | ACC | |
| Mark Location | Solder Side | Solder Side | ACC | |
| 7. Surface Finish | Method | Immersion Gold | Immersion Gold | ACC |
| Tin Thickness | ||||
| Nickel Thickness | 3-6µm | 4.06µm | ACC | |
| Gold Thickness | 0.05µm | 0.056µm | ACC | |
| 8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC |
| REACH | Directive 1907 /2006 | OK | ACC | |
| 9.Annular Ring | Min. Line Width (mil) | 5mil | 4.8mil | ACC |
| Min. Spacing (mil) | 5mil | 5.2mil | ACC | |
| 10.V-groove | Angle | 30º | 30º | ACC |
| Residual thickness | 0.4±0.1mm | 0.43mm | ACC | |
| 11. Beveling | Angle | |||
| Height | ||||
| 12. Function | Electrical Test | 100% PASS | 100% PASS | ACC |
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC |
| Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |
| Warp and Twist | ≦0.7% | 0.21% | ACC | |
| 14. Reliability Test | Tape Test | No Peeling | OK | ACC |
| Solvent Test | No Peeling | OK | ACC | |
| Solderability Test | 265 ±5℃ | OK | ACC | |
| Thermal Stress Test | 288 ±5℃ | OK | ACC | |
| Ionic Contamination Test | ≦ 1.56 µg/c㎡ | 0.56µg/c㎡ | ACC |
Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05
| Hole Code | PTH | Required | Actual value | Result | |||
| 1 | Y | 0.400 | 0.400 | 0.425 | 0.425 | 0.400 | ACC |
| 2 | Y | 0.450 | 0.450 | 0.500 | 0.475 | 0.450 | ACC |
| 3 | Y | 0.600 | 0.600 | 0.650 | 0.625 | 0.600 | ACC |
| 4 | Y | 0.725 | 0.750 | 0.775 | 0.775 | 0.750 | ACC |
| 5 | Y | 0.850 | 0.850 | 0.825 | 0.850 | 0.825 | ACC |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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