Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Hydrocarbon Ceramic Laminates |
| Layer count | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| PCB thickness | 4mil (0.102mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm) |
| PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, etc. |
| Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
| Brand Name | Bicheng |
| Model Number | BIC-199.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Hydrocarbon Ceramic Laminates | Layer count | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| PCB thickness | 4mil (0.102mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm) | PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. | Brand Name | Bicheng |
| Model Number | BIC-199.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | RO4835 Rogers RF PCB Board ，RF PCB Board 30mil ，ED Copper Multilayer Microwave PCB Board | ||
Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Rogers RO4835 substrates are hydrocarbon ceramic laminates, a type of antioxidative high frequency materials for applications demanding greater stability at elevated temperatures. It is significantly more resistant to oxidation than other hydrocarbon based materials. RO4835 laminates are designed to offer superior high frequency performance and low cost circuit fabrication. Moreover, RO4835 material provides nearly identical electrical and mechanical properties to RO4350B laminates, which customers have used successfully for many years.
Oxidation affects all thermoset laminate materials over time and temperature. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate.
| Property | RO4835 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | - | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -100℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 108 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 7 x108 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 30.2(755) | Z | Kv/mm(v/mil) | IPC-TM-650 2.5.6.2 | |
| Tensile Modulus | 7780(1128) | Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 136(19.7) | Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 186 (27) | Mpa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 31 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.66 | W/m/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.05 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.92 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Features and Benefits
1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance sensitive, high volume applications.
2. Low loss exhibits excellent electrical performance allowing application with higher operating frequencies, especially ideal for automotive applications.
3. Tight dielectric constant tolerance results in controlled impedance transmission lines
4. Lead-free process compatible results in no blistering or delamination
5. Low Z-axis expansion results in reliable plated through holes
6. Low in-plane expansion coefficient remains stable over an entire range of circuit processing temperatures
7. CAF resistant
Our PCB Capability (RO4835)
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4835 |
| Dielectric constant: | 3.48 (10 GHz) |
| Dissipation Factor | 0.0037 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness (ED copper) | 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| Dielectric thickness (LoPro copper) | 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Typical Applications:
1. Automotive Radar and Sensors
2. Point-to point Microwave
3. Power Amplifiers
4. Phased - Array Radar
5. RF Components
Products Application:
1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense
8, Automotive
9, Smart Home
10, Industrial Automation
11, Medical Devices
12, New Energy
And so on
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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